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DTSTART;VALUE=DATE:20260608
DTEND;VALUE=DATE:20260613
DTSTAMP:20260924T001033
CREATED:20260324T125511Z
LAST-MODIFIED:20260324T125721Z
UID:2162-1780876800-1781308799@czechsemiconductorcentre.cz
SUMMARY:RISC-V Summit Europe
DESCRIPTION:Join us at the RISC-V Summit Europe 2026\, the leading European event dedicated to the open standard RISC-V architecture and its rapidly evolving ecosystem. \nTaking place in Bologna\, Italy\, from 8–12 June 2026\, the summit brings together key stakeholders from industry\, academia\, research\, and government to explore the future of computing and innovation built on RISC-V. \nThe programme will feature: \n\nInspiring keynotes and technical sessions\nPanels\, tutorials\, and workshops\nIndustry exhibitions\, demos\, and poster sessions\nExtensive networking opportunities with leaders across semiconductors\, AI\, embedded systems\, HPC\, and beyond\n\nRISC-V\, as an open and flexible instruction set architecture\, is enabling new applications and research that are shaping the future of computing in Europe and globally. \nThe summit offers a unique platform to exchange knowledge\, showcase innovations\, and strengthen collaboration across the European and global RISC-V community. \n📍 Location: Bologna Congress Center\, Italy📅 Dates: 8–12 June 2026🔗 Learn more and register: RISC-V Summit Europe 2026 website
URL:https://czechsemiconductorcentre.cz/event/risc-v-summit-europe-2/
LOCATION:Bologna\, Bologna\, Italy
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-24-135153.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260604
DTEND;VALUE=DATE:20260606
DTSTAMP:20260924T001033
CREATED:20260521T081219Z
LAST-MODIFIED:20260521T081247Z
UID:2373-1780531200-1780703999@czechsemiconductorcentre.cz
SUMMARY:European Semiconductor Collaborations Days
DESCRIPTION:Chips Without Borders will bring together key stakeholders from across the European semiconductor ecosystem\, including industry leaders\, SMEs\, research organizations\, and policy representatives. The program is designed to foster collaboration\, showcase innovation\, and strengthen international partnerships. \nHungarian SMEs\, industrial stakeholders\, and the HCHiP consortium itself will present their profiles\, ideas\, and international collaboration opportunities. This event also provides an opportunity for CCCs and our other European partners to present themselves\, their profiles\, and the areas in which they are seeking partners through posters and presentations. \nMore informations: https://hchip.hu/en/2026/04/15/european-semiconductor-collaboration-days-2/ \nEuropean Semiconductor Collaboration Day\, taking place on 4–5 June 2026 in Budapest\, Hungary. “Chips Without Borders” will bring together key stakeholders from across the European semiconductor ecosystem\, including industry leaders\, SMEs\, research organizations\, and policy representatives. The program is designed to foster collaboration\, showcase innovation\, and strengthen international partnerships. Venue: Novotel Budapest Danube (Budapest\, Bem rakpart 33-34\, 1027) The participation is free\, but it requires registration. \nRegister here: https://lnkd.in/dB2mS2kG \nFor questions\, please contact us at: hchip@hchip.hu
URL:https://czechsemiconductorcentre.cz/event/european-semiconductor-collaborations-days/
LOCATION:Budapest\, Budapest\, Hungary
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1778062652574-Hchip_European_Semiconductor_Collaboration_Days_cover.webp
ORGANIZER;CN="Hchip":MAILTO:hchip@hchip.hu
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260604
DTEND;VALUE=DATE:20260605
DTSTAMP:20260924T001033
CREATED:20260520T091830Z
LAST-MODIFIED:20260520T091902Z
UID:2361-1780531200-1780617599@czechsemiconductorcentre.cz
SUMMARY:Forming\, storming\, norming and performing of European Semiconductor startups meetup
DESCRIPTION:EuroCDP and Silicon Catalyst.EU (via Malta Semiconductor Competence Centre) are co‑hosting the EU Semiconductor FSNP Meetup – targeted working day bringing together semiconductor startups\, VCs\, corporates\, and ecosystem leaders. \nWelcome to forming\, storming\, norming and performing of European semiconductor startups. This is a curated afternoon and evening event\, focusing exclusively on semiconductor startups and investors. The beautiful chateau location has been carefully chosen for easy access from Bordeaux station and airport for your same day arrival from anywhere in Europe. You will enjoy high-value conversations without the noise of broader tech events as the sun sets over the vineyards of the most hallowed wine growing soil in the world. \n​We have a packed agenda of investor insights\, funding discussions\, fast-paced startup pitch sessions and a deep insight into the geopolitical semiconductor dynamics challenging Europe’s chip ecosystem. \nDesigned for founders\, VCs\, and ecosystem leaders\, the day aims to spark meaningful connections and knowledge sharing. \nThe day closes by enjoying the finest wines in the world at our Bordeaux wine tasting social event led by one of the region’s top female sommeliers. \n​The event is free and dedicated to startup founders\, investors and ecosystem leaders. \nRegistration here.
URL:https://czechsemiconductorcentre.cz/event/forming-storming-norming-and-performing-of-european-semiconductor-startups-meetup/
LOCATION:Château de Seguin\, 3 Chem. du Bon Coin\, Lignan-de-Bordeaux\, 33360\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1778664931554.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260603
DTEND;VALUE=DATE:20260604
DTSTAMP:20260924T001033
CREATED:20260408T074732Z
LAST-MODIFIED:20260408T074732Z
UID:2188-1780444800-1780531199@czechsemiconductorcentre.cz
SUMMARY:SEMI Europe Policy Forum 2026
DESCRIPTION:Join leading policymakers\, industry executives and technology experts at the SEMI Europe Policy Forum 2026\, a high-level gathering dedicated to shaping the future of Europe’s semiconductor ecosystem. \nIn an era defined by rapid geopolitical shifts and technological transformation\, Europe faces both unprecedented challenges and unique opportunities. This year’s forum will explore how Europe can strengthen its strategic position\, enhance supply chain resilience\, and secure long-term economic competitiveness in the global semiconductor landscape. \n\nWhy Attend?\nThe SEMI Europe Policy Forum brings together key stakeholders from across the semiconductor value chain and public sector to: \n\nExamine the impact of global geopolitical dynamics on Europe’s technology leadership\nDiscuss the next phase of the European Chips Act and its role in securing Europe’s tech future\nAddress sustainability and competitiveness challenges across the industry\nExplore strategies for building a skilled workforce for the future\nFoster international collaboration and strategic partnerships\n\n\nWho Should Attend?\nThis forum is designed for decision-makers and influencers\, including: \n\nEU and national policymakers\, public sector leaders and diplomatic representatives\nSenior executives and industry leaders from semiconductor and technology companies\nR&D professionals\, innovation leaders and supply chain stakeholders\nRepresentatives from academia\, research institutions and think tanks\n\n\nProgramme Highlights\nParticipants can look forward to a full-day programme featuring: \n\nHigh-level keynote sessions and panel discussions\nExpert insights on policy\, innovation and competitiveness\nNetworking opportunities with European and global leaders\nEvening reception and networking dinner\n\nKey topics include Europe’s tech sovereignty\, workforce development\, sustainability challenges\, and global partnerships shaping the future of semiconductors. \n\nBe Part of the Conversation\nAs Europe navigates a rapidly evolving global landscape\, collaboration between industry and policymakers has never been more critical. The SEMI Europe Policy Forum offers a unique platform to exchange ideas\, influence policy direction\, and contribute to a resilient and competitive European semiconductor ecosystem. \n👉 Register now
URL:https://czechsemiconductorcentre.cz/event/semi-europe-policy-forum-2026/
LOCATION:Brussels\, Brussels\, Belgium
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/04/SEPF_360x317px.png.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260522T130000
DTEND;TZID=Europe/Prague:20260522T170000
DTSTAMP:20260924T001033
CREATED:20260520T092202Z
LAST-MODIFIED:20260520T092309Z
UID:2367-1779454800-1779469200@czechsemiconductorcentre.cz
SUMMARY:NanoIC Webinar
DESCRIPTION:Join this online webinar to discover the NanoIC Pilot Line and its cutting-edge technologies for next-generation semiconductor innovation. The session will include an introduction to the pilot line\, presentations on advanced logic\, novel embedded memories\, and advanced interconnect technologies\, as well as information on how to access the pilot line and upcoming training and workforce development opportunities. \nPreliminary Agenda \n\nNanoIC Pilot Line: Introduction\nGiuseppe Fiorentino\nNanoIC Technologies\n\nAdvanced Logic – Yasser Sherazi\nNovel Embedded Memories – Marie Garcia Bardon\nAdvanced Interconnect – Nicolas Pantano\n\n\nAccess to the Pilot Line\nNina Bazzazian\nTraining and Workforce Development\nRuxandra Marina Florea\n\nRead more about NanoIC: https://www.nanoic-project.eu/en \nRegistration here.
URL:https://czechsemiconductorcentre.cz/event/nanoic-webinar/
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/1778582712459.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260521
DTEND;VALUE=DATE:20260522
DTSTAMP:20260924T001033
CREATED:20260504T074829Z
LAST-MODIFIED:20260525T075119Z
UID:2252-1779321600-1779407999@czechsemiconductorcentre.cz
SUMMARY:Verification Academy Live Brno
DESCRIPTION:Verification Academy Live Brno brings together engineers and researchers from industry and academia to examine advances in functional verification. The program covers the Questa One toolchain\, AI-assisted verification workflows\, and stimulus-free approaches that combine static and formal analysis to uncover issues earlier and more efficiently. \nDYNANIC is co-organizing this event and contributing three sessions to the program  including a technical presentation\, a research-grounded overview\, and a panel discussion. \n\n\n\n\n\n\n\n\nThe seminar also addresses how verification IP continues to evolve to address increasing design complexity\, improve coverage quality\, and reduce overall project risk. Topics directly relevant to FPGA-based system development. \nGet more information & registration here: https://dyna-nic.com/dynanic-at-verification-academy-live/ 
URL:https://czechsemiconductorcentre.cz/event/where-verification-methodology-meets-real-world-practice/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/05/DYNANIC-preview-general.webp
ORGANIZER;CN="DynaNIC":MAILTO:info@dyna-nic.com
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260521
DTEND;VALUE=DATE:20260522
DTSTAMP:20260924T001033
CREATED:20260320T091517Z
LAST-MODIFIED:20260320T091517Z
UID:2152-1779321600-1779407999@czechsemiconductorcentre.cz
SUMMARY:PIXEurope Connect
DESCRIPTION:Join PIXEurope Connect – Industry Ecosystem Building Day\, taking place on 21 May 2026 in Barcelona. \nOrganized within the framework of the PIXEurope Pilot Line – coordinated by ICFO and co-funded by the Chips Joint Undertaking and participating Member States\, with support from regional authorities – this event will be the first to bring together end-users\, technology providers\, industry leaders and policymakers around this Pan-European initiative. \nThe event will highlight the value of the PIXEurope infrastructure and its role in strengthening Europe’s integrated photonics ecosystem. Through presentations and collaborative sessions\, participants will explore how the Pilot Line can accelerate the adoption of integrated photonic chips\, reinforcing Europe’s technological sovereignty and fostering new industrial and scientific opportunities. \nThe venue of the event will be Torre Glòries\, one of Barcelona’s most iconic landmarks. Located at the entrance to the 22@ innovation district – an ideal setting for PIXEurope’s mission to bridge the gap between research and industrial readiness in advanced photonic integrated circuits.
URL:https://czechsemiconductorcentre.cz/event/pixeurope-connect/
LOCATION:Barcelona\, Barcelona\, Spain
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-20-101451.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260518
DTEND;VALUE=DATE:20260521
DTSTAMP:20260924T001033
CREATED:20260311T113719Z
LAST-MODIFIED:20260520T092505Z
UID:2102-1779062400-1779321599@czechsemiconductorcentre.cz
SUMMARY:Czech Semicon Days 2026
DESCRIPTION:Join us at Czech Semicon Days 2026\, one of the key events for the semiconductor sector in Central Europe. \nFrom 18–20 May 2026 in Prague\, industry leaders\, researchers\, investors and policymakers will come together to discuss the future of semiconductors and their role in next-generation mobility\, autonomous systems and electrification. \nThe programme will feature expert discussions\, networking opportunities and specialised events connecting companies across the semiconductor value chain and strengthening the Czech and European semiconductor ecosystem. \nWe are also pleased to highlight that the Czech Semiconductor Centre will be presenting at the event\, showcasing its role in the European network of competence centres and its activities supporting research\, innovation and collaboration between industry and academia in chip technologies. \nThe programme of Czech Semicon Days 2026 will begin on 18–19 May in Prague\, bringing together industry leaders\, policymakers\, investors and researchers to discuss the future of semiconductors and their role in next-generation mobility. The first day at Bohemia Pavilion\, Výstaviště Prague will feature specialised ecosystem events such as Supplier Day\, focused on strengthening connections across the semiconductor supply chain\, followed by the Czech Semiconductor Ecosystem Development Day\, dedicated to advancing the national semiconductor ecosystem and improving regional readiness to attract new industry investments. On 19 May\, the main conference Czech Investment Forum: Semiconductors for Future Mobility will take place in the historic Fantova Building at Prague’s main railway station\, with keynote speeches\, expert presentations and panel discussions on industry–academia collaboration\, semiconductor innovation hubs and resilient European semiconductor ecosystems. \nThe programme will then continue on 20 May in Brno at the Advanced Chip Design Research Center (ACDRC)\, where participants will gain direct insight into advanced research and collaboration opportunities in semiconductor design and innovation. This will be followed by additional accompanying events and networking activities throughout the week\, providing further opportunities for industry partners\, researchers and policymakers to deepen collaboration\, explore investment opportunities and strengthen the Czech Republic’s role within the European semiconductor value chain. \nCzech Semicon Days provide a unique opportunity to:\n• meet key stakeholders in the European semiconductor ecosystem\n• explore collaboration opportunities across industry and research\n• discuss investment and technology trends shaping the future of semiconductors \n📍 Prague\, Czech Republic\n📅 18–20 May 2026 \nMore information: https://czechsemicondays.com/
URL:https://czechsemiconductorcentre.cz/event/czech-semicon-days-2026/
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/ChatGPT-Image-11.-3.-2026-12_46_34.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260513T110000
DTEND;TZID=Europe/Prague:20260513T170000
DTSTAMP:20260924T001033
CREATED:20260507T075412Z
LAST-MODIFIED:20260507T075412Z
UID:2263-1778670000-1778691600@czechsemiconductorcentre.cz
SUMMARY:Invitation to the Webinar#4 ALL2GaN Insights: Driving Greener Power Electronics
DESCRIPTION:ALL2GaN Insights: Driving Greener Power Electronics – The Wednesday Webinar Series \nWebinar#4 : 13.05.2026 at 11 a.m. \nNovelties in HV GaN power devices from ALL2GaN \nPresenters: Gianmauro POZZOVIVO (Infineon Technologies Austria AG)\, Elison MATIOLI (EPFL)\, Iordan DOYTCHINOV (Corintis) \nThe webinar hosts three participants who cooperate very strictly in the ALL2GaN project. \nStarting with Gianmauro\, he will present the development and industrialization of 650 V GaN-on-Si power technology on 200 mm wafers\, covering advances in epitaxy\, device processes\, and manufacturing readiness. It highlights the enablement of large-scale production of normally-off lateral GaN HEMTs\, the qualification of lead products for industrial market release\, and briefly outlines future directions toward integrated GaN solutions. \n\n\n\nJoin from the meeting link\n\n\nhttps://infineon.webex.com/infineon/j.php?MTID=m812b4bc8d4194bbbba4041d1eaa50219\n\n\n\n\n\n\n\nJoin by meeting number\n\n\nMeeting number (access code): 2780 340 0314\n\n\nMeeting password: X3gZ5pgGgq2\n\n\n\nAbout the Speakers : \n\n\n\n\n\nName / Surname\nGianmauro POZZOVIVO\nElison MATIOLI\nIordan DOYTCHINOV\n\n\nOrganisation / University\nInfineon Technologies Austria AG\nEPFL\nCorintis SA\n\n\nTitle in the Organisation\nDirector\nProfessor and Director of the POWERlab\nSenior Program Manager\n\n\nRole in ALL2GaN Project\nIn the All2GaN project\, I contribute to WP2 by developing and industrializing best‑in‑class 650V lateral GaN technology (advanced epitaxy and device processing) and advancing integrated high‑voltage GaN solutions through monolithic power ICs and system‑in‑package approaches\, targeting production readiness and market release.\nPartner in Task 2\, O2.3: Breaking the limits: Realizing most advanced GaN HEMT device and integration concepts\nSenior Program Manager responsible for leading Corintis contribution on demonstrating value of topology optimized cooling for future high power (data center applications) GaN modules.\n\n\nAcademic Background\nPhD in Electrotechnics from TU Vienna (2010)\, focused on optimizing GaN HEMTs. Joined Infineon Austria in 2010 as an early GaN technology development engineer\, working on FEOL development plus wafer- and package-level characterization. From 2015–2020\, I managed the development of the first-generation normally-off high-voltage GaN power devices\, launched as CoolGaN in 2021. Today\, I lead High Voltage GaN Technology Development\, managing a team of 20 engineers.\nGaN power devices\nPhD in Precision Engineering (Cranfield University)\, EPFL; background as Principle Investigator on AI research related to drone GPS free navigation systems\, Corintis related scientific contributions in the area of co-packaged and designed cooling.\n\n\nWhat excites you about the project?\nALL2GaN excites me because it’s about speeding up real GaN adoption\, giving engineers practical tools and support to integrate GaN across major applications faster and at scale. That’s the kind of push that can make GaN the next mainstream power semiconductor\nTo develop technologies that can reveal the true capabilities of GaN\nThe opportunity to enable higher-efficiency power electronics for future data centers by integrating advanced microfluidic cooling directly into next-generation GaN power modules.\n\n\nWhat is the biggest challenge in making power electronics greener? [nbsp]\nThe biggest challenge is getting GaN into real products at scale\, making sure it’s reliable in the field\, cost-competitive\, and the supply chain can actually support volume. That’s when “greener” savings become real.\nTo make full use of the GaN properties\nManaging rising heat flux while ensuring efficiency\, reliability\, and scalable manufacturing.\n\n\nLinkedIn\nhttps://www.linkedin.com/in/gianmauro-pozzovivo-66a99a26/ \nhttps://www.linkedin.com/in/elison-matioli-74ab1586/  \nhttps://www.linkedin.com/in/iordan-doytchinov-21b18045/
URL:https://czechsemiconductorcentre.cz/event/invitation-to-the-webinar4-all2gan-insights-driving-greener-power-electronics/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/12/shutterstock_2501790583-scaled.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260505
DTEND;VALUE=DATE:20260507
DTSTAMP:20260924T001033
CREATED:20260311T112857Z
LAST-MODIFIED:20260311T112933Z
UID:2098-1777939200-1778111999@czechsemiconductorcentre.cz
SUMMARY:Power Semiconductor Devices & Technologies | ECPE Tutorial | ONLINE
DESCRIPTION:The tutorial is aimed at engineers who are engaged in power electronics and want to improve their knowledge and understanding of power devices including the developments expected in near future. \nThe course starts with a general overview on required power device properties and a very basic treatment of semiconductor material and device physics. Blocking capability of the devices\, unipolar and bipolar current transport and gate control will be discussed. Diodes\, MOS transistors (including compensated superjunction MOS) and Insulated Gate Bipolar Transistors (IGBT) will be treated in detail including their dynamical properties\, safe operation and temperature limits. The wide bandgap semiconductor materials silicon carbide and gallium nitride have become important competitors to silicon. Their superior properties for application and the expectations for the next years will be discussed. Also\, issues concerning control\, packaging and integration will be treated in the corresponding contributions. The following chapters demonstrate basic principles of power electronic systems and the basics of intelligent IGBT / MOSFET control circuits. MOS transistor and IGBT gate drivers for various fields of application are discussed in detail. Finally a short overview of hybrid power electronic integration and the most relevant aspects (cooling\, reliability and EMC problems) will be presented. \n  \n\n\n\n\n\n\n\nDate: 05/05/2026 – 06/05/2026 \n\n\n\n\n\n\n\n\n\n\n\n\n\n\nLocation: Digital Event \n\n\n\n\n\n\n\n\n\n\n\n\n\n\nTechnical Chair: \nDr. Anton Mauder\, Infineon Technologies (DE)\nProf. Nando Kaminski\, University of Bremen (DE) \n\nECPE Contact:\nMarietta Di Dio\n+49 911 81 02 88 – 13\nmarietta.didio@ecpe.org \n\nRegistration Deadline: 28 April 2026
URL:https://czechsemiconductorcentre.cz/event/power-semiconductor-devices-technologies-ecpe-tutorial-online/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-11-122756.png
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260427
DTEND;VALUE=DATE:20260430
DTSTAMP:20260924T001033
CREATED:20260316T101745Z
LAST-MODIFIED:20260316T101745Z
UID:2139-1777248000-1777507199@czechsemiconductorcentre.cz
SUMMARY:IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems
DESCRIPTION:We invite you to attend the 29th International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2026)\, which will take place 27–29 April 2026 in Bratislava\, Slovakia. \nDDECS is a well-established international forum bringing together researchers and industry experts working on the design\, verification\, testing\, reliability\, and security of electronic circuits and systems. The programme features keynote talks\, technical sessions\, tutorials\, and networking opportunities covering topics such as digital design\, hardware accelerators\, analog circuits\, AI hardware\, and system reliability. \nOne of the highlights of this year’s programme will be the keynote presentation on 29 April 2026: Karel Masařík\, Director of the Czech Semiconductor Centre \nThis keynote will address the growing complexity of electronic design automation (EDA) and the strategic role of semiconductor technologies in Europe. \nWe warmly invite researchers\, engineers\, students\, and industry partners to join this event and engage with the international microelectronics community. \nMore information and registration are available at:https://deimos.fei.stuba.sk/projekty/DDECS2026/
URL:https://czechsemiconductorcentre.cz/event/ieee-international-symposium-on-design-and-diagnostics-of-electronic-circuits-and-systems/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-16-102601.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260424T100000
DTEND;TZID=Europe/Prague:20260424T120000
DTSTAMP:20260924T001033
CREATED:20260408T075305Z
LAST-MODIFIED:20260408T075313Z
UID:2191-1777024800-1777032000@czechsemiconductorcentre.cz
SUMMARY:Workshop - Photonics Call in Chips JU 2026
DESCRIPTION:Chips JU 2026 Call: Reinforcing Europe’s Strength in PhotonicsOnline | 24 April 2026 | 10:00–12:00 CET \nWe invite you to join an Information and Matchmaking Workshop dedicated to the upcoming Chips Joint Undertaking (Chips JU) 2026 call on photonics. \nThis online session offers a valuable opportunity to gain first-hand insights into the call and to connect with potential partners for future project collaborations. \n\nAbout the Workshop\nThe workshop is designed to support the photonics community in developing high-quality project proposals by providing detailed guidance on the funding call and facilitating networking among stakeholders. \nParticipants will benefit from: \n\nDirect insights into the call from the European Commission and Chips JU representatives\nA dedicated Q&A session addressing key aspects of the call\nPresentations of project ideas from across the community\nPartner search pitches to help build strong consortia\n\nIf you are interested in presenting your project idea\, you are encouraged to get in touch with the organisers. \n\nWhy Attend?\n\nGain a clear understanding of the Chips JU 2026 photonics call\nIdentify potential collaborators and consortium partners\nPosition your organisation for successful proposal development\nStay informed about the latest priorities in European photonics funding\n\n\nFunding Call Overview\nThe HORIZON-JU-Chips-2026-FT2-IA call focuses on reinforcing Europe’s leadership in photonics through innovation-driven projects. \n\nFunding type: Innovation Action (IA)\nEU budget: €20 million (with additional national co-funding)\nExpected projects funded: 2\nSubmission deadline: 17 September 2026\n\nSelected projects are expected to deliver industrial-grade demonstrators of advanced photonic technologies\, demonstrating scalability\, reliability and integration readiness at TRL 7–8. \nKey areas of focus include: \n\nScaling of wafer-level photonic processes\nDevelopment of packaging and testing solutions\nIntegration of heterogeneous materials and components\nCo-optimisation of design and process equipment\nDemonstration of system-level functionality\n\n\nRegister Now\nSecure your place and take the first step towards building strong\, competitive proposals in photonics.
URL:https://czechsemiconductorcentre.cz/event/workshop-photonics-call-in-chips-ju-2026/
LOCATION:on-line
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260421T130000
DTEND;TZID=Europe/Prague:20260421T140000
DTSTAMP:20260924T001033
CREATED:20260407T115750Z
LAST-MODIFIED:20260407T115750Z
UID:2184-1776776400-1776780000@czechsemiconductorcentre.cz
SUMMARY:Chips Think Tank Webinar
DESCRIPTION:We are pleased to invite you to our upcoming Chips Think Tank webinar\, taking place on 21 April at 13:00 CET. \nAs artificial intelligence continues to scale rapidly\, the limitations of traditional electronic architectures are becoming increasingly evident. Photonics is emerging as a key enabler to address these challenges—but how are investors positioning themselves\, and where do the most promising opportunities lie? \nJoin us for an insightful session exploring the investment dynamics shaping the photonics ecosystem. \nWe are delighted to welcome Pieter Klinkert\, Partner and Co-founder of PhotonVentures\, who will share his perspective on: \n\nThe investment thesis behind a venture capital firm fully dedicated to photonics\nHow the most promising start-ups are identified within a highly technical field\nThe impact of AI on the growing demand for optical interconnect technologies\nHow investors anticipate and position themselves in a fast-evolving market\n\nThe session will be hosted by Régis Hamelin\, CTO of BLUMORPHO and Coordinator of aCCCess\, and will include a live Q&A. \n👉 Register here to secure your place:https://www.blumorpho.com/webinar/?webinarKey=8236940136715699552 \nWe encourage you to join the discussion and share this invitation within your networks. \nMore information on aCCCess website: https://www.acccess.eu/events/chips-think-tank-webinar-6 
URL:https://czechsemiconductorcentre.cz/event/chips-think-tank-webinar/
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/04/Chips-Think-Tank-200125-5.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260402T180000
DTEND;TZID=Europe/Prague:20260402T220000
DTSTAMP:20260924T001033
CREATED:20260309T095336Z
LAST-MODIFIED:20260309T102601Z
UID:2083-1775152800-1775167200@czechsemiconductorcentre.cz
SUMMARY:Czech Premiere of the Documentary A Chip Odyssey
DESCRIPTION:The Taiwanese documentary A Chip Odyssey will have its Czech premiere in Brno on Thursday\, 2 April at 18:00\, at Kino Lucerna. \nDirected by award-winning filmmaker Hsiao Chu-Chen\, the feature-length documentary tells the remarkable story of how Taiwan built one of the world’s most important semiconductor industries from the ground up. Through interviews with pioneering engineers\, technicians\, policymakers and a new generation of innovators\, the film traces a fifty-year journey that transformed a small island into a global technological powerhouse. \nDrawing on rare archival materials and insights from more than 80 key figures\, A Chip Odyssey reveals the human stories behind the chips that power today’s digital world—from smartphones to artificial intelligence and advanced technologies. The film highlights the courage\, ambition and collective determination that shaped Taiwan’s rise at the centre of the global semiconductor ecosystem. \nScreening details \n\n\nFilm: A Chip Odyssey (2025) (more information on the website) \n\n\nDate: Thursday\, 2 April \n\n\nTime: 18:00 \n\n\nVenue: Kino Lucerna\, Brno \n\n\nJoin us for the Czech premiere of this compelling documentary and discover the extraordinary human story behind one of the most strategic industries of our time.
URL:https://czechsemiconductorcentre.cz/event/czech-premiere-of-the-documentary-a-chip-odyssey/
LOCATION:kino Lucerna\, Brno\, Minská 19\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/plakat.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20260328T100000
DTEND;TZID=Europe/Prague:20260328T150000
DTSTAMP:20260924T001033
CREATED:20260214T140336Z
LAST-MODIFIED:20260214T140747Z
UID:2033-1774692000-1774710000@czechsemiconductorcentre.cz
SUMMARY:Days of Electron Microscopy
DESCRIPTION:We warmly invite you to the Days of Electron Microscopy in Brno\, a city-wide celebration of science and discovery\, which this year for the first time includes the Faculty of Electrical Engineering and Communication at Brno University of Technology & Czech Semiconductor Centre. Join us to explore the micro-world and discover what modern science can image\, measure and truly understand. \nSaturday 28 March 2026FEEC BUT\, Technická 8\, Brno10:00–12:00 and 13:00–15:00 \nBrno is recognised as a global leader in electron microscopy\, building on the legacy of Armin Delong. This year marks the 75th anniversary of the first Czechoslovak electron microscope\, constructed in Brno under his leadership — a milestone that helped shape the city’s international reputation in this field. Currently\, every third electron microscope in the world is manufactured in Brno. \n\nProgramme at FEEC BUT\n1) Guided Tour of the Electron Microscope\n(30 minutes – registration required) \nIn laboratory\, specialist Nikola Papež will demonstrate the practical use of an electron microscope. Visitors will observe extreme magnifications and details invisible to the naked eye — such as a nanofibre nearly 1\,000 times thinner than a human hair or a damaged silver contact on the surface of a solar cell. \nParticipation is possible upon prior registration only. \n\n2) Chips and Semiconductors: How the Modern World Is Built\n(No registration required) \nWhat exactly is a semiconductor? How is a microchip manufactured? And why can we not build an electron microscope without chips — nor chips without an electron microscope? \nThis accessible and engaging session will explain the fundamentals of semiconductor technology and its crucial role in modern science and industry. Visitors will see real examples and gain insight into how chips are designed\, fabricated and analysed. \nThe session will be delivered by: \n\n\nJana Drbohlavová\, Coordinator and Deputy Director of the Czech Semiconductor Centre (CSC) \n\n\nMartin Balabán from the student creative team SPICE \n\n\nThe Czech Semiconductor Centre plays a key role in strengthening the Czech Republic’s position in the global semiconductor ecosystem. This part of the programme offers a unique opportunity to understand how advanced research\, industry collaboration and education come together to shape the future of microelectronics — and why semiconductors are strategic for Europe’s technological sovereignty. \nThis session is open to all visitors without registration. \n\nThe event is organised by the Institute of Physics FEEC BUT\, the Department of Microelectronics FEEC BUT\, the Czech Semiconductor Centre (CSC)\, and the student creative team SPICE. We look forward to welcoming curious visitors of all ages — students\, parents and children alike. \nFull programme of the Days of Electron Microscopy Brno:https://dembrno.cz/
URL:https://czechsemiconductorcentre.cz/event/days-of-electron-microscopy/
LOCATION:FEEC\, BUT\, Technická 8\, Brno\, Czech Republic
CATEGORIES:Organized by CSC
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/02/Elektronova-mikroskopie3-scaled.jpg
ORGANIZER;CN="CSC":MAILTO:info@czechsemiconductorcentre.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260317
DTEND;VALUE=DATE:20260320
DTSTAMP:20260924T001033
CREATED:20260311T112332Z
LAST-MODIFIED:20260311T112332Z
UID:2090-1773705600-1773964799@czechsemiconductorcentre.cz
SUMMARY:AMPER 2026
DESCRIPTION:From 17–19 March 2026\, the AMPER 2026 trade fair will bring together manufacturers\, developers\, researchers\, startups\, and technology companies from across the electronics\, energy\, and advanced technology sectors at Veletrhy Brno\, a. s. With 400+ exhibitors from more than 20 countries and over 26\,000 visitors\, AMPER ranks among the largest and most influential technology events of its kind in Central Europe. \nFor the semiconductor and chip sector\, events like AMPER play a particularly important role. They create a space where research\, industry and emerging talent meet\, helping to accelerate the transfer of ideas into real-world technologies. As Europe works to strengthen its semiconductor capabilities and resilience of the chip supply chain\, collaboration across universities\, startups\, SMEs and established companies is more important than ever. AMPER provides exactly this kind of environment — bringing together innovators working on electronics design\, embedded systems\, advanced manufacturing\, power electronics\, and the broader technologies that enable the semiconductor value chain. \nThe Czech Semiconductor Centre will be there as well. \nYou can meet our team at the AMPER Innovation Hub in Pavilion P\, where we will be part of exhibitions hosted by our members:\n🔹 Brno University of Technology (Vysoké učení technické v Brně)\n🔹 Czech Technical University in Prague (České vysoké učení technické v Praze) \nWe look forward to meeting startups\, SMEs\, students\, researchers and industry partners who are interested in the future of chips in Europe. Whether you are working on semiconductor design\, advanced electronics\, or exploring collaboration opportunities\, come and say hello. \nLet’s talk about talent\, innovation\, and how we can strengthen the semiconductor value chain in Czechia and across the European Union.
URL:https://czechsemiconductorcentre.cz/event/amper-2026/
LOCATION:Brno\, Božetěchova 1/2\, Brno\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/uz.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260317
DTEND;VALUE=DATE:20260319
DTSTAMP:20260924T001033
CREATED:20260311T112636Z
LAST-MODIFIED:20260311T112659Z
UID:2093-1773705600-1773878399@czechsemiconductorcentre.cz
SUMMARY:Gate Drivers and Control Circuitry of IGBTs and MOSFETs
DESCRIPTION:Gate Drivers and control circuits are the interface between the signal level and the power stage within a power electronic system. They are responsible for a safe operation of the power switches. \nThe development of gate driving circuits for ideal operation of power electronics necessitates profound knowledge of semiconductor characteristics (MOSFETs\, IGBTs)\, influence of gate voltage on switching behaviour\, power supply of galvanically isolated parts of the circuitry\, parasitics\, and protection functions. \nBeginning with silicon MOSFETs\, switching behaviour will be explained\, and then derived for Silicon Carbide MOSFETs and IGBTs. As the mechanisms are basically the same for all voltage/power classes\, no differentiation will be done between high and low power devices. \nIn the context of the development and adoption of innovative Wide-Band-Gap semiconductors\, new challenges concerning robust operation at very fast switching speed and frequencies are also addressed to attain the expected gains at system level. \nWith this tutorial we want to transfer the necessary knowledge to drive and control IGBTs and MOSFETs in a safe way. The focus is on modules\, discretes will be covered only briefly.
URL:https://czechsemiconductorcentre.cz/event/gate-drivers-and-control-circuitry-of-igbts-and-mosfets/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/03/Snimek-obrazovky-2026-03-11-122452.png
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260310
DTEND;VALUE=DATE:20260313
DTSTAMP:20260924T001033
CREATED:20251201T144124Z
LAST-MODIFIED:20251201T144225Z
UID:1789-1773100800-1773359999@czechsemiconductorcentre.cz
SUMMARY:Embedded World 2026
DESCRIPTION:The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community\, including leading experts\, key players and industry associations. It offers unprecedented insight into the world of embedded systems\, from components and modules to operating systems\, hardware and software design\, M2M communication\, services\, and various issues related to complex system design. \nIts expertise and sharp focus on technologies\, processes and future-oriented products make it unparalleled in international comparisons – and THE must-attend event for developers\, system architects\, product managers and technical management.
URL:https://czechsemiconductorcentre.cz/event/embedded-world-2026/
LOCATION:Nuremberg\, Nuremberg\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/12/embedded-n-dynamicteaser-eingangsbereich.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260204
DTEND;VALUE=DATE:20260206
DTSTAMP:20260924T001033
CREATED:20251201T143544Z
LAST-MODIFIED:20251201T143704Z
UID:1783-1770163200-1770335999@czechsemiconductorcentre.cz
SUMMARY:ECS Brokerage Event 2026
DESCRIPTION:Registration is now open for The ECS Brokerage Event\, which will return to Brussels on 4&5 February 2026 at a new venue location; The EGG\, Brussels. The event combines the brokerage activities of the industry associations AENEAS\, EPoSS and INSIDE into one networking event dedicated to project proposals for the new Chips JU Calls 2026. \nThis event gathers the ECS community around project ideas\, allowing it to network\, build consortia and start creating project proposals. We encourage you to plan your travel and accommodation early\, as back-to-back events are scheduled before and after the Brokerage.
URL:https://czechsemiconductorcentre.cz/event/ecs-brokerage-event-2026/
LOCATION:Brussels\, Brussels\, Belgium
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/12/Snimek-obrazovky-2025-12-01-153559.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260125
DTEND;VALUE=DATE:20260131
DTSTAMP:20260924T001033
CREATED:20251002T065847Z
LAST-MODIFIED:20251002T065847Z
UID:1677-1769299200-1769817599@czechsemiconductorcentre.cz
SUMMARY:The FAMES European FD-SOI Design School (EFDS)
DESCRIPTION:The FAMES European FD-SOI Design School (EFDS) is a one-week theoretical and practical training course focused on FD-SOI design. \n\nDate: From Jan. 25 to 30\, 2025\nLocation: CIME Nanotech and CEA-Leti\, Grenoble\, France\n\nThis course is intended for chip designers\, engineers\, Masters and PhD students\, with the purpose of providing the essential scientific and technical foundations for developing integrated circuits using FD-SOI technology. \nThe comprehensive program includes important topics such as transistor modeling\, sophisticated analog and RF design techniques (including body-biasing)\, the complete digital circuit design flow (from RTL to routing)\, and crucial design-for-test methodologies. The curriculum combines expert lectures with hands-on sessions to give participants a practical learning experience. \nThis winter school represents a key opportunity to strengthen expertise within the European FD-SOI ecosystem and empower the next generation of designers. \nIf you are interested in participating\, we would be delighted to welcome you or your colleagues to this training. Please note that places are limited and that all the details (including prerequisites) are available on our website.
URL:https://czechsemiconductorcentre.cz/event/the-fames-european-fd-soi-design-school-efds/
LOCATION:Grenoble\, Grenoble\, France
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/10/x.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20260115
DTEND;VALUE=DATE:20260116
DTSTAMP:20260924T001033
CREATED:20251205T093721Z
LAST-MODIFIED:20251205T094005Z
UID:1798-1768435200-1768521599@czechsemiconductorcentre.cz
SUMMARY:Get Spin-off/Start-up Ready!
DESCRIPTION:Turn your research into real-world impact\nScience can change the world — when it reaches beyond the university walls. It is our mission at CTU Technology Transfer to support you in turning your idea/research into a university spin-off or an independent startup. \nJoin our semestral Spin-off/Start-up Ready! program to put on the business hat\, understand the journey to commercialization\, practice the use of vital business tools\, and build a network of investors and industry partners to bring your innovation to life! \n\n\nWho can join?\nReady! is open to all CTU students\, PhD candidates\, postdocs\, and researchers – Czech and international – who want to explore the business potential of their ideas. \nThe program runs in English. 16 participants will be accepted to ensure individual mentoring and a highly practical experience. \n\n\nProgram at a glance\n\n\nDuration\nFebruary – June 2026 \n\n\nFormat\nIn-person\, Thursdays 9:00–12:30 (incl. brunch) \n\n\nLocation\nPrague \n\n\nLanguage\nEnglish \n\n\nApplication deadline\n15 January 2026 \n\n\nFinal pitch night\n4 June 2026 \n\n\n\nParticipation fee\nParticipation free of charge \n\n\n\nParticipants get\n\nKnow-how & practice in 8 key commercialization steps + final investor pitch\nPractical assignments to develop their own idea/research\nDedicated business mentoring: each participant is matched with an experienced mentor who supports them individually throughout the program and helps them achieve quality outcomes on the practical assignments between workshops (for participant’s real project)\nNetworking with business community and investors\nČVUT microcertificate upon completion\nFurther commercialization support with contracts\, legal issues\, patents\, incubation\, etc.\n\n\n\nWhat makes Ready! different\n\nHigh-value workshops: expert faculty\, small cohort (max. 16 participants)\nPractical focus: 70% of your time spent developing your own research-to-business idea\nIndividual business mentoring: each participant/team works with an experienced business mentor\nEssential business & soft skills: validation of commercial potential\, business and financial plan\, go-to-market strategy\, team composition and management\, IP protection\, legal support\, pitching to investors\nCommunication for impact: short and intense communication practice spread over all workshops to build you as a strategic\, structured and confident presenter of your business ideas\nBusiness contacts: establishing relationships with topic experts\, business mentors\, industrial partners\, and investors\nSupport beyond the program: guidance\, legal counsel and incubation by ČVUT Technology Transfer seamlessly following the Ready! program\n\n\n  \nReady flyer
URL:https://czechsemiconductorcentre.cz/event/1798/
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/12/Snimek-obrazovky-2025-12-05-103732.png
ORGANIZER;CN="FEE CTU":MAILTO:xprajzlv@fel.cvut.cz
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251203
DTEND;VALUE=DATE:20251205
DTSTAMP:20260924T001033
CREATED:20250710T114355Z
LAST-MODIFIED:20250710T114355Z
UID:1533-1764720000-1764892799@czechsemiconductorcentre.cz
SUMMARY:EFECS 2025
DESCRIPTION:The next edition of EFECS – the European Forum for Electronic Components and Systems is taking place in Malta\, on December 3–4\, 2025\, at the Hilton Hotel in St. Julian’s – the very same place where the journey began with the 1st ECSEL Symposium 2017 that set the course for the ECS community in Europe. This year’s theme\, Accelerate Innovation: Building European Competitiveness\, puts the spotlight on value chain security\, sustainability\, and emerging market opportunities\, all in the context of Europe’s strategic drive for technological sovereignty. \n💡 Why Attend EFECS 2025? \n\nInsightful keynotes & discussions on cutting-edge topics like quantum tech\, cybersecurity\, AI\, and more.\nNetworking with 700+ stakeholders from across Europe’s semiconductor and ECS ecosystem.\nStrengthening the Chips Joint Undertaking mission: Learn how Europe is advancing semiconductor leadership and resilience.\nCelebrating progress and contributing to the future direction of the Chips Joint Undertaking and the broader ECS value chain.\n\nRegistration opens soon – mark your calendars and stay tuned for more details!
URL:https://czechsemiconductorcentre.cz/event/efecs-2025/
LOCATION:Hilton Hotel\, St Julian’s\, Malta\, Vjal Portomaso\, St. Julian´s\, PTM01\, Malta
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/07/Snimek-obrazovky-2025-07-10-134237.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251127
DTEND;VALUE=DATE:20251128
DTSTAMP:20260924T001033
CREATED:20251002T065344Z
LAST-MODIFIED:20251002T065344Z
UID:1672-1764201600-1764287999@czechsemiconductorcentre.cz
SUMMARY:DC Circuit Breaker - Technologies and Applications
DESCRIPTION:With the rapid move towards DC grids for efficient integration of renewables and storage\, protection technologies are becoming critical. This workshop explores the role of DC circuit breakers – with a focus on solid-state solutions using advanced SiC devices – to ensure fast\, reliable fault protection. Featuring leading experts from Europe and Japan\, the event will highlight the latest research and applications shaping the future of DC power systems. \nECPE Online Workshop\nDC Circuit Breaker – Technologies and Applications \n27 November 2025 online \nDC grids use direct current for power distribution\, offering greater efficiency and cost-effectiveness in the growing decentralized energy landscape\, particularly for integrating renewable energy sources like solar photovoltaics and battery storage. Unlike the conventional AC grid\, DC grids eliminate inefficient conversion steps\, as many modern devices and energy sources are inherently DC-powered. This trend to DC grids\, particularly in the Medium Voltage (MV) range\, leads to a similar challenge as in vehicle electrification with on-board voltages of 800 V in EVs and > 1000 V in heavy duty vehicles\, the DC Circuit Breaker (DC-CB) issue. As a protection element the DC-CB has to open very fast in case of a fault e.g. a short circuit\, and in on-state lowest losses are key. Solid-State Circuit Breakers (SSCBs) are protection devices that use power semiconductors (Si-MOSFETs or IGBTs\, or SiC transistors)\, instead of mechanical contacts to safeguard electrical circuits against overloads and short circuits\, allowing an extremely fast interruption in a few microseconds. These requirements make fast-switching SiC devices with its low on-resistance an excellent choice for Solid-State Circuit Breakers. \nFurthermore\, the workshop aims to strengthen the cooperation between Europe and Japan in the area of SiC-based Circuit Breaker research. Therefore\, Prof. Keiji Wada from the Tokyo Metropolitan University has been invited to join the team of Technical Chairs with Prof. Brueckner (Bundeswehr University Munich) and Prof. Lorenz (ECPE). \nRegistration Deadline: 20 November 2025 \n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\nProgramme in PDF here. \n 
URL:https://czechsemiconductorcentre.cz/event/dc-circuit-breaker-technologies-and-applications/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/10/Snimek-obrazovky-2025-10-02-085312.png
ORGANIZER;CN="ECPE":MAILTO:svenja.roth@ecpe.org
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251118
DTEND;VALUE=DATE:20251122
DTSTAMP:20260924T001033
CREATED:20250509T105833Z
LAST-MODIFIED:20250509T105833Z
UID:1355-1763424000-1763769599@czechsemiconductorcentre.cz
SUMMARY:SEMICON Europa 2025
DESCRIPTION:SEMICON Europa 2025 is co-located with productronica and will take place in November 18-21\, 2025 in Munich\, Germany. This year’s theme Global Collaborations for European Economic Resilience expresses that global collaborations are not just beneficial for Europe’s resilience\, they are essential. In today’s interconnected world\, Europe cannot afford to operate in isolation. By working closely with other nations\, Europe can safeguard its prosperity\, sustainability\, and security for future generations. \nThis approach will enable the industry to create a future where technological innovations and environmental sustainability thrive together. \n– Top-notch Keynotes\n– Market Trends\n– Exhibition\n– Networking\n– Advanced Packaging Forum / Fab Management Forum\n– Sustainability\n– Smart Manufacturing / Mobility / MedTech\n– Workforce Development and many more!
URL:https://czechsemiconductorcentre.cz/event/semicon-europa-2025/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/05/Snimek-obrazovky-2025-05-09-125538.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251023
DTEND;VALUE=DATE:20251025
DTSTAMP:20260924T001033
CREATED:20250619T142332Z
LAST-MODIFIED:20250619T142605Z
UID:1508-1761177600-1761350399@czechsemiconductorcentre.cz
SUMMARY:IMAPS 2025 flash Conference
DESCRIPTION:The conferences organized by IMAPS Czech and Slovak Republic Chapter typically focus on current trends\, challenges\, and innovations in microelectronics\, packaging technologies\, and the manufacturing and protection of electronic assemblies. These events bring together professionals from academia\, industry\, and R&D to exchange knowledge\, present new developments\, and foster collaboration. \nThe IMAPS CZ a SK\, as part of the international IMAPS organization\, promotes the advancement of microelectronics and packaging technologies through conferences\, workshops\, and networking. It supports education\, research\, and the dissemination of technical knowledge in the fields of electronics manufacturing\, design\, materials\, and reliability. \nTopics from previous years: \n\nTrends in wireless technologies from the perspective of international distributors\nDesign for manufacturability in modern electronics\nImproving the cleaning process of electronic assemblies through better design\nCorrosion protection of PCBs\nApplication of XRF (X-ray fluorescence) in production control\nHidden risks in the repair of long-lifecycle electronic systems\nHigh-precision measurement using FBG-based sensors\nNew requirements for capacitors and passive components\nVerification of soldering in surface mount technology for space applications\nCurrent state and trends in EDA (Electronic Design Automation) software\n\n  \nIMAPS flash Conference is the European forum for the exchange of information between senior and young scientists from academic communities and electronic industries on topics related to their experimental and theoretical work in the very wide-spread field of electronics\, microelectronic technology and packaging. \nIt is our pleasure to encourage you to participate in IMAPS flash Conference 2025 “Quantum meets silicon”\, organized by International Microelectronics and Packaging Society Czech and Slovak Chapter (IMAPS CZ&SK)\, Brno University of Technology (BUT) and Institute of Scientific Instruments (ISI). \n+ Workshop on quantum technologies in semiconductors (The year 2025 has been proclaimed by the United Nations as the International Year of Quantum Science and Technology. The aim of this initiative is to raise awareness of the contributions of quantum mechanics and quantum materials to science\, industry\, and everyday life\, in connection with the 100th anniversary of the formulation of quantum mechanics.) \nWe will meet in one of Brno’s iconic villas. The evening will be accompanied by swing music (The Friday Swingers). You will enjoy good food\, drinks and fruitful conversations. We are looking forward to meeting you all.
URL:https://czechsemiconductorcentre.cz/event/imaps-2025-flash-conference/
LOCATION:Institute of Scientific Instruments of the Czech Academy of Sciences\, Královopolská 147\, Brno\, 61200\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/06/Z5he8s9E.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20251022T090000
DTEND;TZID=Europe/Prague:20251022T160000
DTSTAMP:20260924T001033
CREATED:20251009T074548Z
LAST-MODIFIED:20251009T074548Z
UID:1680-1761123600-1761148800@czechsemiconductorcentre.cz
SUMMARY:Re-Thinking Electronics – Is Greentech Too Good to Be True?
DESCRIPTION:The workshop Re-Thinking Electronics – Is Greentech Too Good to Be True? will take place in Prague on October 22 from 9:00 a.m. to 4:00 p.m. at the Vienna House Diplomat. \nWe invite partners from European projects on sustainable electronics to attend the workshop. You can look forward to the participation of experts from research centers and incubators (VTT\, TNO\, Fraunhofer)\, as well as industry players (Covestro\, Flexoo\, BD Medical). \nTopics will include:\n• the use of printed and flexible electronics technologies\n• precious metal waste management strategies\n• the development of compostable electronic components\n• the practical implementation of circular policies \nMore information about the event\, including the program and registration\, can be found HERE. \nJoin us for a full-day free-of-charge forum exploring the realities of sustainable electronics – from bold innovations to hard truths. This full-day event will bring together top minds from across Europe – spanning industry\, academia\, policy\, and research.
URL:https://czechsemiconductorcentre.cz/event/re-thinking-electronics-is-greentech-too-good-to-be-true/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2025/10/x.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251021
DTEND;VALUE=DATE:20251024
DTSTAMP:20260924T001033
CREATED:20250910T070708Z
LAST-MODIFIED:20250910T070708Z
UID:1630-1761004800-1761263999@czechsemiconductorcentre.cz
SUMMARY:BioChip and Biomedicine Chip Design
DESCRIPTION:Discover the future of biochips and biomedical chip technologies at this unique international event\, taking place in Brno and online on October 21–23\, 2025. The program brings together researchers from Taiwan\, Korea\, Japan\, and the Czech Republic to share the latest advances in diagnostics\, wearable electronics\, olfactory sensing\, microfluidics\, and biochip applications. \nParticipants will gain insights into cutting-edge topics such as nanoengineered platforms for rapid disease diagnostics\, electronic fibers for smart garments\, olfactory sensors\, smartphone-based health monitoring\, point-of-need microfluidic devices\, and two-photon lithography for advanced biochip fabrication. Alongside inspiring lectures\, the program will also feature hands-on laboratory sessions on microfluidics\, wearable sensors\, and mobile health applications. The event offers not only expert talks and practical demonstrations\, but also an optional excursion to IQS nano\, networking opportunities\, and a guided tour of Brno. \nDon’t miss the chance to connect with leading experts and explore how biochip innovations are shaping the future of healthcare\, wearable electronics\, and diagnostics. \nThe capacity of the event is limited. We recommend to register as soon as possible. \nLaboratory exercises\nMicrofluidics (Dr. Ludovico Magliaccio – Brno University of Technology)\n\nThis session will demonstrate how to design and fabricate microfluidic chips quickly\, cost-effectively\, and with minimal equipment. The focus will be on practical method for rapid prototyping\, along with a simple setup for testing and operating the fabricated chips. \nSmartphone application for cardio features estimation (Dr. Andrea Němcová – Brno University of Technology) \nDevelopment of smartphone application „Tepovka“ for cardio features estimation will be described from the perspective of sensors\, app development\, algorithm\, accuracy and future outlook. It will be enriched with a real demonstration\, approx. 15-20 min. \nWearable sensors (Prof. Jaromír Hubálek\, Dr. Jakub Arm) \nVitality assessment via wearable activity monitoring will present a sensor system incorporating data fusion\, activity recognition\, energy expenditure estimation\, and vitality assessment (poster). This will be complemented by a live demonstration with an Android application on a treadmill\, and by measuring salinity. \nAll details with registration is available here.
URL:https://czechsemiconductorcentre.cz/event/biochip-and-biomedicine-chip-design/
CATEGORIES:Organized by CSC
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251020
DTEND;VALUE=DATE:20251023
DTSTAMP:20260924T001033
CREATED:20250724T114730Z
LAST-MODIFIED:20250724T114810Z
UID:1556-1760918400-1761177599@czechsemiconductorcentre.cz
SUMMARY:European Conference on EDGE AI Technologies and Applications – EEAI
DESCRIPTION:Join the 𝗘𝘂𝗿𝗼𝗽𝗲𝗮𝗻 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗼𝗻 𝗘𝗗𝗚𝗘 𝗔𝗜 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝗶𝗲𝘀 𝗮𝗻𝗱 𝗔𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀 (EEAI 2025)\, taking place 20–22 October 2025 in Naples\, Italy. EEAI2025 is the European event dedicated to the entire edge AI ecosystem\, from the foundational edge AI hardware and software to the most advanced algorithms\, agentic AI\, generative AI and applications\, the conference explores the latest breakthroughs. During the event\, you’ll get to explore edge AI\, learn from experts in the field\, network with the community and stay updated on the latest technological innovations. \nℹ️️ More information: https://lnkd.in/dVTHu6eS\n🔗 Register now to secure your spot: https://lnkd.in/exd2MJZ6 \n📧 Are you interested in contributing? Submit your presentation\, paper abstracts or poster by 15 August 2025 to info@edge-ai-tech.eu
URL:https://czechsemiconductorcentre.cz/event/1556/
LOCATION:Naples\, Italy\, Naples\, Italy
CATEGORIES:External Event
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ORGANIZER;CN="EdgeAI":MAILTO:info@edge-ai-tech.eu
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251011
DTEND;VALUE=DATE:20251013
DTSTAMP:20260924T001033
CREATED:20250918T124623Z
LAST-MODIFIED:20250918T124750Z
UID:1648-1760140800-1760313599@czechsemiconductorcentre.cz
SUMMARY:Open Days in onsemi Czechia (Rožnov)
DESCRIPTION:Several themed excursions will take you on an exciting journey into the world of chip design and manufacturing\, which powers cars\, smartphones\, and modern industry. We have also prepared a series of entertaining and interactive workshops where you can try your hand at firefighting simulations or first aid “live.” \nThe number of places on individual excursions and workshops is limited. Don’t hesitate and book what interests you in advance using our intuitive booking system. Participation in individual activities may be subject to age restrictions. Please pay attention to the detailed description in the booking system. \nExcursions to learn \nWe will introduce you to the individual stages of semiconductor development and production through four separate engaging excursions. Choose the area that interests you most\, or all of them! \nIn the integrated circuit design center\, you will learn about the environment where engineers transform their ideas into specific integrated circuit designs. This is where the whole story of the digital future begins. (Building C12) \nSilicon wafers are the most commonly used material for chip production. We will also introduce you to their production in detail. (Building M10) \nYou can also explore with us the innovative processes used in the production of silicon carbide wafers\, which we were the first in the world to use on an industrial scale. (Building V1) \nTake a look with us at the individual stages of chip production\, the invisible heroes of our digital age. (Building M8) \nDon’t miss the adrenaline-filled experience of extinguishing a fire and rescuing people from a smoke-filled space. (Building M8) \nLearn how to provide first aid under the guidance of experienced instructors. Virtual reality Human Anatomy will give you a glimpse into the human body. (Building M8) \nYou can test your own health in the interactive Health Day zone with a range of preventive examinations. (Building M8) \nDon’t miss the Škoda EDU.Lab mobile laboratory\, which was created as a unique project by Škoda Auto to support technical education. This specially modified truck will bring samples of the latest technologies used in modern electronics and automobiles\, including robotics\, artificial intelligence\, 3D printing\, and virtual reality\, to Rožnov. \nThe open days at onsemi promise not only a fascinating look behind the scenes of chip production\, but also a rich program of experiences for young and old alike.
URL:https://czechsemiconductorcentre.cz/event/open-days-in-onsemi-czechia-roznov/
LOCATION:onsemi\, Rožnov pod Radhoštěm\, Czech Republic
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251008
DTEND;VALUE=DATE:20251009
DTSTAMP:20260924T001033
CREATED:20250804T092040Z
LAST-MODIFIED:20250804T092129Z
UID:1589-1759881600-1759967999@czechsemiconductorcentre.cz
SUMMARY:EBSCON 2025
DESCRIPTION:Join us for the 5th edition of EBSCON\, the flagship event for professionals\, pioneers\, and visionaries in the electronic and software-based systems industry. Hosted by Silicon Alps Cluster GmbH\, EBSCON 2025 brings together over 350 participants\, including international keynote speakers\, cutting-edge startups\, regional industry leaders\, and innovation-driven public institutions. \nThis Year’s Focus: Creative Destruction\nInspired by economist Joseph Schumpeter\, this year’s theme explores how radical innovation and disruption fuel long-term progress. From AI and sustainability to regional transformation and human-centric tech\, EBSCON 2025 challenges attendees to rethink the future through first principles and bold questions. \nWhat to Expect:\n\n\nOpening Ceremony with political and industry leaders \n\n\nLive signing of a memorandum between European Chips Competence Centers \n\n\nKeynotes\, including a headline talk by Henriette Frädrich: “The Magic of First Principles & Question Marks” \n\n\nInteractive tracks like the Pioneers Pitch\, Bar Camps\, and Panel Discussions \n\n\nStart-up exhibitions\, industry showcases\, and networking lounges \n\n\nFree 1:1 matchmaking via B2Match (slots open one month prior) \n\n\nExtensive media coverage\, including a live press conference and social media features \n\n\n\n\nReady to be part of the change?\nRegistration is free and open now!👉 Find out more information on the event website!
URL:https://czechsemiconductorcentre.cz/event/ebscon-2025/
LOCATION:Messe Congress Graz\, Austria\, Messe Congress\, Graz\, Austria
CATEGORIES:External Event
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