BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Czech Semiconductor Centre - ECPv6.15.18//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://czechsemiconductorcentre.cz
X-WR-CALDESC:Events for Czech Semiconductor Centre
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
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TZID:Europe/Prague
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TZOFFSETFROM:+0100
TZOFFSETTO:+0200
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DTSTART:20250330T010000
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BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20251026T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20260329T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20261025T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:20270328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CET
DTSTART:20271031T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261012T130000
DTEND;TZID=Europe/Prague:20261012T160000
DTSTAMP:20260923T154304
CREATED:20260922T073921Z
LAST-MODIFIED:20260923T070405Z
UID:2727-1791810000-1791820800@czechsemiconductorcentre.cz
SUMMARY:Your Gateway to European Semiconductor Technologies: CCCs\, Pilot Lines & EuroCDP
DESCRIPTION:This joint webinar brings together three national semiconductor competence centres — Czech Semiconductor Centre\, SK Chips and CC Chip.si — with key European semiconductor infrastructure: the European Chips Design Platform (EuroCDP) and the PIXEurope and NanoIC Pilot Lines. \nParticipants will gain a practical overview of the services available to companies\, startups\, SMEs\, researchers and other innovators across Europe. The session will introduce opportunities in chip design\, access to advanced technologies and pilot-line infrastructure\, design tools\, IP libraries and PDKs\, as well as training and technical support. Speakers will also explain how users can access these services and how the competence centres can help them navigate the European semiconductor ecosystem and identify the most suitable support for their projects. \nThe webinar will conclude with an open discussion and Q&A\, providing participants with an opportunity to discuss their needs directly with representatives of the competence centres\, EuroCDP and the Pilot Lines. \nThis webinar is free of charge. Registration open here. \nWebinar Programme (13:00–16:00 CET)\n\n13:00–13:05 | Welcome and Introduction (5 min)\nSpeaker: Petr Kamenický\, Director of the CSC\nWelcome\, webinar objectives and introduction of the speakers.\n\n13:05–13:15 | CSC Services at a Glance (10 min)\nSpeaker: Jana Drbohlavová\, Deputy Director of the CSC\nRole of the CSC\, its main services and areas of expertise.\n\n13:15–13:25 | SK Chips Services at a Glance (10 min)\nSpeaker: Martin Jagelka\, Head of Partnerships\nRole of SK Chips\, its main services and areas of expertise.\n\n13:25–13:35 | CC Chip.si Services at a Glance (10 min)\nSpeaker: Jurij Podržaj\nRole of CC Chip.si\, its main services and areas of expertise.\n\n13:35–14:05 | Introduction to PIXEurope (30 min)\nSpeaker: Marina Santana\nMain technologies\, available services\, target users\, access mechanisms and examples of potential applications.\n\n14:05–14:35 | Introduction to NanoIC (30 min)\nSpeaker: Giuseppe Fiorentino\nMain technologies\, available services\, target users\, access mechanisms and examples of potential applications.\n\n14:35–15:05 | Introduction to the European Chips Design Platform (EuroCDP) (30 min)\nSpeaker: Romano Hoofman\nDesign tools\, IP libraries\, process design kits (PDKs)\, training\, technical support\, and access to Pilot Lines\, foundries\, packaging and testing services.\n\n15:05–16:00 | Open Discussion\, Questions & Networking Session (55 min)\nModerated discussion with all speakers\, questions from participants\, exchange of experiences and networking opportunities.\n\n16:00 | Closing Remarks\nSpeaker: CSC representative\nSummary of key points\, next steps and relevant contact information.
URL:https://czechsemiconductorcentre.cz/event/your-gateway-to-european-semiconductor-technologies-cccs-pilot-lines-eurocdp/
LOCATION:on-line on Teams
CATEGORIES:Organized by CSC
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END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261014T093000
DTEND;TZID=Europe/Prague:20261014T110000
DTSTAMP:20260923T154304
CREATED:20260922T072048Z
LAST-MODIFIED:20260922T072128Z
UID:2724-1791970200-1791975600@czechsemiconductorcentre.cz
SUMMARY:SME Feedback Workshop on the Chips Act 2.0
DESCRIPTION:The European Commission is preparing the Chips Act 2.0\, a measure aimed at strengthening the European semiconductor ecosystem\, increasing its competitiveness and resilience\, and supporting the entire value chain. Small and medium-sized enterprises and other stakeholders in the semiconductor and electronics sectors can share their comments on the proposal during an online workshop on October 14\, 2026\, or in writing.\nThe Chips Act 2.0 is a proposal by the European Commission aimed at strengthening the European semiconductor ecosystem\, increasing its resilience and competitiveness\, and supporting the entire value chain. The proposal also aims to improve conditions for European companies and facilitate their access to support tools and infrastructure. \nCompanies can influence the form of the measures being prepared\nTo ensure that the Chips Act reflects the real needs of companies in the ecosystem\, the Enterprise Europe Network\, in collaboration with the European Commission\, is organizing an event titled “SME Feedback Workshop on the Chips Act 2.0.” \nDuring the workshop\, participants will learn about the proposal and will have the opportunity to share their experiences\, needs\, and feedback directly with representatives of the European Commission. \nThe discussion will cover topics such as: \n\nthe role of SMEs in the European semiconductor and electronics ecosystem\,\naccess to support tools\, pilot lines\, infrastructure\, centers of excellence\, and EU programs\,\nany administrative burdens and barriers to accessing support\,\nthe involvement of various stakeholders across the value chain\,\nspecific recommendations for the next steps in the legislative process.\n\n\nWho is this workshop intended for?\nThe workshop is particularly relevant for small and medium-sized enterprises operating in the fields of semiconductors\, microelectronics\, and electronics. Participating companies may include\, for example\, those involved in the manufacture and supply of semiconductors\, chip development\, electronic components\, manufacturing equipment\, testing\, and packaging\, as well as other players in the European semiconductor and electronics value chain. \nThe event will take place online on October 14\, 2026\, from 9:30 a.m. to 11:00 a.m.\, and the program will be conducted in English. Participation is free\, but prior registration is required. \nCompanies can also share feedback in writing\nCompanies do not have to provide their feedback only during the workshop. They can also submit their experiences\, needs\, and comments on the Chips Act 2.0 proposal in writing through the Enterprise Europe Network. \nIs your company dealing with issues related to support availability\, infrastructure\, pilot lines\, administrative requirements\, or other obstacles in the semiconductor industry? \nWe would appreciate it if you would send us your suggestions. We will help you prepare and draft your feedback\, which we will forward to the relevant organizations.
URL:https://czechsemiconductorcentre.cz/event/sme-feedback-workshop-on-the-chips-act-2-0/
LOCATION:on-line
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261021
DTEND;VALUE=DATE:20261023
DTSTAMP:20260923T154304
CREATED:20260720T064502Z
LAST-MODIFIED:20260720T064502Z
UID:2579-1792540800-1792713599@czechsemiconductorcentre.cz
SUMMARY:Engaged Investments
DESCRIPTION:Start-up founders and investors are invited to attend Engaged Investments 2026\, an exclusive venture capital conference bringing together active investors and ambitious founders from Central and Eastern Europe and the Baltic region. \nTaking place at the National House in Prague on 21–22 October 2026\, the conference is expected to welcome up to 500 participants\, including approximately 250 venture investors\, 150 start-up founders and more than 40 speakers. The event is organised by active investors DEPO Ventures and J&T Ventures\, with a strong focus on meaningful connections\, cross-border investment and new business opportunities. \nThe conference is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking investment and commercial partnerships within the CEE ecosystem. Its panel discussions will explore technology trends including AI infrastructure\, defence and space – sectors that increasingly depend on advanced computing\, specialised chips\, sensors and other semiconductor technologies. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, business angels and other active investors;\narrange one-to-one meetings through the conference networking platform;\nexplore cross-border investment and technology transfer opportunities;\nconnect with founders\, industry representatives and ecosystem organisations;\nattend expert panel discussions and practical workshops;\npresent their businesses to international investors through the Engaged Top Startup Selection.\n\nTwo days of venture investment and start-up opportunities\nThe first day is primarily designed for investors and will address topics such as capital formation\, exit strategies\, cross-border collaboration and emerging technology trends. \nThe second day will focus on founders and the Engaged Top Startup Selection. Up to 50 promising CEE start-ups will be selected across four funding stages: angel\, pre-seed\, seed and Series A. Each category will be evaluated by an investor jury\, giving selected companies an opportunity to pitch live and pursue direct funding discussions with international investors. \nThe programme will also include structured networking\, pre-arranged one-to-one meetings\, workshops and partner side events. Start-ups applying for the Top Startup Selection must purchase a founder ticket and be selected by the organisers to receive a pitching opportunity. \nEngaged Investments 2026\n21–22 October 2026\nNational House\, Prague\, Czech Republic \nLearn more\, purchase a ticket and apply for the Top Startup Selection
URL:https://czechsemiconductorcentre.cz/event/engaged-investments/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260923T154304
CREATED:20260204T094221Z
LAST-MODIFIED:20260204T094319Z
UID:1980-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:IMAPS Flash Conference 2026
DESCRIPTION:The IMAPS Flash Conference 2026 invites researchers\, engineers\, and industry professionals to meet in the heart of Moravia for two days of intensive scientific exchange and discussion. Organised by the Czech and Slovak Chapter of IMAPS (IMAPS CZ&SK) in partnership with Tomas Bata University in Zlín\, the conference will take place on 22–23 October 2026 at the Faculty of Applied Informatics\, Tomas Bata University in Zlín. \nIMAPS Flash Conference is a well-established European forum connecting senior and early-career scientists from academia and the electronics industry. The event focuses on sharing experimental and theoretical advances across the broad fields of electronics\, microelectronic technologies\, and electronic packaging. \nFlash Poster Session and Thematic Focus\nBuilding on the success of previous editions\, the 2026 conference will once again feature a flash poster session\, designed to stimulate open discussion\, rapid idea exchange\, and interdisciplinary interaction. \nA special thematic focus for this year will be “Comprehensive Semiconductor Analysis”\, reflecting the growing importance of integrated\, cross-disciplinary approaches in contemporary semiconductor research\, development\, and characterisation. \nTopics of Interest\nThe technical programme will cover a wide range of topics\, including: \n\n\nElectronic Assembly\, Packaging and Advanced Integration \n\n\nJoining\, Interconnection and Interface Technologies \n\n\nMaterials and Functional Structures for Microelectronics \n\n\nSimulation\, Modelling and Digital Design Tools \n\n\nReliability\, Testing and Characterisation \n\n\nSensors\, Microsystems\, Embedded and Control Systems \n\n\nQuantum\, Photonics and Future Semiconductor Technologies \n\n\nThis broad scope makes the conference highly relevant for both academic researchers and industrial practitioners working on current and emerging semiconductor technologies. \nKey Information\n\n\nDate: 22–23 October 2026 \n\n\nVenue: Tomas Bata University in Zlín\, Faculty of Applied Informatics \n\n\nConference Chair: doc. Ing. Milan Navrátil\, Ph.D. \n\n\nAbstract submission deadline: 1 June 2026 \n\n\nJoin the IMAPS Community in Zlín\nIMAPS Flash Conference 2026 offers a unique opportunity to present your work\, gain feedback from international experts\, and build new professional connections within the European microelectronics and semiconductor community. \nFor detailed information on registration\, submission guidelines\, and programme updates\, please visit:👉 https://cz.imapseurope.org/imaps-flash-conference-2026/👉 https://imaps.isibrno.cz/
URL:https://czechsemiconductorcentre.cz/event/imaps-flash-conference-2026/
LOCATION:Zlín\, Zlín\, Czech Republic
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260923T154304
CREATED:20260921T153646Z
LAST-MODIFIED:20260921T153646Z
UID:2720-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:INPHO Venture Summit 2026
DESCRIPTION:22–23 October 2026 | Palais de la Bourse\, Bordeaux\, France \nDeep-tech startups\, investors and industry leaders will meet in Bordeaux this October for the INPHO Venture Summit 2026\, an invitation-only event focused on the technologies and investment opportunities shaping the next industrial cycle. \nTaking place on 22–23 October 2026 at the Palais de la Bourse\, the tenth edition of INPHO will bring together venture capital investors\, limited partners\, corporate investors\, industrial companies and selected high-potential startups from Europe and beyond. \nA strong focus on semiconductors and enabling technologies\nThe summit covers several strategic deep-tech areas\, including semiconductors\, photonics and quantum technologies\, alongside AI and data infrastructure\, robotics\, defence and dual-use technologies\, energy and other critical infrastructure. The 2026 programme places particular emphasis on European technological sovereignty\, AI and industrial leadership. \nSemiconductors also feature directly in the programme. One of the main discussions will explore deep tech and sovereignty\, including strategic opportunities in semiconductors\, defence\, cyber and AI. Another session will address how Europe can build stronger deep-tech leadership through clusters\, competence centres\, platforms and capital at scale. \nFor semiconductor startups and SMEs\, the event therefore offers an opportunity to connect technology development with one of the factors essential for scaling innovation: access to investment and industrial partners. \nMeet investors and pitch your technology\nINPHO combines keynote sessions and expert discussions with startup pitches\, curated one-to-one meetings and high-level networking. Selected startups can present their solutions directly to investors and corporate representatives and explore potential investment and strategic partnerships. \nApplications from deep-tech startups are reviewed by an investor-led selection committee\, and applying is free of charge. Participation in the summit itself follows an invitation-only format. \nWhen: 22–23 October 2026\nWhere: Palais de la Bourse\, Bordeaux\, France\nWho: Deep-tech startups and scaleups\, investors\, LPs\, corporates and industry representatives \nInterested in taking part? \nVisit the INPHO Venture Summit 2026 website for the programme\, startup application and participation details.
URL:https://czechsemiconductorcentre.cz/event/inpho-venture-summit-2026/
LOCATION:Bordeaux\, Bordeaux \, France
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261023
DTEND;VALUE=DATE:20261024
DTSTAMP:20260923T154304
CREATED:20260716T095647Z
LAST-MODIFIED:20260716T095909Z
UID:2566-1792713600-1792799999@czechsemiconductorcentre.cz
SUMMARY:HM Fellowship Programme 2027/2028
DESCRIPTION:Researchers and academics with a strong track record in international teaching are invited to apply for the HM Fellowship Programme 2027/2028\, organised by Hochschule München University of Applied Sciences (HM). The programme offers an excellent opportunity to spend a semester in Munich while contributing to innovative teaching\, developing new international learning formats\, and strengthening academic collaboration across Europe. \nEstablished in 2007\, the HM Fellowship Programme has already welcomed more than 65 international fellows. For the 2027/2028 academic year\, up to three fellowships will be awarded to outstanding candidates from a wide range of disciplines. \nSuccessful applicants will: \n\nteach in English during either the Summer Semester 2027 (15 March – end of July 2027) or the Winter Semester 2027/2028 (1 October 2027 – mid-February 2028)\,\ncontribute to the development of innovative international teaching projects alongside HM academic staff\,\nhelp advance Hochschule München’s strategy of “internationalisation at home” through new teaching methods\, joint programmes and collaborative educational initiatives.\n\nFellowship support\nThe fellowship provides comprehensive financial support\, including: \n\nTeaching allowance of up to €9\,000\,\nAcademic project grant of €3\,000\,\nTravel and accommodation reimbursement of up to €6\,000\,\nadditional organisational support from HM’s International Office\, including assistance with accommodation and visa arrangements.\n\nWho can apply?\nApplicants should: \n\nhold a doctoral degree (PhD)\,\ndemonstrate an excellent academic record\,\nhave substantial experience in international teaching\,\npreferably come from an HM partner institution\, although applicants from other institutions with strong collaboration potential are also encouraged to apply.\n\nApplication deadline\nApplications must be submitted by 23 October 2026. The results of the selection process will be announced in early December 2026. \nFor further information about the fellowship and application process\, please contact the HM International Office – Staff Mobility Team at staff-mobility-io@hm.edu \nAll details available here:Call for Application
URL:https://czechsemiconductorcentre.cz/event/hm-fellowship-programme-2027-2028/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261026
DTEND;VALUE=DATE:20261028
DTSTAMP:20260923T154304
CREATED:20260720T064156Z
LAST-MODIFIED:20260720T064156Z
UID:2576-1792972800-1793145599@czechsemiconductorcentre.cz
SUMMARY:Deep Tech Summit
DESCRIPTION:Start-ups\, investors\, researchers and industry representatives are invited to attend Deep Tech Summit 2026\, a major Central and Eastern European event connecting technology innovators with investment\, business and partnership opportunities. \nTaking place in Warsaw on 26–27 October 2026\, the summit is expected to welcome more than 1\,000 participants from over 30 countries\, including over 250 start-ups and scale-ups\, 150 investors and business angels\, as well as corporate executives\, researchers\, engineers and representatives of the innovation ecosystem. \nThe event is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking new investors\, industrial partners and connections across the CEE region. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, corporate investors and business angels;\ntake part in dedicated matchmaking and one-to-one meetings;\npresent technologies and business propositions to potential partners;\nexplore financing and international growth opportunities;\nconnect with start-up founders\, industry executives\, researchers and innovation organisations;\ngain insights into emerging deep-tech trends and technology commercialisation.\n\nTwo days of investment\, innovation and networking\nThe first day\, Investment Day on 26 October\, will focus on matchmaking\, investor discussions\, VC Central and networking events. Participants will be able to meet selected technology projects and connect with investors\, corporations and potential business partners. \nThe CEE Summit on 27 October will feature the Business on Tech and Science to Business stages\, expert discussions\, keynote presentations\, workshops\, pitching competitions and further matchmaking opportunities. Side events will take place throughout both days. \nDeep Tech Summit provides semiconductor and hardware innovators with an opportunity to enter the wider CEE investment ecosystem\, strengthen their international visibility and establish relationships that can support funding\, commercialisation and expansion into new markets. \nDeep Tech Summit 2026\n26–27 October 2026\nWarsaw\, Poland \nLearn more and register on the official Deep Tech Summit website
URL:https://czechsemiconductorcentre.cz/event/deep-tech-summit/
LOCATION:Warsaw\, Poland\, Warsaw\, Poland
CATEGORIES:External Event
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20261101
DTEND;VALUE=DATE:20261105
DTSTAMP:20260923T154304
CREATED:20260625T071252Z
LAST-MODIFIED:20260625T071258Z
UID:2491-1793491200-1793836799@czechsemiconductorcentre.cz
SUMMARY:International Trade Partners Conference - ITPC 2026
DESCRIPTION:For more than 40 years\, the SEMI International Trade Partners Conference—ITPC has served as our premium networking and knowledge-sharing event for C-suite executives in the global semiconductor and microelectronics design and manufacturing supply chain. \nMulti‑Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\nThe global semiconductor industry is entering a defining era; one in which chips are no longer simply components inside devices\, but the foundation of the world’s digital economy\, AI infrastructure\, advanced manufacturing\, mobility\, communications\, energy systems\, healthcare innovation\, and national security. \nAs industry revenues accelerate toward multi-trillion-dollar scale\, the next phase of growth will not happen by chance. It must be designed through strategic investment\, resilient supply chains\, trusted global partnerships\, and coordinated innovation across the full electronics ecosystem. \nAnchored by the 2026 theme\, Multi-Trillion by Design: Semiconductors as the World’s New Critical Infrastructure\, ITPC will convene senior executives and decision-makers from across the semiconductor design and manufacturing supply chain to examine how the industry can shape this future with intention—balancing rapid AI-driven demand\, geopolitical complexity\, sustainability pressures\, workforce needs\, and the technology breakthroughs required to power the next decade of global progress. \nSessions\n\nKeynotes\nFuture Trends\nMarkets & Applications\nTechnology\nTrade & Politics\n\nJoin the Following Speakers at ITPC 2026\n\nASML\nRapidus\nIntel\nSkyWater\nAnd More!\n\nDon’t Miss Out!\nITPC offers intimate and exclusive access to visionaries on the front line. Mark your calendars now and plan on joining industry leaders at ITPC to contribute your perspective\, catch up with colleagues\, and forge new connections. \nThank You\nA sincere appreciation to the executives serving on the ITPC Global Committee. We thank the committee for their time and expertise in developing the ITPC program. \nITPC History\nThe SEMI International Trade Partners Conference—ITPC has championed industry coordination for over four decades. The event was originally designed to support collaboration and productive trans-pacific relationship amidst severe trade tensions that threatened supply chain prosperity in the 1980s. Having successfully contributed to a spirit of cooperation and mutual business interest\, the event continues to promote alignment in the era of globalization. It has developed into a premier executive thought-leadership and relationship-building event to support global industry executive-level engagement.
URL:https://czechsemiconductorcentre.cz/event/international-trade-partners-conference-itpc-2025/
LOCATION:Hawai\, HI\, United States
CATEGORIES:External Event
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END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261110
DTEND;VALUE=DATE:20261114
DTSTAMP:20260923T154305
CREATED:20260720T065200Z
LAST-MODIFIED:20260720T065200Z
UID:2582-1794268800-1794614399@czechsemiconductorcentre.cz
SUMMARY:SEMICON Europa 2026
DESCRIPTION:Join Europe’s Semiconductor Industry at SEMICON Europa 2026\n10–13 November 2026 | Messe München\, Munich\, Germany \nCompanies\, start-ups\, researchers\, investors and industry professionals are invited to attend SEMICON Europa 2026\, Europe’s leading event for the semiconductor manufacturing and design ecosystem. \nTaking place at Messe München from 10 to 13 November 2026 and co-located with electronica\, the event will bring together stakeholders from across the semiconductor value chain – from materials\, equipment and chip design to manufacturing\, advanced packaging\, applications and system integration. \nUnder the theme “Europe’s Next Era: Navigating the Perfect Storm”\, the 2026 edition will explore how Europe can build a more competitive\, resilient and sustainable semiconductor ecosystem amid technological transformation and a rapidly changing geopolitical environment. Discussions will address technological sovereignty\, innovation\, international cooperation and the long-term strength of Europe’s semiconductor industry. \nWhy attend SEMICON Europa?\nParticipants will have the opportunity to: \n\nmeet semiconductor manufacturers\, equipment and materials suppliers\, technology companies and system integrators;\ndiscover emerging technologies and developments across the semiconductor value chain;\nattend expert conferences\, presentations and industry discussions;\nconnect with potential customers\, suppliers\, research partners and investors;\nexplore opportunities in chip design\, manufacturing\, advanced packaging\, MEMS\, imaging sensors and smart manufacturing;\nengage with the wider European and international semiconductor ecosystem.\n\nThe programme is expected to include specialist conferences and initiatives covering areas such as advanced packaging\, fab management\, MEMS and imaging sensors\, smart manufacturing\, executive-level industry dialogue and start-up innovation. \nChips Venture Forum at SEMICON Europa\nSEMICON Europa 2026 will also provide the setting for the final event of the Chips Venture Forum\, an initiative connecting promising semiconductor innovators with investors\, corporate partners and European institutions. \nThe final event is intended for selected semiconductor-related start-ups established or legally registered in a country hosting an operational Competence Centre within the European network\, as well as beneficiaries of the European Innovation Council. \nOrganised within the aCCCess project by Blumorpho in collaboration with DG CONNECT and the European Innovation Council\, the Chips Venture Forum supports the development\, financing and industrial adoption of European semiconductor technologies. It connects start-ups and scale-ups with venture capital and private equity funds\, industrial companies\, OEMs\, Competence Centres and institutional stakeholders. \nSelected start-ups will gain access to a broader ecosystem that may include: \n\nrepresentatives of the European Commission and the European Innovation Council;\nsemiconductor-focused investors and venture capital funds;\ncorporate partners and potential customers;\nsemiconductor equipment and technology providers;\nOEMs\, system integrators and industrial end-users;\nEuropean Chips Competence Centres\, Pilot Lines and the European Design Platform.\n\nThe forum offers semiconductor innovators an opportunity to present their solutions\, hold qualified discussions with investors and industrial partners\, increase their visibility and explore funding and commercialisation opportunities. \nFurther information about the Munich programme and the participation of selected start-ups is expected to be published by the organisers. \nSEMICON Europa 2026\n10–13 November 2026\nMesse München\nMunich\, Germany \nLearn more about SEMICON Europa 2026 \nLearn more about the Chips Venture Forum
URL:https://czechsemiconductorcentre.cz/event/semicon-europa-2026/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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