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X-WR-CALDESC:Events for Czech Semiconductor Centre
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DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260917
DTSTAMP:20260922T115207
CREATED:20260729T123453Z
LAST-MODIFIED:20260729T123453Z
UID:2590-1789344000-1789603199@czechsemiconductorcentre.cz
SUMMARY:ISIG Executive Summit EU 2026
DESCRIPTION:Prague will welcome senior representatives of the global semiconductor industry on 14–16 September 2026. The ISIG Executive Summit EU will bring together decision-makers from the semiconductor\, power electronics and advanced manufacturing sectors to discuss the technologies and strategic choices shaping Europe’s industrial future. \nHeld under the theme “Chips\, Power and Machines: Powering AI and Electrifying Industry”\, the summit will connect international industry leaders\, technology experts\, investors and policymakers with Czechia’s rapidly developing semiconductor ecosystem. \nThe programme will explore some of the most important trends affecting the industry\, including Europe’s future position in the global semiconductor market\, the development of the European Chips Act\, advanced manufacturing\, artificial intelligence\, robotics and the electrification of transport and industry. \nFrom power electronics to intelligent machines\nA major focus of the event will be on the technologies enabling the next generation of electric vehicles and industrial systems. Participants will examine how 800-volt architectures and power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) can improve performance\, energy efficiency\, charging speed and reliability. \nFurther sessions will address the semiconductor requirements of humanoid robots and autonomous systems\, including edge intelligence\, real-time decision-making\, advanced sensing and energy-efficient computing. \nThe agenda will also cover: \n\nadvanced processes\, materials and testing for scalable SiC and GaN production;\nautomation and data-driven optimisation in intelligent semiconductor fabs;\nfunding opportunities for innovative and scalable semiconductor projects;\nthe future of wide-bandgap semiconductor research and development;\nthe impact of artificial intelligence and the emerging Chips Act 2.0 on the power\, automotive and industrial sectors;\nthe capabilities and future development of the Czech semiconductor industry.\n\nInternational speakers and Czech expertise\nThe summit will feature senior representatives of leading global semiconductor companies. Confirmed speakers include Thomas Morgenstern\, Executive Vice President for Manufacturing at STMicroelectronics\, and Magdalena Christine Böbel\, Executive Vice President for Integrated Circuits for Energy Systems and Head of the corresponding business division at Infineon Technologies. \nThe programme will also introduce international participants to Czechia’s semiconductor expertise\, industrial capabilities and potential for deeper integration into European and global value chains. \nAs part of the summit\, delegates will have an opportunity to visit the Hitachi Energy Semiconductors facility in Prague\, providing a first-hand look at semiconductor production and expertise based in Czechia. \nThe event is supported by CzechInvest in cooperation with the Ministry of Foreign Affairs of the Czech Republic. \nEvent details\nEvent: ISIG Executive Summit EU 2026\nDate: 14–16 September 2026\nLocation: Prague\, Czechia\nMain theme: Chips\, Power and Machines: Powering AI and Electrifying Industry\nLanguage: English \nJoin semiconductor executives\, technology leaders\, investors and policymakers in Prague and take part in the discussion about the future of chips\, power electronics\, artificial intelligence and advanced industrial manufacturing in Europe. \nRegister on the official ISIG Executive Summit EU website.
URL:https://czechsemiconductorcentre.cz/event/isig-executive-summit-eu-2026/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/ISIG_banner_1.png
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DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260919
DTSTAMP:20260922T115207
CREATED:20260701T134537Z
LAST-MODIFIED:20260701T134537Z
UID:2508-1789344000-1789775999@czechsemiconductorcentre.cz
SUMMARY:ECCE Europe 2026 in Valencia
DESCRIPTION:ECCE Europe is Europe’s leading conference on power electronics and energy conversion\, bringing together researchers\, industry experts\, and innovators from around the world. It will be taking place from 14 – 18 September 2026 in Valencia\, Spain. \nThe ECCE Europe 2026 conference and exhibition will take place from 14 – 18 September at the Valencia Conference Center in Valencia\, Spain. \nCommencing in 2024\, IEEE PELS is embarking on a dynamic new collaboration with the European Center for Power Electronics (ECPE) for the PELS flagship conference\, now titled IEEE ECCE Europe. United\, IEEE PELS and ECPE are on the brink of unprecedented opportunities in Europe: nurturing innovation\, facilitating the exchange of knowledge\, and catalyzing transformative breakthroughs in the realm of global power electronics. IEEE PELS and ECPE are inviting the Power Electronics community from academia and industry in Europe to follow us in shaping the new ECCE Europe Conference. \nConference Highlights: \n\nCutting-edge Research Presentations\nKeynote Speakers & Industry Experts\nIndustry Sessions\nDiverse Technical Tracks\nWorkshops and Tutorials\nNetworking Opportunities\nStudent Job Fairs
URL:https://czechsemiconductorcentre.cz/event/ecce-europe-2026-in-valencia/
LOCATION:Valencia\, Valencia\, Spain
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x.webp
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
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