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X-WR-CALDESC:Events for Czech Semiconductor Centre
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260817
DTEND;VALUE=DATE:20260822
DTSTAMP:20260728T072355
CREATED:20260507T064136Z
LAST-MODIFIED:20260507T064136Z
UID:2258-1786924800-1787356799@czechsemiconductorcentre.cz
SUMMARY:CEITEC Student Talent Summer School 2026
DESCRIPTION:Applying for CEITEC Student Talent Summer School 2026\n\nThe summer school is aimed at high school students in the third grade\, but any high school student can apply.\nAs we are limited by the size of the labs and the number of students/mentor\, participants are selected based on cover letters that they supply as part of the application process.\nWe consider the reasons why the student would like to attend the Summer School\, why they chose the topic\, how participation could help them in their future studies\, etc. Cover letters are evaluated directly by the mentors of the research projects.\nApplications are open until 30 June 2026.\n\n  \nInterested in applying?\n\nChoose the topic that you want to pursue – you should always apply for a specific research project.\nApply by email to Marcela.Frybortova@ceitec.vutbr.cz – the email must state your chosen research project as well as a short cover letter in which you outline why you chose the topic\, what made you interested in it\, and why it could benefit you personally.\nPut “Summer School 2026” in the subject line.\nApply by 30 June 2026\, when the application period closes.\nIf you are selected\, we will contact you at the very end of June with instructions on how to make your registration binding via our website. The binding registration will entail paying a registration fee of 500 CZK.\nWe will provide food and board for participants throughout the duration of the programme at a nearby dormitory (7-minute walk).\n\n  \nProgramme:\nDay 1 (Monday\, August 17\, 2026)\n\n 8:00 – 9:00 | Participant Registration\n 9:00 – 10:00 | Official Opening\n10:00 – 11:00 | Orientation Walk Around the CEITEC BUT Campus\n11:00 – 13:00 | Check-in at the Dormitory\n13:00 – 17:00 | Lab Work\n17:00 – 18:00 | Meeting with an Alumnus\n18:00 – 21:00 | BBQ and Improvised Networking (CEITEC BUT Courtyard)\n\n  \nDay 2 (Tuesday\, August 18\, 2026)\n\n 9:00 – 13:00 | Lab Work\n14:00 – 17:00 | Programme in Brno City Centre\n17:00 – 18:00 | Hands-On Science with Stanislav Průša\, Summer School Expert Guarantor\n18:00 – 20:00 | Pub Quiz\n\n  \nDay 3 (Wednesday\, August 19\, 2026)\n\n 9:00 – 13:00 | Lab Work\n14:00 – 16:00 | Field Trip to Thermo Fisher Scientific\n17:00 – 19:00 | Lab Work\n19:00 – 21:00 | Movie Night\n\n  \nDay 4 (Thursday\, August 20\, 2026)\n\n9:00 – 12:00 | Laboratory Program (Group Rotation and Opportunity to Try a Different Research Project)\n13:00 – 15:00 | Expert Lecture\n15:00 – 19:00 | Project Presentation Preparation\n\n  \nDay 5 (Friday\, August 21\, 2026)\n\n9:00 – 12:00 | Project Presentations and Official Closing
URL:https://czechsemiconductorcentre.cz/event/ceitec-student-talent-summer-school-2026/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:Organized by CSC
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1777463370180.jpg
ORGANIZER;CN="CEITEC BUT":MAILTO:Marcela.Frybortova@ceitec.vutbr.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260821
DTEND;VALUE=DATE:20260823
DTSTAMP:20260728T072355
CREATED:20260720T063814Z
LAST-MODIFIED:20260720T063814Z
UID:2572-1787270400-1787443199@czechsemiconductorcentre.cz
SUMMARY:Chips Venture Forum Selection at INPHO Venture Summit
DESCRIPTION:Semiconductor start-ups are invited to apply for the Chips Venture Forum Selection\, taking place in Bordeaux on 21–22 October 2026. The event will connect promising European innovators with investors\, corporate partners\, semiconductor end-users and representatives of key European institutions. \nThe opportunity is open to semiconductor-related start-ups that are established or legally registered in a country hosting an operational Competence Centre within the European network\, as well as to beneficiaries of the European Innovation Council. \nWhy apply?\nSelected start-ups will have the opportunity to: \n\npresent their technologies and business propositions to leading venture capital funds and corporate partners;\ntake part in qualified meetings with investors and potential industrial partners;\nincrease their visibility within the European semiconductor ecosystem;\nengage with representatives of the Chips Competence Centres\, Pilot Lines\, the European Design Platform\, the European Innovation Council and the European Commission;\nexplore investment\, commercialisation and scaling opportunities.\n\nThe Chips Venture Forum is organised by Blumorpho within the aCCCess project\, in collaboration with DG CONNECT and the European Innovation Council. Its objective is to accelerate the development\, financing and industrial adoption of semiconductor technologies while strengthening Europe’s semiconductor ecosystem. \nContinue the conversation at the INPHO Venture Summit\nSelected companies will also have the opportunity to participate in the INPHO Venture Summit on 22–23 October 2026 at the Palais de la Bourse in Bordeaux. \nThe invitation-only summit brings together deep-tech investors\, venture capital funds\, large corporations and selected start-ups. It offers participating companies a valuable opportunity to continue discussions with investors while meeting semiconductor end-users and other key industry stakeholders. \nChips Venture Forum Selection\n21–22 October 2026\nBordeaux\, France \nINPHO Venture Summit\n22–23 October 2026\nPalais de la Bourse\, Bordeaux\, France \nLearn more and apply through the Chips Venture Forum website \nDiscover the INPHO Venture Summit
URL:https://czechsemiconductorcentre.cz/event/chips-venture-forum-selection-at-inpho-venture-summit/
LOCATION:Bordeaux\, Bordeaux \, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x-1.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260823
DTEND;VALUE=DATE:20260829
DTSTAMP:20260728T072355
CREATED:20260223T083900Z
LAST-MODIFIED:20260223T083900Z
UID:2064-1787443200-1787961599@czechsemiconductorcentre.cz
SUMMARY:ECS Summer School 2026 - Application deadline 29 March
DESCRIPTION:WHEN: August 23th – August 28th\, 2026 \nWHERE: University Residential Centre\, University of Bologna\, Bertinoro\, Italy \nThe program will cover four main topics: \n\nSemiconductor technology\nIntegrated Circuits design\nDigital systems and Embedded Intelligence\nIntegration\n\nTalks will be delivered by representatives from leading universities\, research institutes and companies. Career testimonies by young engineers will complete the week. \nEligibility criteria: This Summer School is dedicated to undergraduate students who\, by the time of the summer school\, will have completed at least two years of university study and will have at least one year to go before completing their undergraduate studies. Students from all fields of STEM (Science\, Technology\, Engineering and Mathematics) in a university based in the EU or associated country are eligible to apply. A good knowledge of English is mandatory since all interaction will be held in that language. \nSelection will be based on the applicant’s CV\, a motivation letter\, up to three recommendation letters\, and academic transcripts. It will take into account gender and geographical balance to ensure a diversity of student backgrounds. \nCost: Free of charge. Accommodation and meals are provided. Please note that travel costs are not reimbursed. \nApplication deadline: 29 March 2026. \nREGISTRATION HERE.
URL:https://czechsemiconductorcentre.cz/event/ecs-summer-school-2026-application-deadline-29-march/
LOCATION:University of Bologna\, Via Frangipane 6\, Bertinoro\, Italy
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/02/Snimek-obrazovky-2026-02-23-093839.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260829
DTEND;VALUE=DATE:20260906
DTSTAMP:20260728T072355
CREATED:20250918T124143Z
LAST-MODIFIED:20250918T124143Z
UID:1644-1787961600-1788652799@czechsemiconductorcentre.cz
SUMMARY:European Federation of Electron Paramagnetic Resonance (EFEPR)
DESCRIPTION:13th European Federation of Electron Paramagnetic Resonance (EFEPR) Conference\, taking place in Brno\, Czech Republic. This year\, we have prepared a rich and varied programme\, complemented by two additional days dedicated to the Young Researcher Conference (EFEPR). You can look forward to a diverse array of professional contributions\, the exchange of valuable experiences\, and opportunities for both formal discussions and informal networking. Beyond the academic programme\, you will also have the chance to enjoy the renowned hospitality and charm of the Brno region and the family-friendly atmosphere of the venue. \n  \nOn behalf of the Organizing Committee of the 13th European Federation of Electron Paramagnetic Resonance (EFEPR) Conference and the accompanying Young Researcher Conference (yEFEPR)\, I am pleased to invite you to join us in Brno\, Czech Republic\, from 29 August to 5 September 2026\, at the OREA Congress Hotel.\nThe yEFEPR conference\, dedicated to young scientists in magnetic resonance\, will take place during the first two days and will be followed by the main EFEPR 2026 conference. \nThis year’s EFEPR holds special significance: it takes place on the 100th anniversary of Josef Dadok (28 February 1926 – 4 October 2024)\, a renowned Czech scientist\, and magnetic resonance pioneer – a name deeply intertwined with the history of EPR and NMR in Czechoslovakia. \nDadok graduated from Brno University of Technology in the early 50s. In 1960\, he founded the Nuclear Magnetic Resonance Department at the Institute of Scientific Instruments (ISI)\, Czechoslovak Academy of Sciences\, where he\, together with his team\, developed the first devices for NMR spectroscopy in Czechoslovakia. At that time\, an embargo from the US on NMR equipment to the Soviet Bloc made scientific progress difficult. Luckily\, ISI was just ten minutes from TESLA Brno – the state-sponsored monopoly on electronics production in Czechoslovakia. In 1965\, TESLA put Dadok’s first 60 MHz spectrometer\, the TESLA BS477\, into production\, making Czechoslovakia the third country\, after the USA and Japan\, to succeed in the serial production of these scientific devices. This was the only production of its kind in the Eastern Bloc\, which continued for 25 years\, resulting in about 500 TESLA spectrometers. \nIn 1967\, Professor Dadok left for an internship in the USA and did not return after the Soviet occupation of Czechoslovakia in 1968. In 1976\, he became Technical Director of the Pittsburgh National NMR Centre and full professor at Carnegie Mellon University. A year later\, he developed the first 600 MHz superconducting spectrometer (14.1 T)\, which remained the most powerful high-resolution NMR system in the world for eight years. \nDadok’s legacy remains alive in Brno. Since 2013\, the National NMR Centre at CEITEC has carried his name and houses the most powerful spectrometer in Central and Eastern Europe. Moreover\, my team at the Magneto-Optical and THz Spectroscopy group aims to reestablish the tradition of magnetic resonance development in Brno\, started by Josef Dadok. You can read more about the history of EPR in Czechoslovakia and Dadok’s legacy in our recent paper. \nI am honored to host EFEPR 2026 in a city so deeply tied to Josef Dadok’s legacy. I believe his spirit of scientific excellence will inspire all participants. \nOn behalf of the Organizing Committee\, I warmly invite you to register and join us for what promises to be an exciting and memorable meeting. \nWe look forward to welcoming you to Brno in 2026! \nWarm regards\,\nOn behalf of the Organizing Committee\nPetr Neugebauer
URL:https://czechsemiconductorcentre.cz/event/european-federation-of-electron-paramagnetic-resonance-efepr/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/09/Snimek-obrazovky-2025-09-18-143926.png
ORGANIZER;CN="CEITEC BUT":MAILTO:Marcela.Frybortova@ceitec.vutbr.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260831
DTEND;VALUE=DATE:20260904
DTSTAMP:20260728T072355
CREATED:20250710T115052Z
LAST-MODIFIED:20250710T115052Z
UID:1537-1788134400-1788479999@czechsemiconductorcentre.cz
SUMMARY:NFO18 – Near-Field Optics\, Nanophotonics and Related Techniques Conference
DESCRIPTION:NFO18 – the 18th International Conference on Near-Field Optics\, Nanophotonics and Related Techniques \nFollowing NFO3 in 1995\, we are honored to host this prestigious event in Brno once again. Brno is an academic and technology hub\, home to several universities (with over 80\,000 students)\, research institutes and high-tech companies. Notably\, it hosts three major electron microscope manufacturers\, whose combined output accounts for about one-third of the world’s total production. This unique position makes our city an ideal venue for discussions on the latest advances in near-field optics and other related nanophotonic domains\, including novel materials\, and nanofabrication technologies. A special attention will be given to an emerging field combining near-field optical and electron-beam techniques.  \nThe NFO Summer School preceding the conference (August 30)\, will offer hands-on workshops\, specialized tutorials\, and valuable networking opportunities  for early-career researchers. NFO18 itself will bring together specialists from academia and industry to exchange ideas and foster collaborations in a welcoming\, focused environment.  \nPlease mark your calendars and stay tuned for details. Whether you seek cutting-edge knowledge\, new partnerships\, or simply want to experience Brno’s vibrant atmosphere\, we look forward to your participation.  \nNFO18 is organised by Brno University of Technology (Faculty of Mechanical Engineering and CEITEC BUT)
URL:https://czechsemiconductorcentre.cz/event/nfo18-near-field-optics-nanophotonics-and-related-techniques-conference/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/07/Snimek-obrazovky-2025-07-10-134831.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260919
DTSTAMP:20260728T072355
CREATED:20260701T134537Z
LAST-MODIFIED:20260701T134537Z
UID:2508-1789344000-1789775999@czechsemiconductorcentre.cz
SUMMARY:ECCE Europe 2026 in Valencia
DESCRIPTION:ECCE Europe is Europe’s leading conference on power electronics and energy conversion\, bringing together researchers\, industry experts\, and innovators from around the world. It will be taking place from 14 – 18 September 2026 in Valencia\, Spain. \nThe ECCE Europe 2026 conference and exhibition will take place from 14 – 18 September at the Valencia Conference Center in Valencia\, Spain. \nCommencing in 2024\, IEEE PELS is embarking on a dynamic new collaboration with the European Center for Power Electronics (ECPE) for the PELS flagship conference\, now titled IEEE ECCE Europe. United\, IEEE PELS and ECPE are on the brink of unprecedented opportunities in Europe: nurturing innovation\, facilitating the exchange of knowledge\, and catalyzing transformative breakthroughs in the realm of global power electronics. IEEE PELS and ECPE are inviting the Power Electronics community from academia and industry in Europe to follow us in shaping the new ECCE Europe Conference. \nConference Highlights: \n\nCutting-edge Research Presentations\nKeynote Speakers & Industry Experts\nIndustry Sessions\nDiverse Technical Tracks\nWorkshops and Tutorials\nNetworking Opportunities\nStudent Job Fairs
URL:https://czechsemiconductorcentre.cz/event/ecce-europe-2026-in-valencia/
LOCATION:Valencia\, Valencia\, Spain
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x.webp
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260921
DTEND;VALUE=DATE:20260923
DTSTAMP:20260728T072355
CREATED:20260520T090952Z
LAST-MODIFIED:20260520T090952Z
UID:2356-1789948800-1790121599@czechsemiconductorcentre.cz
SUMMARY:FD-SOI ICs Design Opportunities Short Course
DESCRIPTION:The FAMES Pilot Line informs that pre-registrations is still open for the FD-SOI ICs Design Opportunities Short Course. taking place in: \nDate: 21–22 September 2026\nGrenoble\, France \nThis one-and-a-half-day training\, provided by FD-SOI experts\, will provide a comprehensive overview of FD-SOI technology and advanced design methodologies for digital\, analog\, RF and power management circuits. It is aimed for engineers\, researchers and technologists interested in leveraging FD-SOI for next-generation integrated circuits. \nThe program also includes technical tutorials\, networking opportunities and an immersive clean-room visit at CEA-Leti. \nConsult the full program and pre-register here: https://fames-pilot-line.eu/fd-soi-ics-design-opportunities-short-course/. \n⚠️This is a paid event with limited capacity.
URL:https://czechsemiconductorcentre.cz/event/fd-soi-ics-design-opportunities-short-course/
LOCATION:Grenoble\, Grenoble\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/FD-SOI_ics_Grenoble.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260930
DTEND;VALUE=DATE:20261002
DTSTAMP:20260728T072355
CREATED:20260619T081449Z
LAST-MODIFIED:20260619T081659Z
UID:2482-1790726400-1790899199@czechsemiconductorcentre.cz
SUMMARY:FIRST by FMD
DESCRIPTION:FIRST – Fast Innovation through Research in Semiconductor Technologies\nThe European conference on microelectronic trends\, roadmaps and strategic alignment \n\n  \n\nFIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience\, technological sovereignty\, security\, and sustainable growth. With initiatives such as the EU Chips Act and Germany’s Hightech Agenda\, the strategic importance of European microelectronics is greater than ever. \nFIRST – Fast Innovation through Research in Semiconductor Technologies – brings together decision-makers from industry\, policy and research. With a clearly curated program\, FIRST provides strategic insights into emerging technologies\, industrial roadmaps and future infrastructure developments. \nAt FIRST\, leaders from across the semiconductor value chain engage with representatives from key application sectors including AI\, automotive\, healthcare\, industrial manufacturing\, telecommunications and energy. For those driving innovation\, product strategies or technology roadmaps\, this is where Europe’s semiconductor future becomes business reality. \nProgram highlights at FIRST 2026\n\nGain early insights into emerging technology and market trends\nUnlock strategic partnerships across the full value chain\nStrengthen your innovation-to-market capabilities\nExpand your network with Europe’s key semiconductor decision-makers\n\nA further strategic focus is the APECS pilot line\, implemented by the Research Fab Microelectronics Germany (FMD). It provides an industry-oriented environment for advanced packaging and design as key enabling technologies for chiplet architectures and heterogeneous integration\, strengthening innovation across the European value chain.
URL:https://czechsemiconductorcentre.cz/event/first-by-fmd/
LOCATION:Berlin\, Berlin\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Eventankuendigung-FHG-web.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261007
DTEND;VALUE=DATE:20261010
DTSTAMP:20260728T072355
CREATED:20260409T065725Z
LAST-MODIFIED:20260409T065928Z
UID:2196-1791331200-1791590399@czechsemiconductorcentre.cz
SUMMARY:ASDAM (Advanced Semiconductor Devices and Microsystems)
DESCRIPTION:𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝙞𝙨 𝙘𝙤𝙢𝙞𝙣𝙜 𝙩𝙤 𝘽𝙧𝙖𝙩𝙞𝙨𝙡𝙖𝙫𝙖.\nThe 𝟭𝟲𝘁𝗵 𝗜𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 on 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗮𝗻𝗱 𝗠𝗶𝗰𝗿𝗼𝘀𝘆𝘀𝘁𝗲𝗺𝘀 will take place on 𝟳–𝟵 𝗢𝗰𝘁𝗼𝗯𝗲𝗿 𝟮𝟬𝟮𝟲 𝗮𝘁 𝘁𝗵𝗲 𝗥𝗮𝗱𝗶𝘀𝘀𝗼𝗻 𝗕𝗹𝘂 𝗖𝗮𝗿𝗹𝘁𝗼𝗻 𝗛𝗼𝘁𝗲𝗹 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮\, 𝗦𝗹𝗼𝘃𝗮𝗸𝗶𝗮. \nThe conference is 𝗳𝗼𝗰𝘂𝘀𝗲𝗱 𝗼𝗻 the latest research and development in semiconductor devices\, microsystems\, materials\, and related technologies. Its scope includes topics such as WBG and UWBG materials\, semiconductor structures and devices\, characterization and modelling\, sensors and microsystems\, photonics\, IC design\, packaging technologies\, and AI in electronics. \n𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝘄𝗶𝗹𝗹 𝗯𝗿𝗶𝗻𝗴 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 researchers\, scientists\, university experts\, doctoral candidates\, and industry 𝗽𝗿𝗼𝗳𝗲𝘀𝘀𝗶𝗼𝗻𝗮𝗹𝘀 𝗳𝗿𝗼𝗺 𝗮𝗹𝗹 𝗼𝘃𝗲𝗿 𝘁𝗵𝗲 𝘄𝗼𝗿𝗹𝗱. Giving participants an opportunity 𝘁𝗼 𝗽𝗿𝗲𝘀𝗲𝗻𝘁 𝘁𝗵𝗲𝗶𝗿 𝘄𝗼𝗿𝗸 𝘄𝗶𝘁𝗵𝗶𝗻 𝗮 𝗿𝗲𝘀𝗽𝗲𝗰𝘁𝗲𝗱 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗳𝗼𝗿𝘂𝗺. Its 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝘀𝗰𝗶𝗲𝗻𝘁𝗶𝗳𝗶𝗰 𝗰𝗼𝗺𝗺𝗶𝘁𝘁𝗲𝗲 includes 𝗲𝘅𝗽𝗲𝗿𝘁𝘀 from leading institutions in multiple countries\, and the proceedings will be published by the 𝗜𝗘𝗘𝗘 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗦𝗼𝗰𝗶𝗲𝘁𝘆. \n𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀 𝗶𝘀 𝗻𝗼𝘄 𝗼𝗽𝗲𝗻. 𝗬𝗼𝘂 𝗰𝗮𝗻 𝗳𝗶𝗻𝗱 𝗮𝗹𝗹 𝘁𝗵𝗲 𝗶𝗻𝗳𝗼𝗿𝗺𝗮𝘁𝗶𝗼𝗻 𝗼𝗻 𝗔𝗦𝗗𝗔𝗠 𝘄𝗲𝗯𝗽𝗮𝗴𝗲: 𝘄𝘄𝘄.𝗮𝘀𝗱𝗮𝗺.𝘀𝗸 \n𝗔𝗯𝘀𝘁𝗿𝗮𝗰𝘁 𝘀𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝘀𝘁𝗮𝗿𝘁𝗲𝗱 𝗼𝗻 𝟭 𝗔𝗽𝗿𝗶𝗹 𝟮𝟬𝟮𝟲\, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝗱𝗲𝗮𝗱𝗹𝗶𝗻𝗲 𝗳𝗼𝗿 𝗮𝗯𝘀𝘁𝗿𝗮𝗰𝘁𝘀 𝗶𝘀 𝟭 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲. \n𝗪𝗲 𝗶𝗻𝘃𝗶𝘁𝗲 researchers\, scientists\, doctoral candidates\, and experts from academia working in semiconductor devices\, microsystems\, materials\, photonics\, sensors\, modelling\, packaging\, IC design\, and related fields to submit their abstracts and become part of ASDAM 2026. \n𝗝𝗼𝗶𝗻 𝘂𝘀 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮 𝗮𝗻𝗱 𝘀𝗵𝗮𝗿𝗲 𝘆𝗼𝘂𝗿 𝗿𝗲𝘀𝗲𝗮𝗿𝗰𝗵 with an international community shaping the future of semiconductors and microsystems.
URL:https://czechsemiconductorcentre.cz/event/asdam-advanced-semiconductor-devices-and-microsystems/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261021
DTEND;VALUE=DATE:20261023
DTSTAMP:20260728T072355
CREATED:20260720T064502Z
LAST-MODIFIED:20260720T064502Z
UID:2579-1792540800-1792713599@czechsemiconductorcentre.cz
SUMMARY:Engaged Investments
DESCRIPTION:Start-up founders and investors are invited to attend Engaged Investments 2026\, an exclusive venture capital conference bringing together active investors and ambitious founders from Central and Eastern Europe and the Baltic region. \nTaking place at the National House in Prague on 21–22 October 2026\, the conference is expected to welcome up to 500 participants\, including approximately 250 venture investors\, 150 start-up founders and more than 40 speakers. The event is organised by active investors DEPO Ventures and J&T Ventures\, with a strong focus on meaningful connections\, cross-border investment and new business opportunities. \nThe conference is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking investment and commercial partnerships within the CEE ecosystem. Its panel discussions will explore technology trends including AI infrastructure\, defence and space – sectors that increasingly depend on advanced computing\, specialised chips\, sensors and other semiconductor technologies. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, business angels and other active investors;\narrange one-to-one meetings through the conference networking platform;\nexplore cross-border investment and technology transfer opportunities;\nconnect with founders\, industry representatives and ecosystem organisations;\nattend expert panel discussions and practical workshops;\npresent their businesses to international investors through the Engaged Top Startup Selection.\n\nTwo days of venture investment and start-up opportunities\nThe first day is primarily designed for investors and will address topics such as capital formation\, exit strategies\, cross-border collaboration and emerging technology trends. \nThe second day will focus on founders and the Engaged Top Startup Selection. Up to 50 promising CEE start-ups will be selected across four funding stages: angel\, pre-seed\, seed and Series A. Each category will be evaluated by an investor jury\, giving selected companies an opportunity to pitch live and pursue direct funding discussions with international investors. \nThe programme will also include structured networking\, pre-arranged one-to-one meetings\, workshops and partner side events. Start-ups applying for the Top Startup Selection must purchase a founder ticket and be selected by the organisers to receive a pitching opportunity. \nEngaged Investments 2026\n21–22 October 2026\nNational House\, Prague\, Czech Republic \nLearn more\, purchase a ticket and apply for the Top Startup Selection
URL:https://czechsemiconductorcentre.cz/event/engaged-investments/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260728T072355
CREATED:20260204T094221Z
LAST-MODIFIED:20260204T094319Z
UID:1980-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:IMAPS Flash Conference 2026
DESCRIPTION:The IMAPS Flash Conference 2026 invites researchers\, engineers\, and industry professionals to meet in the heart of Moravia for two days of intensive scientific exchange and discussion. Organised by the Czech and Slovak Chapter of IMAPS (IMAPS CZ&SK) in partnership with Tomas Bata University in Zlín\, the conference will take place on 22–23 October 2026 at the Faculty of Applied Informatics\, Tomas Bata University in Zlín. \nIMAPS Flash Conference is a well-established European forum connecting senior and early-career scientists from academia and the electronics industry. The event focuses on sharing experimental and theoretical advances across the broad fields of electronics\, microelectronic technologies\, and electronic packaging. \nFlash Poster Session and Thematic Focus\nBuilding on the success of previous editions\, the 2026 conference will once again feature a flash poster session\, designed to stimulate open discussion\, rapid idea exchange\, and interdisciplinary interaction. \nA special thematic focus for this year will be “Comprehensive Semiconductor Analysis”\, reflecting the growing importance of integrated\, cross-disciplinary approaches in contemporary semiconductor research\, development\, and characterisation. \nTopics of Interest\nThe technical programme will cover a wide range of topics\, including: \n\n\nElectronic Assembly\, Packaging and Advanced Integration \n\n\nJoining\, Interconnection and Interface Technologies \n\n\nMaterials and Functional Structures for Microelectronics \n\n\nSimulation\, Modelling and Digital Design Tools \n\n\nReliability\, Testing and Characterisation \n\n\nSensors\, Microsystems\, Embedded and Control Systems \n\n\nQuantum\, Photonics and Future Semiconductor Technologies \n\n\nThis broad scope makes the conference highly relevant for both academic researchers and industrial practitioners working on current and emerging semiconductor technologies. \nKey Information\n\n\nDate: 22–23 October 2026 \n\n\nVenue: Tomas Bata University in Zlín\, Faculty of Applied Informatics \n\n\nConference Chair: doc. Ing. Milan Navrátil\, Ph.D. \n\n\nAbstract submission deadline: 1 June 2026 \n\n\nJoin the IMAPS Community in Zlín\nIMAPS Flash Conference 2026 offers a unique opportunity to present your work\, gain feedback from international experts\, and build new professional connections within the European microelectronics and semiconductor community. \nFor detailed information on registration\, submission guidelines\, and programme updates\, please visit:👉 https://cz.imapseurope.org/imaps-flash-conference-2026/👉 https://imaps.isibrno.cz/
URL:https://czechsemiconductorcentre.cz/event/imaps-flash-conference-2026/
LOCATION:Zlín\, Zlín\, Czech Republic
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261023
DTEND;VALUE=DATE:20261024
DTSTAMP:20260728T072355
CREATED:20260716T095647Z
LAST-MODIFIED:20260716T095909Z
UID:2566-1792713600-1792799999@czechsemiconductorcentre.cz
SUMMARY:HM Fellowship Programme 2027/2028
DESCRIPTION:Researchers and academics with a strong track record in international teaching are invited to apply for the HM Fellowship Programme 2027/2028\, organised by Hochschule München University of Applied Sciences (HM). The programme offers an excellent opportunity to spend a semester in Munich while contributing to innovative teaching\, developing new international learning formats\, and strengthening academic collaboration across Europe. \nEstablished in 2007\, the HM Fellowship Programme has already welcomed more than 65 international fellows. For the 2027/2028 academic year\, up to three fellowships will be awarded to outstanding candidates from a wide range of disciplines. \nSuccessful applicants will: \n\nteach in English during either the Summer Semester 2027 (15 March – end of July 2027) or the Winter Semester 2027/2028 (1 October 2027 – mid-February 2028)\,\ncontribute to the development of innovative international teaching projects alongside HM academic staff\,\nhelp advance Hochschule München’s strategy of “internationalisation at home” through new teaching methods\, joint programmes and collaborative educational initiatives.\n\nFellowship support\nThe fellowship provides comprehensive financial support\, including: \n\nTeaching allowance of up to €9\,000\,\nAcademic project grant of €3\,000\,\nTravel and accommodation reimbursement of up to €6\,000\,\nadditional organisational support from HM’s International Office\, including assistance with accommodation and visa arrangements.\n\nWho can apply?\nApplicants should: \n\nhold a doctoral degree (PhD)\,\ndemonstrate an excellent academic record\,\nhave substantial experience in international teaching\,\npreferably come from an HM partner institution\, although applicants from other institutions with strong collaboration potential are also encouraged to apply.\n\nApplication deadline\nApplications must be submitted by 23 October 2026. The results of the selection process will be announced in early December 2026. \nFor further information about the fellowship and application process\, please contact the HM International Office – Staff Mobility Team at staff-mobility-io@hm.edu \nAll details available here:Call for Application
URL:https://czechsemiconductorcentre.cz/event/hm-fellowship-programme-2027-2028/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261026
DTEND;VALUE=DATE:20261028
DTSTAMP:20260728T072355
CREATED:20260720T064156Z
LAST-MODIFIED:20260720T064156Z
UID:2576-1792972800-1793145599@czechsemiconductorcentre.cz
SUMMARY:Deep Tech Summit
DESCRIPTION:Start-ups\, investors\, researchers and industry representatives are invited to attend Deep Tech Summit 2026\, a major Central and Eastern European event connecting technology innovators with investment\, business and partnership opportunities. \nTaking place in Warsaw on 26–27 October 2026\, the summit is expected to welcome more than 1\,000 participants from over 30 countries\, including over 250 start-ups and scale-ups\, 150 investors and business angels\, as well as corporate executives\, researchers\, engineers and representatives of the innovation ecosystem. \nThe event is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking new investors\, industrial partners and connections across the CEE region. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, corporate investors and business angels;\ntake part in dedicated matchmaking and one-to-one meetings;\npresent technologies and business propositions to potential partners;\nexplore financing and international growth opportunities;\nconnect with start-up founders\, industry executives\, researchers and innovation organisations;\ngain insights into emerging deep-tech trends and technology commercialisation.\n\nTwo days of investment\, innovation and networking\nThe first day\, Investment Day on 26 October\, will focus on matchmaking\, investor discussions\, VC Central and networking events. Participants will be able to meet selected technology projects and connect with investors\, corporations and potential business partners. \nThe CEE Summit on 27 October will feature the Business on Tech and Science to Business stages\, expert discussions\, keynote presentations\, workshops\, pitching competitions and further matchmaking opportunities. Side events will take place throughout both days. \nDeep Tech Summit provides semiconductor and hardware innovators with an opportunity to enter the wider CEE investment ecosystem\, strengthen their international visibility and establish relationships that can support funding\, commercialisation and expansion into new markets. \nDeep Tech Summit 2026\n26–27 October 2026\nWarsaw\, Poland \nLearn more and register on the official Deep Tech Summit website
URL:https://czechsemiconductorcentre.cz/event/deep-tech-summit/
LOCATION:Warsaw\, Poland\, Warsaw\, Poland
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261101
DTEND;VALUE=DATE:20261105
DTSTAMP:20260728T072355
CREATED:20260625T071252Z
LAST-MODIFIED:20260625T071258Z
UID:2491-1793491200-1793836799@czechsemiconductorcentre.cz
SUMMARY:International Trade Partners Conference - ITPC 2026
DESCRIPTION:For more than 40 years\, the SEMI International Trade Partners Conference—ITPC has served as our premium networking and knowledge-sharing event for C-suite executives in the global semiconductor and microelectronics design and manufacturing supply chain. \nMulti‑Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\nThe global semiconductor industry is entering a defining era; one in which chips are no longer simply components inside devices\, but the foundation of the world’s digital economy\, AI infrastructure\, advanced manufacturing\, mobility\, communications\, energy systems\, healthcare innovation\, and national security. \nAs industry revenues accelerate toward multi-trillion-dollar scale\, the next phase of growth will not happen by chance. It must be designed through strategic investment\, resilient supply chains\, trusted global partnerships\, and coordinated innovation across the full electronics ecosystem. \nAnchored by the 2026 theme\, Multi-Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\, ITPC will convene senior executives and decision-makers from across the semiconductor design and manufacturing supply chain to examine how the industry can shape this future with intention—balancing rapid AI-driven demand\, geopolitical complexity\, sustainability pressures\, workforce needs\, and the technology breakthroughs required to power the next decade of global progress. \nSessions\n\nKeynotes\nFuture Trends\nMarkets & Applications\nTechnology\nTrade & Politics\n\nJoin the Following Speakers at ITPC 2026\n\nASML\nRapidus\nIntel\nSkyWater\nAnd More!\n\nDon’t Miss Out!\nITPC offers intimate and exclusive access to visionaries on the front line. Mark your calendars now and plan on joining industry leaders at ITPC to contribute your perspective\, catch up with colleagues\, and forge new connections. \nThank You\nA sincere appreciation to the executives serving on the ITPC Global Committee. We thank the committee for their time and expertise in developing the ITPC program. \nITPC History\nThe SEMI International Trade Partners Conference—ITPC has championed industry coordination for over four decades. The event was originally designed to support collaboration and productive trans-pacific relationship amidst severe trade tensions that threatened supply chain prosperity in the 1980s. Having successfully contributed to a spirit of cooperation and mutual business interest\, the event continues to promote alignment in the era of globalization. It has developed into a premier executive thought-leadership and relationship-building event to support global industry executive-level engagement.
URL:https://czechsemiconductorcentre.cz/event/international-trade-partners-conference-itpc-2025/
LOCATION:Hawai\, HI\, United States
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261110
DTEND;VALUE=DATE:20261114
DTSTAMP:20260728T072355
CREATED:20260720T065200Z
LAST-MODIFIED:20260720T065200Z
UID:2582-1794268800-1794614399@czechsemiconductorcentre.cz
SUMMARY:SEMICON Europa 2026
DESCRIPTION:Join Europe’s Semiconductor Industry at SEMICON Europa 2026\n10–13 November 2026 | Messe München\, Munich\, Germany \nCompanies\, start-ups\, researchers\, investors and industry professionals are invited to attend SEMICON Europa 2026\, Europe’s leading event for the semiconductor manufacturing and design ecosystem. \nTaking place at Messe München from 10 to 13 November 2026 and co-located with electronica\, the event will bring together stakeholders from across the semiconductor value chain – from materials\, equipment and chip design to manufacturing\, advanced packaging\, applications and system integration. \nUnder the theme “Europe’s Next Era: Navigating the Perfect Storm”\, the 2026 edition will explore how Europe can build a more competitive\, resilient and sustainable semiconductor ecosystem amid technological transformation and a rapidly changing geopolitical environment. Discussions will address technological sovereignty\, innovation\, international cooperation and the long-term strength of Europe’s semiconductor industry. \nWhy attend SEMICON Europa?\nParticipants will have the opportunity to: \n\nmeet semiconductor manufacturers\, equipment and materials suppliers\, technology companies and system integrators;\ndiscover emerging technologies and developments across the semiconductor value chain;\nattend expert conferences\, presentations and industry discussions;\nconnect with potential customers\, suppliers\, research partners and investors;\nexplore opportunities in chip design\, manufacturing\, advanced packaging\, MEMS\, imaging sensors and smart manufacturing;\nengage with the wider European and international semiconductor ecosystem.\n\nThe programme is expected to include specialist conferences and initiatives covering areas such as advanced packaging\, fab management\, MEMS and imaging sensors\, smart manufacturing\, executive-level industry dialogue and start-up innovation. \nChips Venture Forum at SEMICON Europa\nSEMICON Europa 2026 will also provide the setting for the final event of the Chips Venture Forum\, an initiative connecting promising semiconductor innovators with investors\, corporate partners and European institutions. \nThe final event is intended for selected semiconductor-related start-ups established or legally registered in a country hosting an operational Competence Centre within the European network\, as well as beneficiaries of the European Innovation Council. \nOrganised within the aCCCess project by Blumorpho in collaboration with DG CONNECT and the European Innovation Council\, the Chips Venture Forum supports the development\, financing and industrial adoption of European semiconductor technologies. It connects start-ups and scale-ups with venture capital and private equity funds\, industrial companies\, OEMs\, Competence Centres and institutional stakeholders. \nSelected start-ups will gain access to a broader ecosystem that may include: \n\nrepresentatives of the European Commission and the European Innovation Council;\nsemiconductor-focused investors and venture capital funds;\ncorporate partners and potential customers;\nsemiconductor equipment and technology providers;\nOEMs\, system integrators and industrial end-users;\nEuropean Chips Competence Centres\, Pilot Lines and the European Design Platform.\n\nThe forum offers semiconductor innovators an opportunity to present their solutions\, hold qualified discussions with investors and industrial partners\, increase their visibility and explore funding and commercialisation opportunities. \nFurther information about the Munich programme and the participation of selected start-ups is expected to be published by the organisers. \nSEMICON Europa 2026\n10–13 November 2026\nMesse München\nMunich\, Germany \nLearn more about SEMICON Europa 2026 \nLearn more about the Chips Venture Forum
URL:https://czechsemiconductorcentre.cz/event/semicon-europa-2026/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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