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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260603
DTEND;VALUE=DATE:20260604
DTSTAMP:20260923T210513
CREATED:20260408T074732Z
LAST-MODIFIED:20260408T074732Z
UID:2188-1780444800-1780531199@czechsemiconductorcentre.cz
SUMMARY:SEMI Europe Policy Forum 2026
DESCRIPTION:Join leading policymakers\, industry executives and technology experts at the SEMI Europe Policy Forum 2026\, a high-level gathering dedicated to shaping the future of Europe’s semiconductor ecosystem. \nIn an era defined by rapid geopolitical shifts and technological transformation\, Europe faces both unprecedented challenges and unique opportunities. This year’s forum will explore how Europe can strengthen its strategic position\, enhance supply chain resilience\, and secure long-term economic competitiveness in the global semiconductor landscape. \n\nWhy Attend?\nThe SEMI Europe Policy Forum brings together key stakeholders from across the semiconductor value chain and public sector to: \n\nExamine the impact of global geopolitical dynamics on Europe’s technology leadership\nDiscuss the next phase of the European Chips Act and its role in securing Europe’s tech future\nAddress sustainability and competitiveness challenges across the industry\nExplore strategies for building a skilled workforce for the future\nFoster international collaboration and strategic partnerships\n\n\nWho Should Attend?\nThis forum is designed for decision-makers and influencers\, including: \n\nEU and national policymakers\, public sector leaders and diplomatic representatives\nSenior executives and industry leaders from semiconductor and technology companies\nR&D professionals\, innovation leaders and supply chain stakeholders\nRepresentatives from academia\, research institutions and think tanks\n\n\nProgramme Highlights\nParticipants can look forward to a full-day programme featuring: \n\nHigh-level keynote sessions and panel discussions\nExpert insights on policy\, innovation and competitiveness\nNetworking opportunities with European and global leaders\nEvening reception and networking dinner\n\nKey topics include Europe’s tech sovereignty\, workforce development\, sustainability challenges\, and global partnerships shaping the future of semiconductors. \n\nBe Part of the Conversation\nAs Europe navigates a rapidly evolving global landscape\, collaboration between industry and policymakers has never been more critical. The SEMI Europe Policy Forum offers a unique platform to exchange ideas\, influence policy direction\, and contribute to a resilient and competitive European semiconductor ecosystem. \n👉 Register now
URL:https://czechsemiconductorcentre.cz/event/semi-europe-policy-forum-2026/
LOCATION:Brussels\, Brussels\, Belgium
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/04/SEPF_360x317px.png.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260604
DTEND;VALUE=DATE:20260605
DTSTAMP:20260923T210513
CREATED:20260520T091830Z
LAST-MODIFIED:20260520T091902Z
UID:2361-1780531200-1780617599@czechsemiconductorcentre.cz
SUMMARY:Forming\, storming\, norming and performing of European Semiconductor startups meetup
DESCRIPTION:EuroCDP and Silicon Catalyst.EU (via Malta Semiconductor Competence Centre) are co‑hosting the EU Semiconductor FSNP Meetup – targeted working day bringing together semiconductor startups\, VCs\, corporates\, and ecosystem leaders. \nWelcome to forming\, storming\, norming and performing of European semiconductor startups. This is a curated afternoon and evening event\, focusing exclusively on semiconductor startups and investors. The beautiful chateau location has been carefully chosen for easy access from Bordeaux station and airport for your same day arrival from anywhere in Europe. You will enjoy high-value conversations without the noise of broader tech events as the sun sets over the vineyards of the most hallowed wine growing soil in the world. \n​We have a packed agenda of investor insights\, funding discussions\, fast-paced startup pitch sessions and a deep insight into the geopolitical semiconductor dynamics challenging Europe’s chip ecosystem. \nDesigned for founders\, VCs\, and ecosystem leaders\, the day aims to spark meaningful connections and knowledge sharing. \nThe day closes by enjoying the finest wines in the world at our Bordeaux wine tasting social event led by one of the region’s top female sommeliers. \n​The event is free and dedicated to startup founders\, investors and ecosystem leaders. \nRegistration here.
URL:https://czechsemiconductorcentre.cz/event/forming-storming-norming-and-performing-of-european-semiconductor-startups-meetup/
LOCATION:Château de Seguin\, 3 Chem. du Bon Coin\, Lignan-de-Bordeaux\, 33360\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1778664931554.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260604
DTEND;VALUE=DATE:20260606
DTSTAMP:20260923T210513
CREATED:20260521T081219Z
LAST-MODIFIED:20260521T081247Z
UID:2373-1780531200-1780703999@czechsemiconductorcentre.cz
SUMMARY:European Semiconductor Collaborations Days
DESCRIPTION:Chips Without Borders will bring together key stakeholders from across the European semiconductor ecosystem\, including industry leaders\, SMEs\, research organizations\, and policy representatives. The program is designed to foster collaboration\, showcase innovation\, and strengthen international partnerships. \nHungarian SMEs\, industrial stakeholders\, and the HCHiP consortium itself will present their profiles\, ideas\, and international collaboration opportunities. This event also provides an opportunity for CCCs and our other European partners to present themselves\, their profiles\, and the areas in which they are seeking partners through posters and presentations. \nMore informations: https://hchip.hu/en/2026/04/15/european-semiconductor-collaboration-days-2/ \nEuropean Semiconductor Collaboration Day\, taking place on 4–5 June 2026 in Budapest\, Hungary. “Chips Without Borders” will bring together key stakeholders from across the European semiconductor ecosystem\, including industry leaders\, SMEs\, research organizations\, and policy representatives. The program is designed to foster collaboration\, showcase innovation\, and strengthen international partnerships. Venue: Novotel Budapest Danube (Budapest\, Bem rakpart 33-34\, 1027) The participation is free\, but it requires registration. \nRegister here: https://lnkd.in/dB2mS2kG \nFor questions\, please contact us at: hchip@hchip.hu
URL:https://czechsemiconductorcentre.cz/event/european-semiconductor-collaborations-days/
LOCATION:Budapest\, Budapest\, Hungary
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1778062652574-Hchip_European_Semiconductor_Collaboration_Days_cover.webp
ORGANIZER;CN="Hchip":MAILTO:hchip@hchip.hu
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260608
DTEND;VALUE=DATE:20260613
DTSTAMP:20260923T210513
CREATED:20260324T125511Z
LAST-MODIFIED:20260324T125721Z
UID:2162-1780876800-1781308799@czechsemiconductorcentre.cz
SUMMARY:RISC-V Summit Europe
DESCRIPTION:Join us at the RISC-V Summit Europe 2026\, the leading European event dedicated to the open standard RISC-V architecture and its rapidly evolving ecosystem. \nTaking place in Bologna\, Italy\, from 8–12 June 2026\, the summit brings together key stakeholders from industry\, academia\, research\, and government to explore the future of computing and innovation built on RISC-V. \nThe programme will feature: \n\nInspiring keynotes and technical sessions\nPanels\, tutorials\, and workshops\nIndustry exhibitions\, demos\, and poster sessions\nExtensive networking opportunities with leaders across semiconductors\, AI\, embedded systems\, HPC\, and beyond\n\nRISC-V\, as an open and flexible instruction set architecture\, is enabling new applications and research that are shaping the future of computing in Europe and globally. \nThe summit offers a unique platform to exchange knowledge\, showcase innovations\, and strengthen collaboration across the European and global RISC-V community. \n📍 Location: Bologna Congress Center\, Italy📅 Dates: 8–12 June 2026🔗 Learn more and register: RISC-V Summit Europe 2026 website
URL:https://czechsemiconductorcentre.cz/event/risc-v-summit-europe-2/
LOCATION:Bologna\, Bologna\, Italy
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-24-135153.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260609
DTEND;VALUE=DATE:20260610
DTSTAMP:20260923T210513
CREATED:20260529T122352Z
LAST-MODIFIED:20260529T123149Z
UID:2425-1780963200-1781049599@czechsemiconductorcentre.cz
SUMMARY:Q-LAB Grand Opening
DESCRIPTION:We are pleased to invite you to the official opening of Q-LAB\, a state-of-the-art technical cleanliness laboratory developed by QPAG in cooperation with ZEISS\, taking place on 9 June 2026 at the QPAG Technology Centre in Brno. \nIn today’s manufacturing environment\, even microscopic contaminants can significantly affect product performance\, durability and safety. Q-LAB has been established as a specialised centre for technical cleanliness testing and contamination analysis in accordance with VDA 19.1 / ISO 16232 standards\, operating in an ISO 7 cleanroom environment. \nWhat to Expect\n\nExpert presentations on technical cleanliness and quality assurance\nParticle analysis demonstrations in cooperation with ZEISS\nGuided tours of the QPAG Technology Centre\nLive demonstrations of:\n\nQ-LAB technical cleanliness laboratory (ISO 7)\nAccredited calibration laboratory\nPrecision measurement and 3D scanning technologies\nAutomated quality control solutions\nAI-powered visual inspection systems\n\n\nNetworking opportunities with industry professionals and technology partners\n\nEvent Details\n📅 Date: 9 June 2026📍 Venue: QPAG Technology Centre\, Kaštanová 530/125b\, Brno\, Czech Republic🕘 Morning Session: Registration 08:30 | Opening 09:00 (full)🕐 Afternoon Session: Registration 12:30 | Opening 13:00(Both sessions feature the same programme content.) \nThe event is intended for manufacturing and technical directors\, quality management professionals\, process engineers and specialists from the automotive\, aerospace\, engineering\, medical and high-tech industries. \nFor registration and further information\, please visit:Q-LAB Registration & Event Details \nWe look forward to welcoming you to Q-LAB and sharing the future of technical cleanliness\, advanced inspection and quality assurance. ✨
URL:https://czechsemiconductorcentre.cz/event/q-lab-grand-opening/
LOCATION:Lab Q-LAB\, Kaštanová 125b\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/ttt-scaled-uai-1032x688-1.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260609T100000
DTEND;TZID=Europe/Prague:20260609T110000
DTSTAMP:20260923T210513
CREATED:20260604T094550Z
LAST-MODIFIED:20260604T094550Z
UID:2449-1780999200-1781002800@czechsemiconductorcentre.cz
SUMMARY:Technology Offers & Collaboration Pathways with NanoIC Pilot Line and FC3 Chips Competence Center
DESCRIPTION:Join us on June 9 for the second webinar of the aCCCess series dedicated to European Pilot Lines. \nThis session will feature the NanoIC Pilot Line and the FC3 Chips Competence Center\, showcasing cutting-edge capabilities and illustrating how their partnership enables seamless access to expertise\, services\, and innovation support. Don’t miss this opportunity to explore how these synergies accelerate the path from research to industrial application across Europe. It is free of charge. Please register here. \n📍 Programme : \n\n10:00 – 10:05 Introduction – aCCCess project\n\nLaure de Tassigny – European Project Manager\, Minalogic \n\n10:05 – 10:15 NanoIC Introduction and Access model\n\nGiuseppe Fiorentino – Programme Manager\, NanoIC Pilot Line – IMEC – IC-Link \n\n10:15 – 10:25NanoIC Technology offer\n\nNina Bazzazian R&D Project Leader – NanoIC Pilot Line Outreach and Access\, IMEC \n\n10:25 – 10:35 NanoIC Workforce and Training opportunities\n\nRuxandra Marina Florea – R&D Project Manager\, NanoIC Pilot Line – IMEC – IC-Link \n\n10:35 – 10:50 FC3 Chips Competence Center approach to tailored trainings\n\nDavid Maes Research Valorization Manager\, FC3 Chips Competence Center – KU Leuven \n\n10:50 – 11:00 Q&A
URL:https://czechsemiconductorcentre.cz/event/technology-offers-collaboration-pathways-with-nanoic-pilot-line-and-fc3-chips-competence-center/
LOCATION:on-line on Teams
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/1778664216731.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260610T110000
DTEND;TZID=Europe/Prague:20260610T120000
DTSTAMP:20260923T210513
CREATED:20260604T095321Z
LAST-MODIFIED:20260604T095321Z
UID:2453-1781089200-1781092800@czechsemiconductorcentre.cz
SUMMARY:ALL2GaN Insights: Driving Greener Power Electronics
DESCRIPTION:We are pleased to invite you to the next session of the ALL2GaN Insights: Driving Greener Power Electronics – The Wednesday Webinar Series. \nWebinar #5: QuanFINE high-performance substrates for power applications and devicesDate: Wednesday\, 10 June 2026Time: 11:00 a.m.Format: Live online via WebExDuration: 60 minutesParticipation: Public event with open registration \nThe webinar will focus on QuanFINE high-performance substrates for power applications and devices and will feature two speakers closely involved in the ALL2GaN project: \nMichael Salter\, RISE Research Institute of SwedenAnders Lundskog\, SweGaN \nMichael Salter will present the latest results of RISE GaN HEMT device development within the ALL2GaN project\, including E-mode/D-mode devices using SweGaN QuanFINE GaN/SiC epi substrates and vertical nanowire HEMT devices. \nAnders Lundskog will introduce SweGaN and QuanFINE Epitaxy\, followed by an overview of Mg-doping profile tuning. \nThe webinar offers an opportunity to discover recent developments in GaN technology\, learn from European research and industry experts\, and engage with the speakers during a live Q&A session. \nJoin the webinar:https://infineon.webex.com/infineon/j.php?MTID=m86ed1962316e3106cf041e32852b7f2f
URL:https://czechsemiconductorcentre.cz/event/all2gan-insights-driving-greener-power-electronics/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/shutterstock_2550090433-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260615
DTEND;VALUE=DATE:20260618
DTSTAMP:20260923T210513
CREATED:20260602T070546Z
LAST-MODIFIED:20260604T101214Z
UID:2431-1781481600-1781740799@czechsemiconductorcentre.cz
SUMMARY:20th Silicon Saxony Days
DESCRIPTION:The Czech Semiconductor Centre will be part of this year’s Silicon Saxony Days\, one of Europe’s key high-tech and semiconductor networking events\, bringing together industry\, research\, start-ups and policy leaders from across the European ecosystem. We are pleased to highlight the participation of Petr Kamenický\, the new Director of Czech Semiconductor Centre\, with his talk: Accelerating Semiconductor Innovation in Europe: AI\, Energy and Open Architectures. His contribution on June 16 will underline the Czech Semiconductor Centre’s role in strengthening Czechia’s position within the European semiconductor landscape and supporting closer cooperation across European innovation ecosystems. This talk presents how the Czech semiconductor ecosystem – through the CSC and Czech National Semiconductor Cluster – accelerates innovation in AI hardware\, energy-efficient semiconductors and open architectures such as RISC-V\, strengthening Europe’s semiconductor value chain. \nThe programme will also feature Jana Drbohlavová\, Deputy Director of the Czech Semiconductor Centre\, who will join the panel discussion: Common challenges\, common goals: European Semiconductor Initiatives on Monday\, June 15 with Pierre Chastanet from European Commission. \n \nWe look forward to connecting with partners\, innovators and decision-makers in Dresden and contributing to the discussion on how Europe can accelerate semiconductor innovation through collaboration\, open architectures\, AI and energy-aware technologies. See you at Silicon Saxony Days 2026. \nMore details here.
URL:https://czechsemiconductorcentre.cz/event/20th-silicon-saxony-days/
LOCATION:Dresden\, Germany\, Dresden\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Snimek-obrazovky-2026-06-02-090521.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260616
DTEND;VALUE=DATE:20260620
DTSTAMP:20260923T210513
CREATED:20260313T110551Z
LAST-MODIFIED:20260313T110749Z
UID:2110-1781568000-1781913599@czechsemiconductorcentre.cz
SUMMARY:EPoSS Annual Forum 2026
DESCRIPTION:The EPoSS Annual Forum 2026 will take place from June 16-19 in Braga\, Portugal\, kindly hosted by the EPoSS member INL. \nThe Annual Forum offers sessions with high-ranking representatives from the EU\, local authorities\, institutions and companies\, thematic sessions\, poster presentations\, start-up award pitch and award ceremony\, on-site visits to thematically relevant institutions as well as time for exchange and idea development. \nBringing together key stakeholders from across Europe\, the forum will offer a rich and dynamic programme\, including: \n\nSessions with high-ranking representatives from the European Union\, local authorities\, research institutions\, and industry;\nThematic sessions addressing strategic and emerging topics in smart systems integration;\nPoster presentations showcasing cutting-edge research and innovation;\nA start-up award pitch session\, followed by the award ceremony.\n\nThe event will provide a unique platform to connect policy\, research\, and industry within one of Portugal’s leading innovation hubs\, fostering dialogue and collaboration around the future of smart systems integration.
URL:https://czechsemiconductorcentre.cz/event/eposs-annual-forum-2026/
LOCATION:INL – International Iberian Nanotechnology Laboratory\, Av. Mte. José Veiga s/n\, Braga\, 4715-330\, Portugal
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/EPOSS2026_General-scaled-1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260618T140000
DTEND;TZID=Europe/Prague:20260618T170000
DTSTAMP:20260923T210513
CREATED:20260529T093358Z
LAST-MODIFIED:20260529T093430Z
UID:2421-1781791200-1781802000@czechsemiconductorcentre.cz
SUMMARY:Info Session on the Chips 2026 Calls on Skills
DESCRIPTION:Responding to the growing semiconductor skills shortage in Europe and the objectives of the European Chips Act\, the Chips Joint Undertaking is launching three dedicated Skills-related Calls in July 2026 to support ambitious initiatives in semiconductor education\, training\, re-skilling\, up-skilling and talent development across the European ecosystem. \nTo help the community better understand these upcoming opportunities and prepare future collaborations\, the Chips JU Office\, in cooperation with AENEAS\, EPoSS and INSIDE is organising the Info Session on the Chips JU 2026 Calls on Skills. \nAgenda \n14:00 – 14:05 Welcome & Opening \n\nMatei Arghirescu\, Chips JU Office\nCaroline Bedran / Patrick Cogez\, AENEAS\n\nIntroduction to the Skills Calls context and Europe’s semiconductor talent challenge. \n14:05 – 15:00     Block 1: Skills Hubs of Excellence (HoE): Moderated by Patrick Cogez\, AENEAS \n\nPresentation of the Call by the Chips JU Office\nEuropean Commission perspective (Stefano Selleri\, DG CONNECT)\nNational representatives (TBD)\nCommunity project idea presentation(s)\nQ&A session\n\n15:00 – 15:05 Short Break \n15:05 – 16:00     Block 2: Pilot Federation \nSame structure- European Commission perspective (Stefano Selleri\, DG CONNECT) \n16:00 – 16:05 Short Break \n16:05 – 17:00      Block 3: Stimulation of Chip Design \nSame structure- European Commission perspective (Marco Ceccarelli\, DG CONNECT) \n17:00 – 17:05 Closing Remarks\nRegistration is free of charge and available here.
URL:https://czechsemiconductorcentre.cz/event/info-session-on-the-chips-2026-calls-on-skills/
LOCATION:on-line on Teams
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1779806475660.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260624
DTEND;VALUE=DATE:20260625
DTSTAMP:20260923T210513
CREATED:20260402T073253Z
LAST-MODIFIED:20260402T073253Z
UID:2180-1782259200-1782345599@czechsemiconductorcentre.cz
SUMMARY:Analog IC Design Using Open Source Tools and IHP-Open-PDK
DESCRIPTION:Date: June 24\, 2026 \nTime: 8:30 – 18:30 \nLocation: Poznan University of Technology \nParticipant limit: 15 people (first come\, first served) \nParticipation fee: 100 EUR (the price does not include VAT\, students are exempt from the fee). Registration is on a first-come\, first-served basis. \nWorkshop format: Interactive demonstration with the possibility to work at stations prepared by the organizer. Personal computers are not required; however\, participants may use their own laptops if they wish. \nAgenda:\n\n8:30 – 9:00 – Participant registration\, organizational introduction\n9:00 – 10:30 – Introduction to analog design in an open-source environment (overview of tools: Xschem\, Ngspice\, IHP-Open-PDK\, workflow basics)\n10:30 – 10:45 – Coffee break\n10:45 – 12:30 – Analog schematic design in Xschem – best practices\, parameterization\, DC\, AC\, and transient simulations (live demonstration)\n12:30 – 13:30 – Lunch break\n13:30 – 15:00 – Design of a sample analog circuit (e.g.\, StrongARM latch comparator) – operation analysis\, Monte Carlo simulations\, mismatch analysis\, parameter verification\n15:00 – 15:15 – Coffee break\n15:15 – 17:00 – Introduction to layout in KLayout\, analog design principles (matching\, symmetry\, noise minimization)\, PyCells – mask design automation\n17:00 – 18:00 – Complete design flow: from schematic to verification (LVS/DRC – process overview)\, fillers\, chip finishing\, sign-off\n18:00 – 18:30 – Q&A session\, workshop summary\n\nTechnical Scope\n\nFundamentals of CMOS analog circuit design\nWorking with open-source tools in a design environment\nElectrical simulations and interpretation of results\nIntroduction to analog layout and good design practices\nOverview of the complete design flow (schematic → simulation → layout → verification)\n\n 
URL:https://czechsemiconductorcentre.cz/event/analog-ic-design-using-open-source-tools-and-ihp-open-pdk/
LOCATION:Poznan\, Poznan\, Poland
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/04/2024-UMEL-Laborky-12-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260624T093000
DTEND;TZID=Europe/Prague:20260624T150000
DTSTAMP:20260923T210513
CREATED:20260616T070136Z
LAST-MODIFIED:20260616T070136Z
UID:2469-1782293400-1782313200@czechsemiconductorcentre.cz
SUMMARY:Digital Europe Program Online National Information Day
DESCRIPTION:Funding for AI\, cybersecurity\, advanced digital skills\, and European data infrastructure for 2026 is now open\, and we’ll show you how to get involved—all in one place. \nCzechInvest and the Ministry of Industry and Trade invite you to the Digital Europe Program Online National Information Day\, which will take place on Wednesday\, June 24\, 2026\, starting at 9:30 a.m. online via the MS Teams platform. \nThe Digital Europe program provides businesses\, research organizations\, and public administration with access to cutting-edge digital technologies and European funding. At the info day\, you will learn: \n\nwhich calls are currently open and what is expected of applicants\,\nwhat the funding rules\, eligibility criteria\, and most common mistakes in applications are\,\nhow to link Digital Europe with synergies from the Horizon Europe program\,\nand how the European network of national contact points DEP4ALL can help you with your preparation.\n\nSpeakers will include Kristina Kardum\, Head of the Digital Europe Program Sector at the European Commission (her presentation will be in English)\, along with experts from CzechInvest\, NÚKIB\, and the Prague Technology Center. \nThe event is intended for companies\, research organizations\, and public administration bodies considering submitting an application to the Digital Europe program: whether you have a specific project proposal or are just considering whether the program is right for you. The current calls for proposals close in early October. Since the summer significantly shortens the effective time for preparation\, it pays to start looking for partners and building a consortium right now\, as a high-quality international project cannot be put together in just a few weeks. \nA follow-up opportunity to find project partners: immediately after the info day\, on the same day from 1:00 PM to 3:00 PM\, the DEP Online Matchmaking Event (in English) will take place\, focused on partnerships for the current (10th) call of the Digital Europe Program. You can look forward to a presentation of partner search tools (the b2match platform)\, thematic breakout sessions on the calls\, short participant pitches\, and networking. \nParticipation is free after registration. Please register for both events HERE: we will send you the access link to MS Teams via email before the event. The program is subject to minor changes.
URL:https://czechsemiconductorcentre.cz/event/digital-europe-program-online-national-information-day/
LOCATION:on-line on Teams
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Logo_Digitalni_Evropa.jpeg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260629T130000
DTEND;TZID=Europe/Prague:20260629T143000
DTSTAMP:20260923T210513
CREATED:20260529T092510Z
LAST-MODIFIED:20260529T092657Z
UID:2417-1782738000-1782743400@czechsemiconductorcentre.cz
SUMMARY:Building the Future Together: Integrating Sustainability in the Semiconductor Ecosystem
DESCRIPTION:This joint webinar by GENESIS and the European Chips Skills Academy (ECSA) explores how sustainability and workforce development can shape the semiconductor industry’s future. The session will highlight the role of PFAS in semiconductor manufacturing\, the challenges\, and how the GENESIS project is working with industry partners to identify safer and more sustainable alternatives. Participants will also gain insight into how ECSA is helping equip the next generation of semiconductor professionals with the skills needed for a more sustainable ecosystem. \nMore details about the event can be found here. \nRegistration here.
URL:https://czechsemiconductorcentre.cz/event/building-the-future-together-integrating-sustainability-in-the-semiconductor-ecosystem/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/June-1.png.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260707T100000
DTEND;TZID=Europe/Prague:20260707T113000
DTSTAMP:20260923T210513
CREATED:20260617T082750Z
LAST-MODIFIED:20260617T082750Z
UID:2472-1783418400-1783423800@czechsemiconductorcentre.cz
SUMMARY:aCCCess Webinar Series on Technology Offers - FAMES PL & ASTEERICS CCC
DESCRIPTION:Join us on July 7 at 10:00 CEST for the third webinar of the aCCCess series dedicated to European Pilot Lines and their collaboration with Competence Centers. \nIn this session\, discover how the FAMES Pilot Line\, the euroCDP and the ASTEERICS Chips Competence Center support innovation from chip design to silicon validation and industrialisation. Through concrete feedback from Soitec and Nellow\, explore how Europe’s semiconductor ecosystem helps de-risk innovation and accelerate market readiness.. \n 📍 Programme : \n 10:00 – 10:05   Introduction: European Chips Act context\, aCCCess project. \nAn Innovation Continuum: From Upstream to Downstream \nLaure de Tassigny – European Projects Manager- Minalogic \n10:05 – 10:12   FAMES Pilot Line: Presentation of FAMES sub-10nm technologies and Open Access \nSusana Bonnetier – Open Access Chairperson – European FAMES Pilot Line – CEA \n 10:12 – 10:15   EuroCDP: Design resources and support services \nOlivier Thomas – Deputy head of the Integrated Circuit & System division – DET IC Dash – CEA \n 10:15 – 10:22 – Industrial Testimonial: How FAMES helps de-risk silicon innovation? (sSOI\, cybersecurity) \nSébastien Lasserre – FDSOI Product Manager – Soitec \n 10:22 – 10:32   ASTEERICS: Chips Competence Center mission\, free training offer and ASIC support services \nPhilippe Flatresse – Director of Valorisation\, ASTEERICS Chips Competence Center \n 10:32 – 10:40   Start-up Testimonial: FESO technology integration\, support and fundraising journey \nJean Philippe Attané – CEO – Nellow \n10:40 – 11:00   Q&A \n\n\nWe strongly encourage you to register here and to disseminate this event in your networks using the attached visuals (this webinar is public and open to your end-users).\n\n  \n About aCCCess webinar series on Technology offers \nEach session spotlights one pilot line and one competence centre and also focus on collaborations between ENCCC actors and user experiences. \nThese sessions will help our communities to understand \n• What are pilot lines and how can their services be accessed?\n• What technological resources in microelectronics exist in European ecosystems and how can they be leveraged?\n• Do European Competence Centres offer services complementary to each other? \n 
URL:https://czechsemiconductorcentre.cz/event/acccess-webinar-series-on-technology-offers-fames-pl-asteerics-ccc/
LOCATION:on-line on Teams
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Webinar-Technology3_1200x1200.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260817
DTEND;VALUE=DATE:20260822
DTSTAMP:20260923T210513
CREATED:20260507T064136Z
LAST-MODIFIED:20260507T064136Z
UID:2258-1786924800-1787356799@czechsemiconductorcentre.cz
SUMMARY:CEITEC Student Talent Summer School 2026
DESCRIPTION:Applying for CEITEC Student Talent Summer School 2026\n\nThe summer school is aimed at high school students in the third grade\, but any high school student can apply.\nAs we are limited by the size of the labs and the number of students/mentor\, participants are selected based on cover letters that they supply as part of the application process.\nWe consider the reasons why the student would like to attend the Summer School\, why they chose the topic\, how participation could help them in their future studies\, etc. Cover letters are evaluated directly by the mentors of the research projects.\nApplications are open until 30 June 2026.\n\n  \nInterested in applying?\n\nChoose the topic that you want to pursue – you should always apply for a specific research project.\nApply by email to Marcela.Frybortova@ceitec.vutbr.cz – the email must state your chosen research project as well as a short cover letter in which you outline why you chose the topic\, what made you interested in it\, and why it could benefit you personally.\nPut “Summer School 2026” in the subject line.\nApply by 30 June 2026\, when the application period closes.\nIf you are selected\, we will contact you at the very end of June with instructions on how to make your registration binding via our website. The binding registration will entail paying a registration fee of 500 CZK.\nWe will provide food and board for participants throughout the duration of the programme at a nearby dormitory (7-minute walk).\n\n  \nProgramme:\nDay 1 (Monday\, August 17\, 2026)\n\n 8:00 – 9:00 | Participant Registration\n 9:00 – 10:00 | Official Opening\n10:00 – 11:00 | Orientation Walk Around the CEITEC BUT Campus\n11:00 – 13:00 | Check-in at the Dormitory\n13:00 – 17:00 | Lab Work\n17:00 – 18:00 | Meeting with an Alumnus\n18:00 – 21:00 | BBQ and Improvised Networking (CEITEC BUT Courtyard)\n\n  \nDay 2 (Tuesday\, August 18\, 2026)\n\n 9:00 – 13:00 | Lab Work\n14:00 – 17:00 | Programme in Brno City Centre\n17:00 – 18:00 | Hands-On Science with Stanislav Průša\, Summer School Expert Guarantor\n18:00 – 20:00 | Pub Quiz\n\n  \nDay 3 (Wednesday\, August 19\, 2026)\n\n 9:00 – 13:00 | Lab Work\n14:00 – 16:00 | Field Trip to Thermo Fisher Scientific\n17:00 – 19:00 | Lab Work\n19:00 – 21:00 | Movie Night\n\n  \nDay 4 (Thursday\, August 20\, 2026)\n\n9:00 – 12:00 | Laboratory Program (Group Rotation and Opportunity to Try a Different Research Project)\n13:00 – 15:00 | Expert Lecture\n15:00 – 19:00 | Project Presentation Preparation\n\n  \nDay 5 (Friday\, August 21\, 2026)\n\n9:00 – 12:00 | Project Presentations and Official Closing
URL:https://czechsemiconductorcentre.cz/event/ceitec-student-talent-summer-school-2026/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:Organized by CSC
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1777463370180.jpg
ORGANIZER;CN="CEITEC BUT":MAILTO:Marcela.Frybortova@ceitec.vutbr.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260821
DTEND;VALUE=DATE:20260823
DTSTAMP:20260923T210513
CREATED:20260720T063814Z
LAST-MODIFIED:20260720T063814Z
UID:2572-1787270400-1787443199@czechsemiconductorcentre.cz
SUMMARY:Chips Venture Forum Selection at INPHO Venture Summit
DESCRIPTION:Semiconductor start-ups are invited to apply for the Chips Venture Forum Selection\, taking place in Bordeaux on 21–22 October 2026. The event will connect promising European innovators with investors\, corporate partners\, semiconductor end-users and representatives of key European institutions. \nThe opportunity is open to semiconductor-related start-ups that are established or legally registered in a country hosting an operational Competence Centre within the European network\, as well as to beneficiaries of the European Innovation Council. \nWhy apply?\nSelected start-ups will have the opportunity to: \n\npresent their technologies and business propositions to leading venture capital funds and corporate partners;\ntake part in qualified meetings with investors and potential industrial partners;\nincrease their visibility within the European semiconductor ecosystem;\nengage with representatives of the Chips Competence Centres\, Pilot Lines\, the European Design Platform\, the European Innovation Council and the European Commission;\nexplore investment\, commercialisation and scaling opportunities.\n\nThe Chips Venture Forum is organised by Blumorpho within the aCCCess project\, in collaboration with DG CONNECT and the European Innovation Council. Its objective is to accelerate the development\, financing and industrial adoption of semiconductor technologies while strengthening Europe’s semiconductor ecosystem. \nContinue the conversation at the INPHO Venture Summit\nSelected companies will also have the opportunity to participate in the INPHO Venture Summit on 22–23 October 2026 at the Palais de la Bourse in Bordeaux. \nThe invitation-only summit brings together deep-tech investors\, venture capital funds\, large corporations and selected start-ups. It offers participating companies a valuable opportunity to continue discussions with investors while meeting semiconductor end-users and other key industry stakeholders. \nChips Venture Forum Selection\n21–22 October 2026\nBordeaux\, France \nINPHO Venture Summit\n22–23 October 2026\nPalais de la Bourse\, Bordeaux\, France \nLearn more and apply through the Chips Venture Forum website \nDiscover the INPHO Venture Summit
URL:https://czechsemiconductorcentre.cz/event/chips-venture-forum-selection-at-inpho-venture-summit/
LOCATION:Bordeaux\, Bordeaux \, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x-1.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260823
DTEND;VALUE=DATE:20260829
DTSTAMP:20260923T210513
CREATED:20260223T083900Z
LAST-MODIFIED:20260223T083900Z
UID:2064-1787443200-1787961599@czechsemiconductorcentre.cz
SUMMARY:ECS Summer School 2026 - Application deadline 29 March
DESCRIPTION:WHEN: August 23th – August 28th\, 2026 \nWHERE: University Residential Centre\, University of Bologna\, Bertinoro\, Italy \nThe program will cover four main topics: \n\nSemiconductor technology\nIntegrated Circuits design\nDigital systems and Embedded Intelligence\nIntegration\n\nTalks will be delivered by representatives from leading universities\, research institutes and companies. Career testimonies by young engineers will complete the week. \nEligibility criteria: This Summer School is dedicated to undergraduate students who\, by the time of the summer school\, will have completed at least two years of university study and will have at least one year to go before completing their undergraduate studies. Students from all fields of STEM (Science\, Technology\, Engineering and Mathematics) in a university based in the EU or associated country are eligible to apply. A good knowledge of English is mandatory since all interaction will be held in that language. \nSelection will be based on the applicant’s CV\, a motivation letter\, up to three recommendation letters\, and academic transcripts. It will take into account gender and geographical balance to ensure a diversity of student backgrounds. \nCost: Free of charge. Accommodation and meals are provided. Please note that travel costs are not reimbursed. \nApplication deadline: 29 March 2026. \nREGISTRATION HERE.
URL:https://czechsemiconductorcentre.cz/event/ecs-summer-school-2026-application-deadline-29-march/
LOCATION:University of Bologna\, Via Frangipane 6\, Bertinoro\, Italy
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/02/Snimek-obrazovky-2026-02-23-093839.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260829
DTEND;VALUE=DATE:20260906
DTSTAMP:20260923T210513
CREATED:20250918T124143Z
LAST-MODIFIED:20250918T124143Z
UID:1644-1787961600-1788652799@czechsemiconductorcentre.cz
SUMMARY:European Federation of Electron Paramagnetic Resonance (EFEPR)
DESCRIPTION:13th European Federation of Electron Paramagnetic Resonance (EFEPR) Conference\, taking place in Brno\, Czech Republic. This year\, we have prepared a rich and varied programme\, complemented by two additional days dedicated to the Young Researcher Conference (EFEPR). You can look forward to a diverse array of professional contributions\, the exchange of valuable experiences\, and opportunities for both formal discussions and informal networking. Beyond the academic programme\, you will also have the chance to enjoy the renowned hospitality and charm of the Brno region and the family-friendly atmosphere of the venue. \n  \nOn behalf of the Organizing Committee of the 13th European Federation of Electron Paramagnetic Resonance (EFEPR) Conference and the accompanying Young Researcher Conference (yEFEPR)\, I am pleased to invite you to join us in Brno\, Czech Republic\, from 29 August to 5 September 2026\, at the OREA Congress Hotel.\nThe yEFEPR conference\, dedicated to young scientists in magnetic resonance\, will take place during the first two days and will be followed by the main EFEPR 2026 conference. \nThis year’s EFEPR holds special significance: it takes place on the 100th anniversary of Josef Dadok (28 February 1926 – 4 October 2024)\, a renowned Czech scientist\, and magnetic resonance pioneer – a name deeply intertwined with the history of EPR and NMR in Czechoslovakia. \nDadok graduated from Brno University of Technology in the early 50s. In 1960\, he founded the Nuclear Magnetic Resonance Department at the Institute of Scientific Instruments (ISI)\, Czechoslovak Academy of Sciences\, where he\, together with his team\, developed the first devices for NMR spectroscopy in Czechoslovakia. At that time\, an embargo from the US on NMR equipment to the Soviet Bloc made scientific progress difficult. Luckily\, ISI was just ten minutes from TESLA Brno – the state-sponsored monopoly on electronics production in Czechoslovakia. In 1965\, TESLA put Dadok’s first 60 MHz spectrometer\, the TESLA BS477\, into production\, making Czechoslovakia the third country\, after the USA and Japan\, to succeed in the serial production of these scientific devices. This was the only production of its kind in the Eastern Bloc\, which continued for 25 years\, resulting in about 500 TESLA spectrometers. \nIn 1967\, Professor Dadok left for an internship in the USA and did not return after the Soviet occupation of Czechoslovakia in 1968. In 1976\, he became Technical Director of the Pittsburgh National NMR Centre and full professor at Carnegie Mellon University. A year later\, he developed the first 600 MHz superconducting spectrometer (14.1 T)\, which remained the most powerful high-resolution NMR system in the world for eight years. \nDadok’s legacy remains alive in Brno. Since 2013\, the National NMR Centre at CEITEC has carried his name and houses the most powerful spectrometer in Central and Eastern Europe. Moreover\, my team at the Magneto-Optical and THz Spectroscopy group aims to reestablish the tradition of magnetic resonance development in Brno\, started by Josef Dadok. You can read more about the history of EPR in Czechoslovakia and Dadok’s legacy in our recent paper. \nI am honored to host EFEPR 2026 in a city so deeply tied to Josef Dadok’s legacy. I believe his spirit of scientific excellence will inspire all participants. \nOn behalf of the Organizing Committee\, I warmly invite you to register and join us for what promises to be an exciting and memorable meeting. \nWe look forward to welcoming you to Brno in 2026! \nWarm regards\,\nOn behalf of the Organizing Committee\nPetr Neugebauer
URL:https://czechsemiconductorcentre.cz/event/european-federation-of-electron-paramagnetic-resonance-efepr/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/09/Snimek-obrazovky-2025-09-18-143926.png
ORGANIZER;CN="CEITEC BUT":MAILTO:Marcela.Frybortova@ceitec.vutbr.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260831
DTEND;VALUE=DATE:20260904
DTSTAMP:20260923T210513
CREATED:20250710T115052Z
LAST-MODIFIED:20250710T115052Z
UID:1537-1788134400-1788479999@czechsemiconductorcentre.cz
SUMMARY:NFO18 – Near-Field Optics\, Nanophotonics and Related Techniques Conference
DESCRIPTION:NFO18 – the 18th International Conference on Near-Field Optics\, Nanophotonics and Related Techniques \nFollowing NFO3 in 1995\, we are honored to host this prestigious event in Brno once again. Brno is an academic and technology hub\, home to several universities (with over 80\,000 students)\, research institutes and high-tech companies. Notably\, it hosts three major electron microscope manufacturers\, whose combined output accounts for about one-third of the world’s total production. This unique position makes our city an ideal venue for discussions on the latest advances in near-field optics and other related nanophotonic domains\, including novel materials\, and nanofabrication technologies. A special attention will be given to an emerging field combining near-field optical and electron-beam techniques.  \nThe NFO Summer School preceding the conference (August 30)\, will offer hands-on workshops\, specialized tutorials\, and valuable networking opportunities  for early-career researchers. NFO18 itself will bring together specialists from academia and industry to exchange ideas and foster collaborations in a welcoming\, focused environment.  \nPlease mark your calendars and stay tuned for details. Whether you seek cutting-edge knowledge\, new partnerships\, or simply want to experience Brno’s vibrant atmosphere\, we look forward to your participation.  \nNFO18 is organised by Brno University of Technology (Faculty of Mechanical Engineering and CEITEC BUT)
URL:https://czechsemiconductorcentre.cz/event/nfo18-near-field-optics-nanophotonics-and-related-techniques-conference/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/07/Snimek-obrazovky-2025-07-10-134831.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260902T093000
DTEND;TZID=Europe/Prague:20260902T153000
DTSTAMP:20260923T210513
CREATED:20260729T124041Z
LAST-MODIFIED:20260729T124120Z
UID:2593-1788341400-1788363000@czechsemiconductorcentre.cz
SUMMARY:Inclusive Chips Forum Bratislava: Bridging Education and Industry for Diverse Talent
DESCRIPTION:How can universities\, employers and public institutions work together to open the semiconductor industry to a wider range of talent? The Inclusive Chips Forum Bratislava will bring together representatives of education\, industry and European initiatives on 2 September 2026 to share practical experience and discuss more inclusive pathways into semiconductor careers. \nThe event\, entitled Inclusive Chips Forum Bratislava: Bridging Education and Industry for Diverse Talent\, will take place at the Faculty of Electrical Engineering and Information Technology of the Slovak University of Technology in Bratislava. \nThe Czech Semiconductor Centre will be represented by Jana Drbohlavová\, Deputy Director of CSC\, who will join the panel discussion “Connecting Education and Industry to Build Diverse Semiconductor Talent”. \nBuilding stronger pathways into the semiconductor industry\nEurope’s semiconductor sector needs a growing number of skilled professionals. Meeting this demand will require not only the development of technical expertise\, but also broader access to education\, stronger cooperation between academia and employers\, and working environments in which people with different backgrounds and professional profiles can succeed. \nThe forum will explore how educational institutions and semiconductor employers can jointly attract\, develop and retain a more diverse talent pool. Discussions will focus on the role of university leadership and institutional culture\, barriers preventing people from entering semiconductor careers\, and successful approaches to connecting education with the rapidly changing needs of industry. \nDuring the afternoon panel\, Jana Drbohlavová will be joined by representatives of SEMI Europe\, the Slovak Ministry of Education\, Research\, Development and Youth\, and other participating organisations. The discussion will examine: \n\nhow diversity\, equity and inclusion initiatives can be embedded in education;\nhow universities and employers can cooperate more effectively;\nwhat prevents talented people from pursuing careers in semiconductors;\nwhich talent development models have proved successful;\nhow education can respond to the evolving requirements of the technology sector.\n\nEvent details\nEvent: Inclusive Chips Forum Bratislava: Bridging Education and Industry for Diverse Talent\nDate: 2 September 2026\nTime: 9.30 a.m.–3.30 p.m.\nVenue: Faculty of Electrical Engineering and Information Technology\, Slovak University of Technology in Bratislava\nAddress: Ilkovičova 3\, Bratislava\, Slovakia\nLanguages: Slovak and English\, with simultaneous interpretation \nParticipation is free of charge\, but prior registration is required. \nJoin the discussion in Bratislava and discover how stronger cooperation between education and industry can help Europe build a more inclusive\, skilled and resilient semiconductor workforce. \nLearn more\, view the full agenda and register on the Inclusive Chips Forum website.
URL:https://czechsemiconductorcentre.cz/event/inclusive-chips-forum-bratislava-bridging-education-and-industry-for-diverse-talent/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/Bratislava-Forum-banner.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260903T093000
DTEND;TZID=Europe/Prague:20260903T143000
DTSTAMP:20260923T210513
CREATED:20260827T090246Z
LAST-MODIFIED:20260827T090734Z
UID:2644-1788427800-1788445800@czechsemiconductorcentre.cz
SUMMARY:Industrial Property Workshop
DESCRIPTION:Protect Your Innovation: Industrial Property Workshop (not only) for Semiconductor Companies\n3 September 2026 | 9:30–14:30 | Moravian Library\, Brno \nPatents and intellectual property are a fundamental part of the semiconductor business. From chip architectures and circuit designs to manufacturing technologies\, materials\, equipment and applications\, companies need to understand not only how to protect their own innovations\, but also how to navigate existing intellectual property rights. \nLarge semiconductor companies typically have dedicated IP teams\, patent specialists and established procedures for training R&D staff. Start-ups\, SMEs and smaller technology companies face many of the same challenges – often without comparable in-house resources. For them\, a practical understanding of industrial property can therefore be particularly valuable. \nThe Moravian Library in Brno is hosting a free workshop\, Introduction to Industrial Property Rights and Databases of the Industrial Property Office of the Czech Republic\, on 3 September. Participants will receive an introduction to patents\, utility models\, industrial designs\, trade marks and other forms of industrial property protection. The programme will also include practical exercises in searching freely accessible databases of the Czech Industrial Property Office. \nThe workshop will also introduce opportunities for financial support for industrial property protection through the Innovation Vouchers scheme. The programme will be led by Hana Churáčková from the Industrial Property Office of the Czech Republic and Hana Rozkopalová from the Business and Innovation Agency. \nFor semiconductor start-ups\, SMEs\, researchers and innovators\, the workshop offers an accessible opportunity to strengthen an area that can have a direct impact on a company’s technology strategy\, competitiveness and ability to commercialise R&D results. \nParticipation is free of charge\, but capacity is limited and advance registration is required.
URL:https://czechsemiconductorcentre.cz/event/industrial-property-workshop/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/08/a571d19b-1ae4-4a6e-aea5-d44fba840903.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260917
DTSTAMP:20260923T210513
CREATED:20260729T123453Z
LAST-MODIFIED:20260729T123453Z
UID:2590-1789344000-1789603199@czechsemiconductorcentre.cz
SUMMARY:ISIG Executive Summit EU 2026
DESCRIPTION:Prague will welcome senior representatives of the global semiconductor industry on 14–16 September 2026. The ISIG Executive Summit EU will bring together decision-makers from the semiconductor\, power electronics and advanced manufacturing sectors to discuss the technologies and strategic choices shaping Europe’s industrial future. \nHeld under the theme “Chips\, Power and Machines: Powering AI and Electrifying Industry”\, the summit will connect international industry leaders\, technology experts\, investors and policymakers with Czechia’s rapidly developing semiconductor ecosystem. \nThe programme will explore some of the most important trends affecting the industry\, including Europe’s future position in the global semiconductor market\, the development of the European Chips Act\, advanced manufacturing\, artificial intelligence\, robotics and the electrification of transport and industry. \nFrom power electronics to intelligent machines\nA major focus of the event will be on the technologies enabling the next generation of electric vehicles and industrial systems. Participants will examine how 800-volt architectures and power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) can improve performance\, energy efficiency\, charging speed and reliability. \nFurther sessions will address the semiconductor requirements of humanoid robots and autonomous systems\, including edge intelligence\, real-time decision-making\, advanced sensing and energy-efficient computing. \nThe agenda will also cover: \n\nadvanced processes\, materials and testing for scalable SiC and GaN production;\nautomation and data-driven optimisation in intelligent semiconductor fabs;\nfunding opportunities for innovative and scalable semiconductor projects;\nthe future of wide-bandgap semiconductor research and development;\nthe impact of artificial intelligence and the emerging Chips Act 2.0 on the power\, automotive and industrial sectors;\nthe capabilities and future development of the Czech semiconductor industry.\n\nInternational speakers and Czech expertise\nThe summit will feature senior representatives of leading global semiconductor companies. Confirmed speakers include Thomas Morgenstern\, Executive Vice President for Manufacturing at STMicroelectronics\, and Magdalena Christine Böbel\, Executive Vice President for Integrated Circuits for Energy Systems and Head of the corresponding business division at Infineon Technologies. \nThe programme will also introduce international participants to Czechia’s semiconductor expertise\, industrial capabilities and potential for deeper integration into European and global value chains. \nAs part of the summit\, delegates will have an opportunity to visit the Hitachi Energy Semiconductors facility in Prague\, providing a first-hand look at semiconductor production and expertise based in Czechia. \nThe event is supported by CzechInvest in cooperation with the Ministry of Foreign Affairs of the Czech Republic. \nEvent details\nEvent: ISIG Executive Summit EU 2026\nDate: 14–16 September 2026\nLocation: Prague\, Czechia\nMain theme: Chips\, Power and Machines: Powering AI and Electrifying Industry\nLanguage: English \nJoin semiconductor executives\, technology leaders\, investors and policymakers in Prague and take part in the discussion about the future of chips\, power electronics\, artificial intelligence and advanced industrial manufacturing in Europe. \nRegister on the official ISIG Executive Summit EU website.
URL:https://czechsemiconductorcentre.cz/event/isig-executive-summit-eu-2026/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/ISIG_banner_1.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260914
DTEND;VALUE=DATE:20260919
DTSTAMP:20260923T210513
CREATED:20260701T134537Z
LAST-MODIFIED:20260701T134537Z
UID:2508-1789344000-1789775999@czechsemiconductorcentre.cz
SUMMARY:ECCE Europe 2026 in Valencia
DESCRIPTION:ECCE Europe is Europe’s leading conference on power electronics and energy conversion\, bringing together researchers\, industry experts\, and innovators from around the world. It will be taking place from 14 – 18 September 2026 in Valencia\, Spain. \nThe ECCE Europe 2026 conference and exhibition will take place from 14 – 18 September at the Valencia Conference Center in Valencia\, Spain. \nCommencing in 2024\, IEEE PELS is embarking on a dynamic new collaboration with the European Center for Power Electronics (ECPE) for the PELS flagship conference\, now titled IEEE ECCE Europe. United\, IEEE PELS and ECPE are on the brink of unprecedented opportunities in Europe: nurturing innovation\, facilitating the exchange of knowledge\, and catalyzing transformative breakthroughs in the realm of global power electronics. IEEE PELS and ECPE are inviting the Power Electronics community from academia and industry in Europe to follow us in shaping the new ECCE Europe Conference. \nConference Highlights: \n\nCutting-edge Research Presentations\nKeynote Speakers & Industry Experts\nIndustry Sessions\nDiverse Technical Tracks\nWorkshops and Tutorials\nNetworking Opportunities\nStudent Job Fairs
URL:https://czechsemiconductorcentre.cz/event/ecce-europe-2026-in-valencia/
LOCATION:Valencia\, Valencia\, Spain
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/x.webp
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260921
DTEND;VALUE=DATE:20260923
DTSTAMP:20260923T210513
CREATED:20260520T090952Z
LAST-MODIFIED:20260520T090952Z
UID:2356-1789948800-1790121599@czechsemiconductorcentre.cz
SUMMARY:FD-SOI ICs Design Opportunities Short Course
DESCRIPTION:The FAMES Pilot Line informs that pre-registrations is still open for the FD-SOI ICs Design Opportunities Short Course. taking place in: \nDate: 21–22 September 2026\nGrenoble\, France \nThis one-and-a-half-day training\, provided by FD-SOI experts\, will provide a comprehensive overview of FD-SOI technology and advanced design methodologies for digital\, analog\, RF and power management circuits. It is aimed for engineers\, researchers and technologists interested in leveraging FD-SOI for next-generation integrated circuits. \nThe program also includes technical tutorials\, networking opportunities and an immersive clean-room visit at CEA-Leti. \nConsult the full program and pre-register here: https://fames-pilot-line.eu/fd-soi-ics-design-opportunities-short-course/. \n⚠️This is a paid event with limited capacity.
URL:https://czechsemiconductorcentre.cz/event/fd-soi-ics-design-opportunities-short-course/
LOCATION:Grenoble\, Grenoble\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/FD-SOI_ics_Grenoble.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260925
DTEND;VALUE=DATE:20260926
DTSTAMP:20260923T210513
CREATED:20260806T072731Z
LAST-MODIFIED:20260806T072731Z
UID:2640-1790294400-1790380799@czechsemiconductorcentre.cz
SUMMARY:ChipQuest Challenge 2026
DESCRIPTION:Can you explain how semiconductors shape our everyday lives in a way that inspires the next generation? \nThe ChipQuest Challenge invites students from primary school through to PhD level to create an engaging two-to-five-minute video introducing the fascinating world of semiconductors to school pupils. \nUse experiments\, animations\, drawings\, demonstrations or creative storytelling to make complex technology easy to understand. Show where chips can be found\, explain why they matter and share the ideas that could spark a young person’s interest in science and engineering. \nWhat could you win?\nSuccessful participants can receive: \n\na technology product of their choice worth up to €1\,000;\nan exclusive behind-the-scenes tour of a semiconductor company;\na one-to-one mentoring session with an industry expert;\na four-day ticket to SEMICON Europa 2026.\n\nWhether you are taking your first steps in science or already conducting advanced research\, this is your opportunity to demonstrate your creativity\, communication skills and passion for technology. \nSubmit your video by 25 September 2026 and help inspire the semiconductor innovators of tomorrow. \nReady to take on the challenge?\nDiscover the competition details and submit your entry on the ChipQuest website.
URL:https://czechsemiconductorcentre.cz/event/chipquest-challenge-2026/
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260930
DTEND;VALUE=DATE:20261002
DTSTAMP:20260923T210513
CREATED:20260619T081449Z
LAST-MODIFIED:20260619T081659Z
UID:2482-1790726400-1790899199@czechsemiconductorcentre.cz
SUMMARY:FIRST by FMD
DESCRIPTION:FIRST – Fast Innovation through Research in Semiconductor Technologies\nThe European conference on microelectronic trends\, roadmaps and strategic alignment \n\n  \n\nFIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience\, technological sovereignty\, security\, and sustainable growth. With initiatives such as the EU Chips Act and Germany’s Hightech Agenda\, the strategic importance of European microelectronics is greater than ever. \nFIRST – Fast Innovation through Research in Semiconductor Technologies – brings together decision-makers from industry\, policy and research. With a clearly curated program\, FIRST provides strategic insights into emerging technologies\, industrial roadmaps and future infrastructure developments. \nAt FIRST\, leaders from across the semiconductor value chain engage with representatives from key application sectors including AI\, automotive\, healthcare\, industrial manufacturing\, telecommunications and energy. For those driving innovation\, product strategies or technology roadmaps\, this is where Europe’s semiconductor future becomes business reality. \nProgram highlights at FIRST 2026\n\nGain early insights into emerging technology and market trends\nUnlock strategic partnerships across the full value chain\nStrengthen your innovation-to-market capabilities\nExpand your network with Europe’s key semiconductor decision-makers\n\nA further strategic focus is the APECS pilot line\, implemented by the Research Fab Microelectronics Germany (FMD). It provides an industry-oriented environment for advanced packaging and design as key enabling technologies for chiplet architectures and heterogeneous integration\, strengthening innovation across the European value chain.
URL:https://czechsemiconductorcentre.cz/event/first-by-fmd/
LOCATION:Berlin\, Berlin\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Eventankuendigung-FHG-web.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261001
DTEND;VALUE=DATE:20261003
DTSTAMP:20260923T210513
CREATED:20260902T090530Z
LAST-MODIFIED:20260902T090600Z
UID:2667-1790812800-1790985599@czechsemiconductorcentre.cz
SUMMARY:Micro & Nano Event 2026
DESCRIPTION:Are you active in the fields of micro- and nanotechnology\, advanced materials\, or precision engineering\, and looking for new business or technology partners? Join the international matchmaking event Micro & Nano Event 2026\, which will take place on October 1–2 in Besançon\, France.\nMicro & Nano Event 2026 will bring together European small and medium-sized enterprises\, startups\, clusters\, associations\, and research organizations active in the fields of micro- and nanotechnology and other high-tech sectors. The event will take place as part of the Micronora international trade fair\, which focuses on microtechnology\, precision engineering\, and nanotechnology. \nThe main component of the program will be pre-arranged B2B meetings\, which will allow participants to actively seek out new business and technology partners\, suppliers\, or partners for research collaboration. Companies will also have the opportunity to showcase their technologies\, expertise\, and services to international participants. \nPresent your company during the pitch session\nCzech startups and innovative small and medium-sized enterprises can also actively sign up to give their own pitch and present their products\, technologies\, or innovative solutions to an international audience during the event. The pitch session will take place on October 2 and will offer another opportunity to raise the company’s profile and establish contacts with potential international partners. \nRegistration for your own pitch takes place via the Micro & Nano Event 2026 platform. \nWho is this event intended for?\n\nsmall and medium-sized enterprises (SMEs)\,\nstartups\,\nclusters and associations\,\nresearch organizations\, laboratories\, and technology centers.\n\nIt is suitable for organizations that want to showcase their offerings\, technologies\, expertise\, and services\, as well as for those seeking new technologies\, suppliers\, experts\, or partners for business\, technological\, or research collaboration. \nWhat areas does the event focus on?\nThe main technological topics include: \n\nmicro- and nanosystems —intelligent systems\, sensors\, actuators\, and motors; micro- and nanocomponents; and embedded and interconnected systems\,\nmaterials and surface treatments – new and lightweight materials\, surface treatments\, smart\, flexible\, conductive\, or biocompatible materials\,\nmanufacturing technologies and processes – micro- and nanomanufacturing\, micromechatronics\, microelectronics\, 3D printing and additive manufacturing\, micro- and nanorobotics\, assembly or laser technologies\,\ndigitization – artificial intelligence\, computer vision\, non-destructive testing and inspection\, software and algorithms\, virtual and augmented reality\, and the Internet of Things\,\nElectronics and Optics.\n\nThe Enterprise Europe Network will be available to you on-site\nAn Enterprise Europe Network consultant from the Czech Republic will also be attending the event\, and Czech companies can approach him directly during the event. He will help them\, for example\, navigate the matchmaking process\, find relevant international partners\, or explore opportunities for further international collaboration. \nAmong other things\, the Enterprise Europe Network helps companies find business and research partners and organizes brokerage and matchmaking events aimed at fostering cross-border partnerships. \nEnterprise Europe Network Program\nOctober 1\, 2026\n\nin-person B2B meetings\,\nnetworking event.\n\nOctober 2\, 2026\n\na pitch session for startups and innovative companies with the option to actively register\,\ninformation on European instruments to support innovation\,\na discussion on technological calls\,\nIn-person B2B meetings.\n\nPractical Information\nWhere: Parc des Expositions de Besançon\, Besançon\, France\nTicket price: 100 EUR (for clients with discount code: EEN-CLIENT-MNE 2026)\n– includes admission to the Micronora trade show; Enterprise Europe Network matchmaking at the trade fair is free of charge. \nOn the event platform\, you can view the list of registered participants in advance and select the organizations you’d like to meet during the matchmaking sessions. \nProposed Route\n\nflight from Prague to Paris-Orly\,\nsubway / transfer from Orly Airport → Gare de Lyon\,\nTGV train from Gare de Lyon → Besançon (about 2 hours).\n\nSource: https://een.gov.cz/en/kalendar-akci/micro-nano-event-2026/ \nRegistration here: https://www.b2match.com/e/micro-nano-event-2026/sign-up/create-account
URL:https://czechsemiconductorcentre.cz/event/micro-nano-event-2026/
LOCATION:Besançon\, Besançon\, France
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/09/Snimek-obrazovky-2026-09-02-110312.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261007
DTEND;VALUE=DATE:20261010
DTSTAMP:20260923T210513
CREATED:20260409T065725Z
LAST-MODIFIED:20260409T065928Z
UID:2196-1791331200-1791590399@czechsemiconductorcentre.cz
SUMMARY:ASDAM (Advanced Semiconductor Devices and Microsystems)
DESCRIPTION:𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝙞𝙨 𝙘𝙤𝙢𝙞𝙣𝙜 𝙩𝙤 𝘽𝙧𝙖𝙩𝙞𝙨𝙡𝙖𝙫𝙖.\nThe 𝟭𝟲𝘁𝗵 𝗜𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 on 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗮𝗻𝗱 𝗠𝗶𝗰𝗿𝗼𝘀𝘆𝘀𝘁𝗲𝗺𝘀 will take place on 𝟳–𝟵 𝗢𝗰𝘁𝗼𝗯𝗲𝗿 𝟮𝟬𝟮𝟲 𝗮𝘁 𝘁𝗵𝗲 𝗥𝗮𝗱𝗶𝘀𝘀𝗼𝗻 𝗕𝗹𝘂 𝗖𝗮𝗿𝗹𝘁𝗼𝗻 𝗛𝗼𝘁𝗲𝗹 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮\, 𝗦𝗹𝗼𝘃𝗮𝗸𝗶𝗮. \nThe conference is 𝗳𝗼𝗰𝘂𝘀𝗲𝗱 𝗼𝗻 the latest research and development in semiconductor devices\, microsystems\, materials\, and related technologies. Its scope includes topics such as WBG and UWBG materials\, semiconductor structures and devices\, characterization and modelling\, sensors and microsystems\, photonics\, IC design\, packaging technologies\, and AI in electronics. \n𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝘄𝗶𝗹𝗹 𝗯𝗿𝗶𝗻𝗴 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 researchers\, scientists\, university experts\, doctoral candidates\, and industry 𝗽𝗿𝗼𝗳𝗲𝘀𝘀𝗶𝗼𝗻𝗮𝗹𝘀 𝗳𝗿𝗼𝗺 𝗮𝗹𝗹 𝗼𝘃𝗲𝗿 𝘁𝗵𝗲 𝘄𝗼𝗿𝗹𝗱. Giving participants an opportunity 𝘁𝗼 𝗽𝗿𝗲𝘀𝗲𝗻𝘁 𝘁𝗵𝗲𝗶𝗿 𝘄𝗼𝗿𝗸 𝘄𝗶𝘁𝗵𝗶𝗻 𝗮 𝗿𝗲𝘀𝗽𝗲𝗰𝘁𝗲𝗱 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗳𝗼𝗿𝘂𝗺. Its 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝘀𝗰𝗶𝗲𝗻𝘁𝗶𝗳𝗶𝗰 𝗰𝗼𝗺𝗺𝗶𝘁𝘁𝗲𝗲 includes 𝗲𝘅𝗽𝗲𝗿𝘁𝘀 from leading institutions in multiple countries\, and the proceedings will be published by the 𝗜𝗘𝗘𝗘 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗦𝗼𝗰𝗶𝗲𝘁𝘆. \n𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀 𝗶𝘀 𝗻𝗼𝘄 𝗼𝗽𝗲𝗻. 𝗬𝗼𝘂 𝗰𝗮𝗻 𝗳𝗶𝗻𝗱 𝗮𝗹𝗹 𝘁𝗵𝗲 𝗶𝗻𝗳𝗼𝗿𝗺𝗮𝘁𝗶𝗼𝗻 𝗼𝗻 𝗔𝗦𝗗𝗔𝗠 𝘄𝗲𝗯𝗽𝗮𝗴𝗲: 𝘄𝘄𝘄.𝗮𝘀𝗱𝗮𝗺.𝘀𝗸 \n𝗔𝗯𝘀𝘁𝗿𝗮𝗰𝘁 𝘀𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝘀𝘁𝗮𝗿𝘁𝗲𝗱 𝗼𝗻 𝟭 𝗔𝗽𝗿𝗶𝗹 𝟮𝟬𝟮𝟲\, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝗱𝗲𝗮𝗱𝗹𝗶𝗻𝗲 𝗳𝗼𝗿 𝗮𝗯𝘀𝘁𝗿𝗮𝗰𝘁𝘀 𝗶𝘀 𝟭 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲. \n𝗪𝗲 𝗶𝗻𝘃𝗶𝘁𝗲 researchers\, scientists\, doctoral candidates\, and experts from academia working in semiconductor devices\, microsystems\, materials\, photonics\, sensors\, modelling\, packaging\, IC design\, and related fields to submit their abstracts and become part of ASDAM 2026. \n𝗝𝗼𝗶𝗻 𝘂𝘀 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮 𝗮𝗻𝗱 𝘀𝗵𝗮𝗿𝗲 𝘆𝗼𝘂𝗿 𝗿𝗲𝘀𝗲𝗮𝗿𝗰𝗵 with an international community shaping the future of semiconductors and microsystems.
URL:https://czechsemiconductorcentre.cz/event/asdam-advanced-semiconductor-devices-and-microsystems/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261012T130000
DTEND;TZID=Europe/Prague:20261012T160000
DTSTAMP:20260923T210513
CREATED:20260922T073921Z
LAST-MODIFIED:20260923T070405Z
UID:2727-1791810000-1791820800@czechsemiconductorcentre.cz
SUMMARY:Your Gateway to European Semiconductor Technologies: CCCs\, Pilot Lines & EuroCDP
DESCRIPTION:This joint webinar brings together three national semiconductor competence centres — Czech Semiconductor Centre\, SK Chips and CC Chip.si — with key European semiconductor infrastructure: the European Chips Design Platform (EuroCDP) and the PIXEurope and NanoIC Pilot Lines. \nParticipants will gain a practical overview of the services available to companies\, startups\, SMEs\, researchers and other innovators across Europe. The session will introduce opportunities in chip design\, access to advanced technologies and pilot-line infrastructure\, design tools\, IP libraries and PDKs\, as well as training and technical support. Speakers will also explain how users can access these services and how the competence centres can help them navigate the European semiconductor ecosystem and identify the most suitable support for their projects. \nThe webinar will conclude with an open discussion and Q&A\, providing participants with an opportunity to discuss their needs directly with representatives of the competence centres\, EuroCDP and the Pilot Lines. \nThis webinar is free of charge. Registration open here. \nWebinar Programme (13:00–16:00 CET)\n\n13:00–13:05 | Welcome and Introduction (5 min)\nSpeaker: Petr Kamenický\, Director of the CSC\nWelcome\, webinar objectives and introduction of the speakers.\n\n13:05–13:15 | CSC Services at a Glance (10 min)\nSpeaker: Jana Drbohlavová\, Deputy Director of the CSC\nRole of the CSC\, its main services and areas of expertise.\n\n13:15–13:25 | SK Chips Services at a Glance (10 min)\nSpeaker: Martin Jagelka\, Head of Partnerships\nRole of SK Chips\, its main services and areas of expertise.\n\n13:25–13:35 | CC Chip.si Services at a Glance (10 min)\nSpeaker: Jurij Podržaj\nRole of CC Chip.si\, its main services and areas of expertise.\n\n13:35–14:05 | Introduction to PIXEurope (30 min)\nSpeaker: Marina Santana\nMain technologies\, available services\, target users\, access mechanisms and examples of potential applications.\n\n14:05–14:35 | Introduction to NanoIC (30 min)\nSpeaker: Giuseppe Fiorentino\nMain technologies\, available services\, target users\, access mechanisms and examples of potential applications.\n\n14:35–15:05 | Introduction to the European Chips Design Platform (EuroCDP) (30 min)\nSpeaker: Romano Hoofman\nDesign tools\, IP libraries\, process design kits (PDKs)\, training\, technical support\, and access to Pilot Lines\, foundries\, packaging and testing services.\n\n15:05–16:00 | Open Discussion\, Questions & Networking Session (55 min)\nModerated discussion with all speakers\, questions from participants\, exchange of experiences and networking opportunities.\n\n16:00 | Closing Remarks\nSpeaker: CSC representative\nSummary of key points\, next steps and relevant contact information.
URL:https://czechsemiconductorcentre.cz/event/your-gateway-to-european-semiconductor-technologies-cccs-pilot-lines-eurocdp/
LOCATION:on-line on Teams
CATEGORIES:Organized by CSC
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END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261014T093000
DTEND;TZID=Europe/Prague:20261014T110000
DTSTAMP:20260923T210513
CREATED:20260922T072048Z
LAST-MODIFIED:20260922T072128Z
UID:2724-1791970200-1791975600@czechsemiconductorcentre.cz
SUMMARY:SME Feedback Workshop on the Chips Act 2.0
DESCRIPTION:The European Commission is preparing the Chips Act 2.0\, a measure aimed at strengthening the European semiconductor ecosystem\, increasing its competitiveness and resilience\, and supporting the entire value chain. Small and medium-sized enterprises and other stakeholders in the semiconductor and electronics sectors can share their comments on the proposal during an online workshop on October 14\, 2026\, or in writing.\nThe Chips Act 2.0 is a proposal by the European Commission aimed at strengthening the European semiconductor ecosystem\, increasing its resilience and competitiveness\, and supporting the entire value chain. The proposal also aims to improve conditions for European companies and facilitate their access to support tools and infrastructure. \nCompanies can influence the form of the measures being prepared\nTo ensure that the Chips Act reflects the real needs of companies in the ecosystem\, the Enterprise Europe Network\, in collaboration with the European Commission\, is organizing an event titled “SME Feedback Workshop on the Chips Act 2.0.” \nDuring the workshop\, participants will learn about the proposal and will have the opportunity to share their experiences\, needs\, and feedback directly with representatives of the European Commission. \nThe discussion will cover topics such as: \n\nthe role of SMEs in the European semiconductor and electronics ecosystem\,\naccess to support tools\, pilot lines\, infrastructure\, centers of excellence\, and EU programs\,\nany administrative burdens and barriers to accessing support\,\nthe involvement of various stakeholders across the value chain\,\nspecific recommendations for the next steps in the legislative process.\n\n\nWho is this workshop intended for?\nThe workshop is particularly relevant for small and medium-sized enterprises operating in the fields of semiconductors\, microelectronics\, and electronics. Participating companies may include\, for example\, those involved in the manufacture and supply of semiconductors\, chip development\, electronic components\, manufacturing equipment\, testing\, and packaging\, as well as other players in the European semiconductor and electronics value chain. \nThe event will take place online on October 14\, 2026\, from 9:30 a.m. to 11:00 a.m.\, and the program will be conducted in English. Participation is free\, but prior registration is required. \nCompanies can also share feedback in writing\nCompanies do not have to provide their feedback only during the workshop. They can also submit their experiences\, needs\, and comments on the Chips Act 2.0 proposal in writing through the Enterprise Europe Network. \nIs your company dealing with issues related to support availability\, infrastructure\, pilot lines\, administrative requirements\, or other obstacles in the semiconductor industry? \nWe would appreciate it if you would send us your suggestions. We will help you prepare and draft your feedback\, which we will forward to the relevant organizations.
URL:https://czechsemiconductorcentre.cz/event/sme-feedback-workshop-on-the-chips-act-2-0/
LOCATION:on-line
CATEGORIES:External Event
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END:VCALENDAR