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X-ORIGINAL-URL:https://czechsemiconductorcentre.cz
X-WR-CALDESC:Events for Czech Semiconductor Centre
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TZID:Europe/Prague
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260917
DTSTAMP:20260911T092109
CREATED:20260729T123453Z
LAST-MODIFIED:20260729T123453Z
UID:2590-1789344000-1789603199@czechsemiconductorcentre.cz
SUMMARY:ISIG Executive Summit EU 2026
DESCRIPTION:Prague will welcome senior representatives of the global semiconductor industry on 14–16 September 2026. The ISIG Executive Summit EU will bring together decision-makers from the semiconductor\, power electronics and advanced manufacturing sectors to discuss the technologies and strategic choices shaping Europe’s industrial future. \nHeld under the theme “Chips\, Power and Machines: Powering AI and Electrifying Industry”\, the summit will connect international industry leaders\, technology experts\, investors and policymakers with Czechia’s rapidly developing semiconductor ecosystem. \nThe programme will explore some of the most important trends affecting the industry\, including Europe’s future position in the global semiconductor market\, the development of the European Chips Act\, advanced manufacturing\, artificial intelligence\, robotics and the electrification of transport and industry. \nFrom power electronics to intelligent machines\nA major focus of the event will be on the technologies enabling the next generation of electric vehicles and industrial systems. Participants will examine how 800-volt architectures and power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) can improve performance\, energy efficiency\, charging speed and reliability. \nFurther sessions will address the semiconductor requirements of humanoid robots and autonomous systems\, including edge intelligence\, real-time decision-making\, advanced sensing and energy-efficient computing. \nThe agenda will also cover: \n\nadvanced processes\, materials and testing for scalable SiC and GaN production;\nautomation and data-driven optimisation in intelligent semiconductor fabs;\nfunding opportunities for innovative and scalable semiconductor projects;\nthe future of wide-bandgap semiconductor research and development;\nthe impact of artificial intelligence and the emerging Chips Act 2.0 on the power\, automotive and industrial sectors;\nthe capabilities and future development of the Czech semiconductor industry.\n\nInternational speakers and Czech expertise\nThe summit will feature senior representatives of leading global semiconductor companies. Confirmed speakers include Thomas Morgenstern\, Executive Vice President for Manufacturing at STMicroelectronics\, and Magdalena Christine Böbel\, Executive Vice President for Integrated Circuits for Energy Systems and Head of the corresponding business division at Infineon Technologies. \nThe programme will also introduce international participants to Czechia’s semiconductor expertise\, industrial capabilities and potential for deeper integration into European and global value chains. \nAs part of the summit\, delegates will have an opportunity to visit the Hitachi Energy Semiconductors facility in Prague\, providing a first-hand look at semiconductor production and expertise based in Czechia. \nThe event is supported by CzechInvest in cooperation with the Ministry of Foreign Affairs of the Czech Republic. \nEvent details\nEvent: ISIG Executive Summit EU 2026\nDate: 14–16 September 2026\nLocation: Prague\, Czechia\nMain theme: Chips\, Power and Machines: Powering AI and Electrifying Industry\nLanguage: English \nJoin semiconductor executives\, technology leaders\, investors and policymakers in Prague and take part in the discussion about the future of chips\, power electronics\, artificial intelligence and advanced industrial manufacturing in Europe. \nRegister on the official ISIG Executive Summit EU website.
URL:https://czechsemiconductorcentre.cz/event/isig-executive-summit-eu-2026/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/ISIG_banner_1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260919
DTSTAMP:20260911T092109
CREATED:20260701T134537Z
LAST-MODIFIED:20260701T134537Z
UID:2508-1789344000-1789775999@czechsemiconductorcentre.cz
SUMMARY:ECCE Europe 2026 in Valencia
DESCRIPTION:ECCE Europe is Europe’s leading conference on power electronics and energy conversion\, bringing together researchers\, industry experts\, and innovators from around the world. It will be taking place from 14 – 18 September 2026 in Valencia\, Spain. \nThe ECCE Europe 2026 conference and exhibition will take place from 14 – 18 September at the Valencia Conference Center in Valencia\, Spain. \nCommencing in 2024\, IEEE PELS is embarking on a dynamic new collaboration with the European Center for Power Electronics (ECPE) for the PELS flagship conference\, now titled IEEE ECCE Europe. United\, IEEE PELS and ECPE are on the brink of unprecedented opportunities in Europe: nurturing innovation\, facilitating the exchange of knowledge\, and catalyzing transformative breakthroughs in the realm of global power electronics. IEEE PELS and ECPE are inviting the Power Electronics community from academia and industry in Europe to follow us in shaping the new ECCE Europe Conference. \nConference Highlights: \n\nCutting-edge Research Presentations\nKeynote Speakers & Industry Experts\nIndustry Sessions\nDiverse Technical Tracks\nWorkshops and Tutorials\nNetworking Opportunities\nStudent Job Fairs
URL:https://czechsemiconductorcentre.cz/event/ecce-europe-2026-in-valencia/
LOCATION:Valencia\, Valencia\, Spain
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x.webp
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260921
DTEND;VALUE=DATE:20260923
DTSTAMP:20260911T092109
CREATED:20260520T090952Z
LAST-MODIFIED:20260520T090952Z
UID:2356-1789948800-1790121599@czechsemiconductorcentre.cz
SUMMARY:FD-SOI ICs Design Opportunities Short Course
DESCRIPTION:The FAMES Pilot Line informs that pre-registrations is still open for the FD-SOI ICs Design Opportunities Short Course. taking place in: \nDate: 21–22 September 2026\nGrenoble\, France \nThis one-and-a-half-day training\, provided by FD-SOI experts\, will provide a comprehensive overview of FD-SOI technology and advanced design methodologies for digital\, analog\, RF and power management circuits. It is aimed for engineers\, researchers and technologists interested in leveraging FD-SOI for next-generation integrated circuits. \nThe program also includes technical tutorials\, networking opportunities and an immersive clean-room visit at CEA-Leti. \nConsult the full program and pre-register here: https://fames-pilot-line.eu/fd-soi-ics-design-opportunities-short-course/. \n⚠️This is a paid event with limited capacity.
URL:https://czechsemiconductorcentre.cz/event/fd-soi-ics-design-opportunities-short-course/
LOCATION:Grenoble\, Grenoble\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/FD-SOI_ics_Grenoble.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260925
DTEND;VALUE=DATE:20260926
DTSTAMP:20260911T092109
CREATED:20260806T072731Z
LAST-MODIFIED:20260806T072731Z
UID:2640-1790294400-1790380799@czechsemiconductorcentre.cz
SUMMARY:ChipQuest Challenge 2026
DESCRIPTION:Can you explain how semiconductors shape our everyday lives in a way that inspires the next generation? \nThe ChipQuest Challenge invites students from primary school through to PhD level to create an engaging two-to-five-minute video introducing the fascinating world of semiconductors to school pupils. \nUse experiments\, animations\, drawings\, demonstrations or creative storytelling to make complex technology easy to understand. Show where chips can be found\, explain why they matter and share the ideas that could spark a young person’s interest in science and engineering. \nWhat could you win?\nSuccessful participants can receive: \n\na technology product of their choice worth up to €1\,000;\nan exclusive behind-the-scenes tour of a semiconductor company;\na one-to-one mentoring session with an industry expert;\na four-day ticket to SEMICON Europa 2026.\n\nWhether you are taking your first steps in science or already conducting advanced research\, this is your opportunity to demonstrate your creativity\, communication skills and passion for technology. \nSubmit your video by 25 September 2026 and help inspire the semiconductor innovators of tomorrow. \nReady to take on the challenge?\nDiscover the competition details and submit your entry on the ChipQuest website.
URL:https://czechsemiconductorcentre.cz/event/chipquest-challenge-2026/
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/08/Snimek-obrazovky-2026-08-06-092605.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260930
DTEND;VALUE=DATE:20261002
DTSTAMP:20260911T092109
CREATED:20260619T081449Z
LAST-MODIFIED:20260619T081659Z
UID:2482-1790726400-1790899199@czechsemiconductorcentre.cz
SUMMARY:FIRST by FMD
DESCRIPTION:FIRST – Fast Innovation through Research in Semiconductor Technologies\nThe European conference on microelectronic trends\, roadmaps and strategic alignment \n\n  \n\nFIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience\, technological sovereignty\, security\, and sustainable growth. With initiatives such as the EU Chips Act and Germany’s Hightech Agenda\, the strategic importance of European microelectronics is greater than ever. \nFIRST – Fast Innovation through Research in Semiconductor Technologies – brings together decision-makers from industry\, policy and research. With a clearly curated program\, FIRST provides strategic insights into emerging technologies\, industrial roadmaps and future infrastructure developments. \nAt FIRST\, leaders from across the semiconductor value chain engage with representatives from key application sectors including AI\, automotive\, healthcare\, industrial manufacturing\, telecommunications and energy. For those driving innovation\, product strategies or technology roadmaps\, this is where Europe’s semiconductor future becomes business reality. \nProgram highlights at FIRST 2026\n\nGain early insights into emerging technology and market trends\nUnlock strategic partnerships across the full value chain\nStrengthen your innovation-to-market capabilities\nExpand your network with Europe’s key semiconductor decision-makers\n\nA further strategic focus is the APECS pilot line\, implemented by the Research Fab Microelectronics Germany (FMD). It provides an industry-oriented environment for advanced packaging and design as key enabling technologies for chiplet architectures and heterogeneous integration\, strengthening innovation across the European value chain.
URL:https://czechsemiconductorcentre.cz/event/first-by-fmd/
LOCATION:Berlin\, Berlin\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Eventankuendigung-FHG-web.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261001
DTEND;VALUE=DATE:20261003
DTSTAMP:20260911T092109
CREATED:20260902T090530Z
LAST-MODIFIED:20260902T090600Z
UID:2667-1790812800-1790985599@czechsemiconductorcentre.cz
SUMMARY:Micro & Nano Event 2026
DESCRIPTION:Are you active in the fields of micro- and nanotechnology\, advanced materials\, or precision engineering\, and looking for new business or technology partners? Join the international matchmaking event Micro & Nano Event 2026\, which will take place on October 1–2 in Besançon\, France.\nMicro & Nano Event 2026 will bring together European small and medium-sized enterprises\, startups\, clusters\, associations\, and research organizations active in the fields of micro- and nanotechnology and other high-tech sectors. The event will take place as part of the Micronora international trade fair\, which focuses on microtechnology\, precision engineering\, and nanotechnology. \nThe main component of the program will be pre-arranged B2B meetings\, which will allow participants to actively seek out new business and technology partners\, suppliers\, or partners for research collaboration. Companies will also have the opportunity to showcase their technologies\, expertise\, and services to international participants. \nPresent your company during the pitch session\nCzech startups and innovative small and medium-sized enterprises can also actively sign up to give their own pitch and present their products\, technologies\, or innovative solutions to an international audience during the event. The pitch session will take place on October 2 and will offer another opportunity to raise the company’s profile and establish contacts with potential international partners. \nRegistration for your own pitch takes place via the Micro & Nano Event 2026 platform. \nWho is this event intended for?\n\nsmall and medium-sized enterprises (SMEs)\,\nstartups\,\nclusters and associations\,\nresearch organizations\, laboratories\, and technology centers.\n\nIt is suitable for organizations that want to showcase their offerings\, technologies\, expertise\, and services\, as well as for those seeking new technologies\, suppliers\, experts\, or partners for business\, technological\, or research collaboration. \nWhat areas does the event focus on?\nThe main technological topics include: \n\nmicro- and nanosystems —intelligent systems\, sensors\, actuators\, and motors; micro- and nanocomponents; and embedded and interconnected systems\,\nmaterials and surface treatments – new and lightweight materials\, surface treatments\, smart\, flexible\, conductive\, or biocompatible materials\,\nmanufacturing technologies and processes – micro- and nanomanufacturing\, micromechatronics\, microelectronics\, 3D printing and additive manufacturing\, micro- and nanorobotics\, assembly or laser technologies\,\ndigitization – artificial intelligence\, computer vision\, non-destructive testing and inspection\, software and algorithms\, virtual and augmented reality\, and the Internet of Things\,\nElectronics and Optics.\n\nThe Enterprise Europe Network will be available to you on-site\nAn Enterprise Europe Network consultant from the Czech Republic will also be attending the event\, and Czech companies can approach him directly during the event. He will help them\, for example\, navigate the matchmaking process\, find relevant international partners\, or explore opportunities for further international collaboration. \nAmong other things\, the Enterprise Europe Network helps companies find business and research partners and organizes brokerage and matchmaking events aimed at fostering cross-border partnerships. \nEnterprise Europe Network Program\nOctober 1\, 2026\n\nin-person B2B meetings\,\nnetworking event.\n\nOctober 2\, 2026\n\na pitch session for startups and innovative companies with the option to actively register\,\ninformation on European instruments to support innovation\,\na discussion on technological calls\,\nIn-person B2B meetings.\n\nPractical Information\nWhere: Parc des Expositions de Besançon\, Besançon\, France\nTicket price: 100 EUR (for clients with discount code: EEN-CLIENT-MNE 2026)\n– includes admission to the Micronora trade show; Enterprise Europe Network matchmaking at the trade fair is free of charge. \nOn the event platform\, you can view the list of registered participants in advance and select the organizations you’d like to meet during the matchmaking sessions. \nProposed Route\n\nflight from Prague to Paris-Orly\,\nsubway / transfer from Orly Airport → Gare de Lyon\,\nTGV train from Gare de Lyon → Besançon (about 2 hours).\n\nSource: https://een.gov.cz/en/kalendar-akci/micro-nano-event-2026/ \nRegistration here: https://www.b2match.com/e/micro-nano-event-2026/sign-up/create-account
URL:https://czechsemiconductorcentre.cz/event/micro-nano-event-2026/
LOCATION:Besançon\, Besançon\, France
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/09/Snimek-obrazovky-2026-09-02-110312.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261007
DTEND;VALUE=DATE:20261010
DTSTAMP:20260911T092109
CREATED:20260409T065725Z
LAST-MODIFIED:20260409T065928Z
UID:2196-1791331200-1791590399@czechsemiconductorcentre.cz
SUMMARY:ASDAM (Advanced Semiconductor Devices and Microsystems)
DESCRIPTION:𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝙞𝙨 𝙘𝙤𝙢𝙞𝙣𝙜 𝙩𝙤 𝘽𝙧𝙖𝙩𝙞𝙨𝙡𝙖𝙫𝙖.\nThe 𝟭𝟲𝘁𝗵 𝗜𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 on 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗮𝗻𝗱 𝗠𝗶𝗰𝗿𝗼𝘀𝘆𝘀𝘁𝗲𝗺𝘀 will take place on 𝟳–𝟵 𝗢𝗰𝘁𝗼𝗯𝗲𝗿 𝟮𝟬𝟮𝟲 𝗮𝘁 𝘁𝗵𝗲 𝗥𝗮𝗱𝗶𝘀𝘀𝗼𝗻 𝗕𝗹𝘂 𝗖𝗮𝗿𝗹𝘁𝗼𝗻 𝗛𝗼𝘁𝗲𝗹 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮\, 𝗦𝗹𝗼𝘃𝗮𝗸𝗶𝗮. \nThe conference is 𝗳𝗼𝗰𝘂𝘀𝗲𝗱 𝗼𝗻 the latest research and development in semiconductor devices\, microsystems\, materials\, and related technologies. Its scope includes topics such as WBG and UWBG materials\, semiconductor structures and devices\, characterization and modelling\, sensors and microsystems\, photonics\, IC design\, packaging technologies\, and AI in electronics. \n𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝘄𝗶𝗹𝗹 𝗯𝗿𝗶𝗻𝗴 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 researchers\, scientists\, university experts\, doctoral candidates\, and industry 𝗽𝗿𝗼𝗳𝗲𝘀𝘀𝗶𝗼𝗻𝗮𝗹𝘀 𝗳𝗿𝗼𝗺 𝗮𝗹𝗹 𝗼𝘃𝗲𝗿 𝘁𝗵𝗲 𝘄𝗼𝗿𝗹𝗱. Giving participants an opportunity 𝘁𝗼 𝗽𝗿𝗲𝘀𝗲𝗻𝘁 𝘁𝗵𝗲𝗶𝗿 𝘄𝗼𝗿𝗸 𝘄𝗶𝘁𝗵𝗶𝗻 𝗮 𝗿𝗲𝘀𝗽𝗲𝗰𝘁𝗲𝗱 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗳𝗼𝗿𝘂𝗺. Its 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝘀𝗰𝗶𝗲𝗻𝘁𝗶𝗳𝗶𝗰 𝗰𝗼𝗺𝗺𝗶𝘁𝘁𝗲𝗲 includes 𝗲𝘅𝗽𝗲𝗿𝘁𝘀 from leading institutions in multiple countries\, and the proceedings will be published by the 𝗜𝗘𝗘𝗘 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗦𝗼𝗰𝗶𝗲𝘁𝘆. \n𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀 𝗶𝘀 𝗻𝗼𝘄 𝗼𝗽𝗲𝗻. 𝗬𝗼𝘂 𝗰𝗮𝗻 𝗳𝗶𝗻𝗱 𝗮𝗹𝗹 𝘁𝗵𝗲 𝗶𝗻𝗳𝗼𝗿𝗺𝗮𝘁𝗶𝗼𝗻 𝗼𝗻 𝗔𝗦𝗗𝗔𝗠 𝘄𝗲𝗯𝗽𝗮𝗴𝗲: 𝘄𝘄𝘄.𝗮𝘀𝗱𝗮𝗺.𝘀𝗸 \n𝗔𝗯𝘀𝘁𝗿𝗮𝗰𝘁 𝘀𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝘀𝘁𝗮𝗿𝘁𝗲𝗱 𝗼𝗻 𝟭 𝗔𝗽𝗿𝗶𝗹 𝟮𝟬𝟮𝟲\, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝗱𝗲𝗮𝗱𝗹𝗶𝗻𝗲 𝗳𝗼𝗿 𝗮𝗯𝘀𝘁𝗿𝗮𝗰𝘁𝘀 𝗶𝘀 𝟭 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲. \n𝗪𝗲 𝗶𝗻𝘃𝗶𝘁𝗲 researchers\, scientists\, doctoral candidates\, and experts from academia working in semiconductor devices\, microsystems\, materials\, photonics\, sensors\, modelling\, packaging\, IC design\, and related fields to submit their abstracts and become part of ASDAM 2026. \n𝗝𝗼𝗶𝗻 𝘂𝘀 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮 𝗮𝗻𝗱 𝘀𝗵𝗮𝗿𝗲 𝘆𝗼𝘂𝗿 𝗿𝗲𝘀𝗲𝗮𝗿𝗰𝗵 with an international community shaping the future of semiconductors and microsystems.
URL:https://czechsemiconductorcentre.cz/event/asdam-advanced-semiconductor-devices-and-microsystems/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/04/1775634398872.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261021
DTEND;VALUE=DATE:20261023
DTSTAMP:20260911T092109
CREATED:20260720T064502Z
LAST-MODIFIED:20260720T064502Z
UID:2579-1792540800-1792713599@czechsemiconductorcentre.cz
SUMMARY:Engaged Investments
DESCRIPTION:Start-up founders and investors are invited to attend Engaged Investments 2026\, an exclusive venture capital conference bringing together active investors and ambitious founders from Central and Eastern Europe and the Baltic region. \nTaking place at the National House in Prague on 21–22 October 2026\, the conference is expected to welcome up to 500 participants\, including approximately 250 venture investors\, 150 start-up founders and more than 40 speakers. The event is organised by active investors DEPO Ventures and J&T Ventures\, with a strong focus on meaningful connections\, cross-border investment and new business opportunities. \nThe conference is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking investment and commercial partnerships within the CEE ecosystem. Its panel discussions will explore technology trends including AI infrastructure\, defence and space – sectors that increasingly depend on advanced computing\, specialised chips\, sensors and other semiconductor technologies. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, business angels and other active investors;\narrange one-to-one meetings through the conference networking platform;\nexplore cross-border investment and technology transfer opportunities;\nconnect with founders\, industry representatives and ecosystem organisations;\nattend expert panel discussions and practical workshops;\npresent their businesses to international investors through the Engaged Top Startup Selection.\n\nTwo days of venture investment and start-up opportunities\nThe first day is primarily designed for investors and will address topics such as capital formation\, exit strategies\, cross-border collaboration and emerging technology trends. \nThe second day will focus on founders and the Engaged Top Startup Selection. Up to 50 promising CEE start-ups will be selected across four funding stages: angel\, pre-seed\, seed and Series A. Each category will be evaluated by an investor jury\, giving selected companies an opportunity to pitch live and pursue direct funding discussions with international investors. \nThe programme will also include structured networking\, pre-arranged one-to-one meetings\, workshops and partner side events. Start-ups applying for the Top Startup Selection must purchase a founder ticket and be selected by the organisers to receive a pitching opportunity. \nEngaged Investments 2026\n21–22 October 2026\nNational House\, Prague\, Czech Republic \nLearn more\, purchase a ticket and apply for the Top Startup Selection
URL:https://czechsemiconductorcentre.cz/event/engaged-investments/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/z.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260911T092109
CREATED:20260204T094221Z
LAST-MODIFIED:20260204T094319Z
UID:1980-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:IMAPS Flash Conference 2026
DESCRIPTION:The IMAPS Flash Conference 2026 invites researchers\, engineers\, and industry professionals to meet in the heart of Moravia for two days of intensive scientific exchange and discussion. Organised by the Czech and Slovak Chapter of IMAPS (IMAPS CZ&SK) in partnership with Tomas Bata University in Zlín\, the conference will take place on 22–23 October 2026 at the Faculty of Applied Informatics\, Tomas Bata University in Zlín. \nIMAPS Flash Conference is a well-established European forum connecting senior and early-career scientists from academia and the electronics industry. The event focuses on sharing experimental and theoretical advances across the broad fields of electronics\, microelectronic technologies\, and electronic packaging. \nFlash Poster Session and Thematic Focus\nBuilding on the success of previous editions\, the 2026 conference will once again feature a flash poster session\, designed to stimulate open discussion\, rapid idea exchange\, and interdisciplinary interaction. \nA special thematic focus for this year will be “Comprehensive Semiconductor Analysis”\, reflecting the growing importance of integrated\, cross-disciplinary approaches in contemporary semiconductor research\, development\, and characterisation. \nTopics of Interest\nThe technical programme will cover a wide range of topics\, including: \n\n\nElectronic Assembly\, Packaging and Advanced Integration \n\n\nJoining\, Interconnection and Interface Technologies \n\n\nMaterials and Functional Structures for Microelectronics \n\n\nSimulation\, Modelling and Digital Design Tools \n\n\nReliability\, Testing and Characterisation \n\n\nSensors\, Microsystems\, Embedded and Control Systems \n\n\nQuantum\, Photonics and Future Semiconductor Technologies \n\n\nThis broad scope makes the conference highly relevant for both academic researchers and industrial practitioners working on current and emerging semiconductor technologies. \nKey Information\n\n\nDate: 22–23 October 2026 \n\n\nVenue: Tomas Bata University in Zlín\, Faculty of Applied Informatics \n\n\nConference Chair: doc. Ing. Milan Navrátil\, Ph.D. \n\n\nAbstract submission deadline: 1 June 2026 \n\n\nJoin the IMAPS Community in Zlín\nIMAPS Flash Conference 2026 offers a unique opportunity to present your work\, gain feedback from international experts\, and build new professional connections within the European microelectronics and semiconductor community. \nFor detailed information on registration\, submission guidelines\, and programme updates\, please visit:👉 https://cz.imapseurope.org/imaps-flash-conference-2026/👉 https://imaps.isibrno.cz/
URL:https://czechsemiconductorcentre.cz/event/imaps-flash-conference-2026/
LOCATION:Zlín\, Zlín\, Czech Republic
CATEGORIES:External Event
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DTSTART;VALUE=DATE:20261023
DTEND;VALUE=DATE:20261024
DTSTAMP:20260911T092109
CREATED:20260716T095647Z
LAST-MODIFIED:20260716T095909Z
UID:2566-1792713600-1792799999@czechsemiconductorcentre.cz
SUMMARY:HM Fellowship Programme 2027/2028
DESCRIPTION:Researchers and academics with a strong track record in international teaching are invited to apply for the HM Fellowship Programme 2027/2028\, organised by Hochschule München University of Applied Sciences (HM). The programme offers an excellent opportunity to spend a semester in Munich while contributing to innovative teaching\, developing new international learning formats\, and strengthening academic collaboration across Europe. \nEstablished in 2007\, the HM Fellowship Programme has already welcomed more than 65 international fellows. For the 2027/2028 academic year\, up to three fellowships will be awarded to outstanding candidates from a wide range of disciplines. \nSuccessful applicants will: \n\nteach in English during either the Summer Semester 2027 (15 March – end of July 2027) or the Winter Semester 2027/2028 (1 October 2027 – mid-February 2028)\,\ncontribute to the development of innovative international teaching projects alongside HM academic staff\,\nhelp advance Hochschule München’s strategy of “internationalisation at home” through new teaching methods\, joint programmes and collaborative educational initiatives.\n\nFellowship support\nThe fellowship provides comprehensive financial support\, including: \n\nTeaching allowance of up to €9\,000\,\nAcademic project grant of €3\,000\,\nTravel and accommodation reimbursement of up to €6\,000\,\nadditional organisational support from HM’s International Office\, including assistance with accommodation and visa arrangements.\n\nWho can apply?\nApplicants should: \n\nhold a doctoral degree (PhD)\,\ndemonstrate an excellent academic record\,\nhave substantial experience in international teaching\,\npreferably come from an HM partner institution\, although applicants from other institutions with strong collaboration potential are also encouraged to apply.\n\nApplication deadline\nApplications must be submitted by 23 October 2026. The results of the selection process will be announced in early December 2026. \nFor further information about the fellowship and application process\, please contact the HM International Office – Staff Mobility Team at staff-mobility-io@hm.edu \nAll details available here:Call for Application
URL:https://czechsemiconductorcentre.cz/event/hm-fellowship-programme-2027-2028/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261026
DTEND;VALUE=DATE:20261028
DTSTAMP:20260911T092109
CREATED:20260720T064156Z
LAST-MODIFIED:20260720T064156Z
UID:2576-1792972800-1793145599@czechsemiconductorcentre.cz
SUMMARY:Deep Tech Summit
DESCRIPTION:Start-ups\, investors\, researchers and industry representatives are invited to attend Deep Tech Summit 2026\, a major Central and Eastern European event connecting technology innovators with investment\, business and partnership opportunities. \nTaking place in Warsaw on 26–27 October 2026\, the summit is expected to welcome more than 1\,000 participants from over 30 countries\, including over 250 start-ups and scale-ups\, 150 investors and business angels\, as well as corporate executives\, researchers\, engineers and representatives of the innovation ecosystem. \nThe event is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking new investors\, industrial partners and connections across the CEE region. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, corporate investors and business angels;\ntake part in dedicated matchmaking and one-to-one meetings;\npresent technologies and business propositions to potential partners;\nexplore financing and international growth opportunities;\nconnect with start-up founders\, industry executives\, researchers and innovation organisations;\ngain insights into emerging deep-tech trends and technology commercialisation.\n\nTwo days of investment\, innovation and networking\nThe first day\, Investment Day on 26 October\, will focus on matchmaking\, investor discussions\, VC Central and networking events. Participants will be able to meet selected technology projects and connect with investors\, corporations and potential business partners. \nThe CEE Summit on 27 October will feature the Business on Tech and Science to Business stages\, expert discussions\, keynote presentations\, workshops\, pitching competitions and further matchmaking opportunities. Side events will take place throughout both days. \nDeep Tech Summit provides semiconductor and hardware innovators with an opportunity to enter the wider CEE investment ecosystem\, strengthen their international visibility and establish relationships that can support funding\, commercialisation and expansion into new markets. \nDeep Tech Summit 2026\n26–27 October 2026\nWarsaw\, Poland \nLearn more and register on the official Deep Tech Summit website
URL:https://czechsemiconductorcentre.cz/event/deep-tech-summit/
LOCATION:Warsaw\, Poland\, Warsaw\, Poland
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261101
DTEND;VALUE=DATE:20261105
DTSTAMP:20260911T092109
CREATED:20260625T071252Z
LAST-MODIFIED:20260625T071258Z
UID:2491-1793491200-1793836799@czechsemiconductorcentre.cz
SUMMARY:International Trade Partners Conference - ITPC 2026
DESCRIPTION:For more than 40 years\, the SEMI International Trade Partners Conference—ITPC has served as our premium networking and knowledge-sharing event for C-suite executives in the global semiconductor and microelectronics design and manufacturing supply chain. \nMulti‑Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\nThe global semiconductor industry is entering a defining era; one in which chips are no longer simply components inside devices\, but the foundation of the world’s digital economy\, AI infrastructure\, advanced manufacturing\, mobility\, communications\, energy systems\, healthcare innovation\, and national security. \nAs industry revenues accelerate toward multi-trillion-dollar scale\, the next phase of growth will not happen by chance. It must be designed through strategic investment\, resilient supply chains\, trusted global partnerships\, and coordinated innovation across the full electronics ecosystem. \nAnchored by the 2026 theme\, Multi-Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\, ITPC will convene senior executives and decision-makers from across the semiconductor design and manufacturing supply chain to examine how the industry can shape this future with intention—balancing rapid AI-driven demand\, geopolitical complexity\, sustainability pressures\, workforce needs\, and the technology breakthroughs required to power the next decade of global progress. \nSessions\n\nKeynotes\nFuture Trends\nMarkets & Applications\nTechnology\nTrade & Politics\n\nJoin the Following Speakers at ITPC 2026\n\nASML\nRapidus\nIntel\nSkyWater\nAnd More!\n\nDon’t Miss Out!\nITPC offers intimate and exclusive access to visionaries on the front line. Mark your calendars now and plan on joining industry leaders at ITPC to contribute your perspective\, catch up with colleagues\, and forge new connections. \nThank You\nA sincere appreciation to the executives serving on the ITPC Global Committee. We thank the committee for their time and expertise in developing the ITPC program. \nITPC History\nThe SEMI International Trade Partners Conference—ITPC has championed industry coordination for over four decades. The event was originally designed to support collaboration and productive trans-pacific relationship amidst severe trade tensions that threatened supply chain prosperity in the 1980s. Having successfully contributed to a spirit of cooperation and mutual business interest\, the event continues to promote alignment in the era of globalization. It has developed into a premier executive thought-leadership and relationship-building event to support global industry executive-level engagement.
URL:https://czechsemiconductorcentre.cz/event/international-trade-partners-conference-itpc-2025/
LOCATION:Hawai\, HI\, United States
CATEGORIES:External Event
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DTSTART;VALUE=DATE:20261110
DTEND;VALUE=DATE:20261114
DTSTAMP:20260911T092109
CREATED:20260720T065200Z
LAST-MODIFIED:20260720T065200Z
UID:2582-1794268800-1794614399@czechsemiconductorcentre.cz
SUMMARY:SEMICON Europa 2026
DESCRIPTION:Join Europe’s Semiconductor Industry at SEMICON Europa 2026\n10–13 November 2026 | Messe München\, Munich\, Germany \nCompanies\, start-ups\, researchers\, investors and industry professionals are invited to attend SEMICON Europa 2026\, Europe’s leading event for the semiconductor manufacturing and design ecosystem. \nTaking place at Messe München from 10 to 13 November 2026 and co-located with electronica\, the event will bring together stakeholders from across the semiconductor value chain – from materials\, equipment and chip design to manufacturing\, advanced packaging\, applications and system integration. \nUnder the theme “Europe’s Next Era: Navigating the Perfect Storm”\, the 2026 edition will explore how Europe can build a more competitive\, resilient and sustainable semiconductor ecosystem amid technological transformation and a rapidly changing geopolitical environment. Discussions will address technological sovereignty\, innovation\, international cooperation and the long-term strength of Europe’s semiconductor industry. \nWhy attend SEMICON Europa?\nParticipants will have the opportunity to: \n\nmeet semiconductor manufacturers\, equipment and materials suppliers\, technology companies and system integrators;\ndiscover emerging technologies and developments across the semiconductor value chain;\nattend expert conferences\, presentations and industry discussions;\nconnect with potential customers\, suppliers\, research partners and investors;\nexplore opportunities in chip design\, manufacturing\, advanced packaging\, MEMS\, imaging sensors and smart manufacturing;\nengage with the wider European and international semiconductor ecosystem.\n\nThe programme is expected to include specialist conferences and initiatives covering areas such as advanced packaging\, fab management\, MEMS and imaging sensors\, smart manufacturing\, executive-level industry dialogue and start-up innovation. \nChips Venture Forum at SEMICON Europa\nSEMICON Europa 2026 will also provide the setting for the final event of the Chips Venture Forum\, an initiative connecting promising semiconductor innovators with investors\, corporate partners and European institutions. \nThe final event is intended for selected semiconductor-related start-ups established or legally registered in a country hosting an operational Competence Centre within the European network\, as well as beneficiaries of the European Innovation Council. \nOrganised within the aCCCess project by Blumorpho in collaboration with DG CONNECT and the European Innovation Council\, the Chips Venture Forum supports the development\, financing and industrial adoption of European semiconductor technologies. It connects start-ups and scale-ups with venture capital and private equity funds\, industrial companies\, OEMs\, Competence Centres and institutional stakeholders. \nSelected start-ups will gain access to a broader ecosystem that may include: \n\nrepresentatives of the European Commission and the European Innovation Council;\nsemiconductor-focused investors and venture capital funds;\ncorporate partners and potential customers;\nsemiconductor equipment and technology providers;\nOEMs\, system integrators and industrial end-users;\nEuropean Chips Competence Centres\, Pilot Lines and the European Design Platform.\n\nThe forum offers semiconductor innovators an opportunity to present their solutions\, hold qualified discussions with investors and industrial partners\, increase their visibility and explore funding and commercialisation opportunities. \nFurther information about the Munich programme and the participation of selected start-ups is expected to be published by the organisers. \nSEMICON Europa 2026\n10–13 November 2026\nMesse München\nMunich\, Germany \nLearn more about SEMICON Europa 2026 \nLearn more about the Chips Venture Forum
URL:https://czechsemiconductorcentre.cz/event/semicon-europa-2026/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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