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X-WR-CALDESC:Events for Czech Semiconductor Centre
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TZID:Europe/Prague
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260930
DTEND;VALUE=DATE:20261002
DTSTAMP:20260922T115041
CREATED:20260619T081449Z
LAST-MODIFIED:20260619T081659Z
UID:2482-1790726400-1790899199@czechsemiconductorcentre.cz
SUMMARY:FIRST by FMD
DESCRIPTION:FIRST – Fast Innovation through Research in Semiconductor Technologies\nThe European conference on microelectronic trends\, roadmaps and strategic alignment \n\n  \n\nFIRST is a high-level trend forum for those who turn technology into industrial leadership. Semiconductors are the foundation of economic resilience\, technological sovereignty\, security\, and sustainable growth. With initiatives such as the EU Chips Act and Germany’s Hightech Agenda\, the strategic importance of European microelectronics is greater than ever. \nFIRST – Fast Innovation through Research in Semiconductor Technologies – brings together decision-makers from industry\, policy and research. With a clearly curated program\, FIRST provides strategic insights into emerging technologies\, industrial roadmaps and future infrastructure developments. \nAt FIRST\, leaders from across the semiconductor value chain engage with representatives from key application sectors including AI\, automotive\, healthcare\, industrial manufacturing\, telecommunications and energy. For those driving innovation\, product strategies or technology roadmaps\, this is where Europe’s semiconductor future becomes business reality. \nProgram highlights at FIRST 2026\n\nGain early insights into emerging technology and market trends\nUnlock strategic partnerships across the full value chain\nStrengthen your innovation-to-market capabilities\nExpand your network with Europe’s key semiconductor decision-makers\n\nA further strategic focus is the APECS pilot line\, implemented by the Research Fab Microelectronics Germany (FMD). It provides an industry-oriented environment for advanced packaging and design as key enabling technologies for chiplet architectures and heterogeneous integration\, strengthening innovation across the European value chain.
URL:https://czechsemiconductorcentre.cz/event/first-by-fmd/
LOCATION:Berlin\, Berlin\, Germany
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/06/Eventankuendigung-FHG-web.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261001
DTEND;VALUE=DATE:20261003
DTSTAMP:20260922T115041
CREATED:20260902T090530Z
LAST-MODIFIED:20260902T090600Z
UID:2667-1790812800-1790985599@czechsemiconductorcentre.cz
SUMMARY:Micro & Nano Event 2026
DESCRIPTION:Are you active in the fields of micro- and nanotechnology\, advanced materials\, or precision engineering\, and looking for new business or technology partners? Join the international matchmaking event Micro & Nano Event 2026\, which will take place on October 1–2 in Besançon\, France.\nMicro & Nano Event 2026 will bring together European small and medium-sized enterprises\, startups\, clusters\, associations\, and research organizations active in the fields of micro- and nanotechnology and other high-tech sectors. The event will take place as part of the Micronora international trade fair\, which focuses on microtechnology\, precision engineering\, and nanotechnology. \nThe main component of the program will be pre-arranged B2B meetings\, which will allow participants to actively seek out new business and technology partners\, suppliers\, or partners for research collaboration. Companies will also have the opportunity to showcase their technologies\, expertise\, and services to international participants. \nPresent your company during the pitch session\nCzech startups and innovative small and medium-sized enterprises can also actively sign up to give their own pitch and present their products\, technologies\, or innovative solutions to an international audience during the event. The pitch session will take place on October 2 and will offer another opportunity to raise the company’s profile and establish contacts with potential international partners. \nRegistration for your own pitch takes place via the Micro & Nano Event 2026 platform. \nWho is this event intended for?\n\nsmall and medium-sized enterprises (SMEs)\,\nstartups\,\nclusters and associations\,\nresearch organizations\, laboratories\, and technology centers.\n\nIt is suitable for organizations that want to showcase their offerings\, technologies\, expertise\, and services\, as well as for those seeking new technologies\, suppliers\, experts\, or partners for business\, technological\, or research collaboration. \nWhat areas does the event focus on?\nThe main technological topics include: \n\nmicro- and nanosystems —intelligent systems\, sensors\, actuators\, and motors; micro- and nanocomponents; and embedded and interconnected systems\,\nmaterials and surface treatments – new and lightweight materials\, surface treatments\, smart\, flexible\, conductive\, or biocompatible materials\,\nmanufacturing technologies and processes – micro- and nanomanufacturing\, micromechatronics\, microelectronics\, 3D printing and additive manufacturing\, micro- and nanorobotics\, assembly or laser technologies\,\ndigitization – artificial intelligence\, computer vision\, non-destructive testing and inspection\, software and algorithms\, virtual and augmented reality\, and the Internet of Things\,\nElectronics and Optics.\n\nThe Enterprise Europe Network will be available to you on-site\nAn Enterprise Europe Network consultant from the Czech Republic will also be attending the event\, and Czech companies can approach him directly during the event. He will help them\, for example\, navigate the matchmaking process\, find relevant international partners\, or explore opportunities for further international collaboration. \nAmong other things\, the Enterprise Europe Network helps companies find business and research partners and organizes brokerage and matchmaking events aimed at fostering cross-border partnerships. \nEnterprise Europe Network Program\nOctober 1\, 2026\n\nin-person B2B meetings\,\nnetworking event.\n\nOctober 2\, 2026\n\na pitch session for startups and innovative companies with the option to actively register\,\ninformation on European instruments to support innovation\,\na discussion on technological calls\,\nIn-person B2B meetings.\n\nPractical Information\nWhere: Parc des Expositions de Besançon\, Besançon\, France\nTicket price: 100 EUR (for clients with discount code: EEN-CLIENT-MNE 2026)\n– includes admission to the Micronora trade show; Enterprise Europe Network matchmaking at the trade fair is free of charge. \nOn the event platform\, you can view the list of registered participants in advance and select the organizations you’d like to meet during the matchmaking sessions. \nProposed Route\n\nflight from Prague to Paris-Orly\,\nsubway / transfer from Orly Airport → Gare de Lyon\,\nTGV train from Gare de Lyon → Besançon (about 2 hours).\n\nSource: https://een.gov.cz/en/kalendar-akci/micro-nano-event-2026/ \nRegistration here: https://www.b2match.com/e/micro-nano-event-2026/sign-up/create-account
URL:https://czechsemiconductorcentre.cz/event/micro-nano-event-2026/
LOCATION:Besançon\, Besançon\, France
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/09/Snimek-obrazovky-2026-09-02-110312.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261007
DTEND;VALUE=DATE:20261010
DTSTAMP:20260922T115041
CREATED:20260409T065725Z
LAST-MODIFIED:20260409T065928Z
UID:2196-1791331200-1791590399@czechsemiconductorcentre.cz
SUMMARY:ASDAM (Advanced Semiconductor Devices and Microsystems)
DESCRIPTION:𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝙞𝙨 𝙘𝙤𝙢𝙞𝙣𝙜 𝙩𝙤 𝘽𝙧𝙖𝙩𝙞𝙨𝙡𝙖𝙫𝙖.\nThe 𝟭𝟲𝘁𝗵 𝗜𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 on 𝗔𝗱𝘃𝗮𝗻𝗰𝗲𝗱 𝗦𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗮𝗻𝗱 𝗠𝗶𝗰𝗿𝗼𝘀𝘆𝘀𝘁𝗲𝗺𝘀 will take place on 𝟳–𝟵 𝗢𝗰𝘁𝗼𝗯𝗲𝗿 𝟮𝟬𝟮𝟲 𝗮𝘁 𝘁𝗵𝗲 𝗥𝗮𝗱𝗶𝘀𝘀𝗼𝗻 𝗕𝗹𝘂 𝗖𝗮𝗿𝗹𝘁𝗼𝗻 𝗛𝗼𝘁𝗲𝗹 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮\, 𝗦𝗹𝗼𝘃𝗮𝗸𝗶𝗮. \nThe conference is 𝗳𝗼𝗰𝘂𝘀𝗲𝗱 𝗼𝗻 the latest research and development in semiconductor devices\, microsystems\, materials\, and related technologies. Its scope includes topics such as WBG and UWBG materials\, semiconductor structures and devices\, characterization and modelling\, sensors and microsystems\, photonics\, IC design\, packaging technologies\, and AI in electronics. \n𝗔𝗦𝗗𝗔𝗠 𝟮𝟬𝟮𝟲 𝘄𝗶𝗹𝗹 𝗯𝗿𝗶𝗻𝗴 𝘁𝗼𝗴𝗲𝘁𝗵𝗲𝗿 researchers\, scientists\, university experts\, doctoral candidates\, and industry 𝗽𝗿𝗼𝗳𝗲𝘀𝘀𝗶𝗼𝗻𝗮𝗹𝘀 𝗳𝗿𝗼𝗺 𝗮𝗹𝗹 𝗼𝘃𝗲𝗿 𝘁𝗵𝗲 𝘄𝗼𝗿𝗹𝗱. Giving participants an opportunity 𝘁𝗼 𝗽𝗿𝗲𝘀𝗲𝗻𝘁 𝘁𝗵𝗲𝗶𝗿 𝘄𝗼𝗿𝗸 𝘄𝗶𝘁𝗵𝗶𝗻 𝗮 𝗿𝗲𝘀𝗽𝗲𝗰𝘁𝗲𝗱 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝗳𝗼𝗿𝘂𝗺. Its 𝗶𝗻𝘁𝗲𝗿𝗻𝗮𝘁𝗶𝗼𝗻𝗮𝗹 𝘀𝗰𝗶𝗲𝗻𝘁𝗶𝗳𝗶𝗰 𝗰𝗼𝗺𝗺𝗶𝘁𝘁𝗲𝗲 includes 𝗲𝘅𝗽𝗲𝗿𝘁𝘀 from leading institutions in multiple countries\, and the proceedings will be published by the 𝗜𝗘𝗘𝗘 𝗘𝗹𝗲𝗰𝘁𝗿𝗼𝗻 𝗗𝗲𝘃𝗶𝗰𝗲𝘀 𝗦𝗼𝗰𝗶𝗲𝘁𝘆. \n𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀 𝗶𝘀 𝗻𝗼𝘄 𝗼𝗽𝗲𝗻. 𝗬𝗼𝘂 𝗰𝗮𝗻 𝗳𝗶𝗻𝗱 𝗮𝗹𝗹 𝘁𝗵𝗲 𝗶𝗻𝗳𝗼𝗿𝗺𝗮𝘁𝗶𝗼𝗻 𝗼𝗻 𝗔𝗦𝗗𝗔𝗠 𝘄𝗲𝗯𝗽𝗮𝗴𝗲: 𝘄𝘄𝘄.𝗮𝘀𝗱𝗮𝗺.𝘀𝗸 \n𝗔𝗯𝘀𝘁𝗿𝗮𝗰𝘁 𝘀𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻 𝘀𝘁𝗮𝗿𝘁𝗲𝗱 𝗼𝗻 𝟭 𝗔𝗽𝗿𝗶𝗹 𝟮𝟬𝟮𝟲\, 𝗮𝗻𝗱 𝘁𝗵𝗲 𝗱𝗲𝗮𝗱𝗹𝗶𝗻𝗲 𝗳𝗼𝗿 𝗮𝗯𝘀𝘁𝗿𝗮𝗰𝘁𝘀 𝗶𝘀 𝟭 𝗝𝘂𝗻𝗲 𝟮𝟬𝟮𝟲. \n𝗪𝗲 𝗶𝗻𝘃𝗶𝘁𝗲 researchers\, scientists\, doctoral candidates\, and experts from academia working in semiconductor devices\, microsystems\, materials\, photonics\, sensors\, modelling\, packaging\, IC design\, and related fields to submit their abstracts and become part of ASDAM 2026. \n𝗝𝗼𝗶𝗻 𝘂𝘀 𝗶𝗻 𝗕𝗿𝗮𝘁𝗶𝘀𝗹𝗮𝘃𝗮 𝗮𝗻𝗱 𝘀𝗵𝗮𝗿𝗲 𝘆𝗼𝘂𝗿 𝗿𝗲𝘀𝗲𝗮𝗿𝗰𝗵 with an international community shaping the future of semiconductors and microsystems.
URL:https://czechsemiconductorcentre.cz/event/asdam-advanced-semiconductor-devices-and-microsystems/
LOCATION:Bratislava\, Bratislava\, Slovakia (Slovak Republic)
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/04/1775634398872.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261012T130000
DTEND;TZID=Europe/Prague:20261012T160000
DTSTAMP:20260922T115041
CREATED:20260922T073921Z
LAST-MODIFIED:20260922T074007Z
UID:2727-1791810000-1791820800@czechsemiconductorcentre.cz
SUMMARY:Your Gateway to European Semiconductor Technologies: CCCs\, Pilot Lines & EuroCDP
DESCRIPTION:This joint webinar brings together three national semiconductor competence centres — Czech Semiconductor Centre\, SK Chips and CC Chip.si — with key European semiconductor infrastructure: the European Chips Design Platform (EuroCDP) and the PIXEurope and NanoIC Pilot Lines. \nParticipants will gain a practical overview of the services available to companies\, startups\, SMEs\, researchers and other innovators across Europe. The session will introduce opportunities in chip design\, access to advanced technologies and pilot-line infrastructure\, design tools\, IP libraries and PDKs\, as well as training and technical support. Speakers will also explain how users can access these services and how the competence centres can help them navigate the European semiconductor ecosystem and identify the most suitable support for their projects. \nThe webinar will conclude with an open discussion and Q&A\, providing participants with an opportunity to discuss their needs directly with representatives of the competence centres\, EuroCDP and the Pilot Lines. \nThis webinar is free of charge. Registration open here.
URL:https://czechsemiconductorcentre.cz/event/your-gateway-to-european-semiconductor-technologies-cccs-pilot-lines-eurocdp/
LOCATION:on-line on Teams
CATEGORIES:Organized by CSC
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/09/LinkedIn-event.png
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=Europe/Prague:20261014T093000
DTEND;TZID=Europe/Prague:20261014T110000
DTSTAMP:20260922T115041
CREATED:20260922T072048Z
LAST-MODIFIED:20260922T072128Z
UID:2724-1791970200-1791975600@czechsemiconductorcentre.cz
SUMMARY:SME Feedback Workshop on the Chips Act 2.0
DESCRIPTION:The European Commission is preparing the Chips Act 2.0\, a measure aimed at strengthening the European semiconductor ecosystem\, increasing its competitiveness and resilience\, and supporting the entire value chain. Small and medium-sized enterprises and other stakeholders in the semiconductor and electronics sectors can share their comments on the proposal during an online workshop on October 14\, 2026\, or in writing.\nThe Chips Act 2.0 is a proposal by the European Commission aimed at strengthening the European semiconductor ecosystem\, increasing its resilience and competitiveness\, and supporting the entire value chain. The proposal also aims to improve conditions for European companies and facilitate their access to support tools and infrastructure. \nCompanies can influence the form of the measures being prepared\nTo ensure that the Chips Act reflects the real needs of companies in the ecosystem\, the Enterprise Europe Network\, in collaboration with the European Commission\, is organizing an event titled “SME Feedback Workshop on the Chips Act 2.0.” \nDuring the workshop\, participants will learn about the proposal and will have the opportunity to share their experiences\, needs\, and feedback directly with representatives of the European Commission. \nThe discussion will cover topics such as: \n\nthe role of SMEs in the European semiconductor and electronics ecosystem\,\naccess to support tools\, pilot lines\, infrastructure\, centers of excellence\, and EU programs\,\nany administrative burdens and barriers to accessing support\,\nthe involvement of various stakeholders across the value chain\,\nspecific recommendations for the next steps in the legislative process.\n\n\nWho is this workshop intended for?\nThe workshop is particularly relevant for small and medium-sized enterprises operating in the fields of semiconductors\, microelectronics\, and electronics. Participating companies may include\, for example\, those involved in the manufacture and supply of semiconductors\, chip development\, electronic components\, manufacturing equipment\, testing\, and packaging\, as well as other players in the European semiconductor and electronics value chain. \nThe event will take place online on October 14\, 2026\, from 9:30 a.m. to 11:00 a.m.\, and the program will be conducted in English. Participation is free\, but prior registration is required. \nCompanies can also share feedback in writing\nCompanies do not have to provide their feedback only during the workshop. They can also submit their experiences\, needs\, and comments on the Chips Act 2.0 proposal in writing through the Enterprise Europe Network. \nIs your company dealing with issues related to support availability\, infrastructure\, pilot lines\, administrative requirements\, or other obstacles in the semiconductor industry? \nWe would appreciate it if you would send us your suggestions. We will help you prepare and draft your feedback\, which we will forward to the relevant organizations.
URL:https://czechsemiconductorcentre.cz/event/sme-feedback-workshop-on-the-chips-act-2-0/
LOCATION:on-line
CATEGORIES:External Event
ATTACH;FMTTYPE=image/png:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/09/Snimek-obrazovky-2026-09-22-091627.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261021
DTEND;VALUE=DATE:20261023
DTSTAMP:20260922T115041
CREATED:20260720T064502Z
LAST-MODIFIED:20260720T064502Z
UID:2579-1792540800-1792713599@czechsemiconductorcentre.cz
SUMMARY:Engaged Investments
DESCRIPTION:Start-up founders and investors are invited to attend Engaged Investments 2026\, an exclusive venture capital conference bringing together active investors and ambitious founders from Central and Eastern Europe and the Baltic region. \nTaking place at the National House in Prague on 21–22 October 2026\, the conference is expected to welcome up to 500 participants\, including approximately 250 venture investors\, 150 start-up founders and more than 40 speakers. The event is organised by active investors DEPO Ventures and J&T Ventures\, with a strong focus on meaningful connections\, cross-border investment and new business opportunities. \nThe conference is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking investment and commercial partnerships within the CEE ecosystem. Its panel discussions will explore technology trends including AI infrastructure\, defence and space – sectors that increasingly depend on advanced computing\, specialised chips\, sensors and other semiconductor technologies. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, business angels and other active investors;\narrange one-to-one meetings through the conference networking platform;\nexplore cross-border investment and technology transfer opportunities;\nconnect with founders\, industry representatives and ecosystem organisations;\nattend expert panel discussions and practical workshops;\npresent their businesses to international investors through the Engaged Top Startup Selection.\n\nTwo days of venture investment and start-up opportunities\nThe first day is primarily designed for investors and will address topics such as capital formation\, exit strategies\, cross-border collaboration and emerging technology trends. \nThe second day will focus on founders and the Engaged Top Startup Selection. Up to 50 promising CEE start-ups will be selected across four funding stages: angel\, pre-seed\, seed and Series A. Each category will be evaluated by an investor jury\, giving selected companies an opportunity to pitch live and pursue direct funding discussions with international investors. \nThe programme will also include structured networking\, pre-arranged one-to-one meetings\, workshops and partner side events. Start-ups applying for the Top Startup Selection must purchase a founder ticket and be selected by the organisers to receive a pitching opportunity. \nEngaged Investments 2026\n21–22 October 2026\nNational House\, Prague\, Czech Republic \nLearn more\, purchase a ticket and apply for the Top Startup Selection
URL:https://czechsemiconductorcentre.cz/event/engaged-investments/
LOCATION:Prague\, Prague\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/jpeg:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/07/z.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260922T115041
CREATED:20260204T094221Z
LAST-MODIFIED:20260204T094319Z
UID:1980-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:IMAPS Flash Conference 2026
DESCRIPTION:The IMAPS Flash Conference 2026 invites researchers\, engineers\, and industry professionals to meet in the heart of Moravia for two days of intensive scientific exchange and discussion. Organised by the Czech and Slovak Chapter of IMAPS (IMAPS CZ&SK) in partnership with Tomas Bata University in Zlín\, the conference will take place on 22–23 October 2026 at the Faculty of Applied Informatics\, Tomas Bata University in Zlín. \nIMAPS Flash Conference is a well-established European forum connecting senior and early-career scientists from academia and the electronics industry. The event focuses on sharing experimental and theoretical advances across the broad fields of electronics\, microelectronic technologies\, and electronic packaging. \nFlash Poster Session and Thematic Focus\nBuilding on the success of previous editions\, the 2026 conference will once again feature a flash poster session\, designed to stimulate open discussion\, rapid idea exchange\, and interdisciplinary interaction. \nA special thematic focus for this year will be “Comprehensive Semiconductor Analysis”\, reflecting the growing importance of integrated\, cross-disciplinary approaches in contemporary semiconductor research\, development\, and characterisation. \nTopics of Interest\nThe technical programme will cover a wide range of topics\, including: \n\n\nElectronic Assembly\, Packaging and Advanced Integration \n\n\nJoining\, Interconnection and Interface Technologies \n\n\nMaterials and Functional Structures for Microelectronics \n\n\nSimulation\, Modelling and Digital Design Tools \n\n\nReliability\, Testing and Characterisation \n\n\nSensors\, Microsystems\, Embedded and Control Systems \n\n\nQuantum\, Photonics and Future Semiconductor Technologies \n\n\nThis broad scope makes the conference highly relevant for both academic researchers and industrial practitioners working on current and emerging semiconductor technologies. \nKey Information\n\n\nDate: 22–23 October 2026 \n\n\nVenue: Tomas Bata University in Zlín\, Faculty of Applied Informatics \n\n\nConference Chair: doc. Ing. Milan Navrátil\, Ph.D. \n\n\nAbstract submission deadline: 1 June 2026 \n\n\nJoin the IMAPS Community in Zlín\nIMAPS Flash Conference 2026 offers a unique opportunity to present your work\, gain feedback from international experts\, and build new professional connections within the European microelectronics and semiconductor community. \nFor detailed information on registration\, submission guidelines\, and programme updates\, please visit:👉 https://cz.imapseurope.org/imaps-flash-conference-2026/👉 https://imaps.isibrno.cz/
URL:https://czechsemiconductorcentre.cz/event/imaps-flash-conference-2026/
LOCATION:Zlín\, Zlín\, Czech Republic
CATEGORIES:External Event
ATTACH;FMTTYPE=image/webp:https://czechsemiconductorcentre.cz/wp-content/uploads/2026/02/SPICE_cipy___webp_801_533.webp
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20261022
DTEND;VALUE=DATE:20261024
DTSTAMP:20260922T115041
CREATED:20260921T153646Z
LAST-MODIFIED:20260921T153646Z
UID:2720-1792627200-1792799999@czechsemiconductorcentre.cz
SUMMARY:INPHO Venture Summit 2026
DESCRIPTION:22–23 October 2026 | Palais de la Bourse\, Bordeaux\, France \nDeep-tech startups\, investors and industry leaders will meet in Bordeaux this October for the INPHO Venture Summit 2026\, an invitation-only event focused on the technologies and investment opportunities shaping the next industrial cycle. \nTaking place on 22–23 October 2026 at the Palais de la Bourse\, the tenth edition of INPHO will bring together venture capital investors\, limited partners\, corporate investors\, industrial companies and selected high-potential startups from Europe and beyond. \nA strong focus on semiconductors and enabling technologies\nThe summit covers several strategic deep-tech areas\, including semiconductors\, photonics and quantum technologies\, alongside AI and data infrastructure\, robotics\, defence and dual-use technologies\, energy and other critical infrastructure. The 2026 programme places particular emphasis on European technological sovereignty\, AI and industrial leadership. \nSemiconductors also feature directly in the programme. One of the main discussions will explore deep tech and sovereignty\, including strategic opportunities in semiconductors\, defence\, cyber and AI. Another session will address how Europe can build stronger deep-tech leadership through clusters\, competence centres\, platforms and capital at scale. \nFor semiconductor startups and SMEs\, the event therefore offers an opportunity to connect technology development with one of the factors essential for scaling innovation: access to investment and industrial partners. \nMeet investors and pitch your technology\nINPHO combines keynote sessions and expert discussions with startup pitches\, curated one-to-one meetings and high-level networking. Selected startups can present their solutions directly to investors and corporate representatives and explore potential investment and strategic partnerships. \nApplications from deep-tech startups are reviewed by an investor-led selection committee\, and applying is free of charge. Participation in the summit itself follows an invitation-only format. \nWhen: 22–23 October 2026\nWhere: Palais de la Bourse\, Bordeaux\, France\nWho: Deep-tech startups and scaleups\, investors\, LPs\, corporates and industry representatives \nInterested in taking part? \nVisit the INPHO Venture Summit 2026 website for the programme\, startup application and participation details.
URL:https://czechsemiconductorcentre.cz/event/inpho-venture-summit-2026/
LOCATION:Bordeaux\, Bordeaux \, France
CATEGORIES:External Event
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DTSTART;VALUE=DATE:20261023
DTEND;VALUE=DATE:20261024
DTSTAMP:20260922T115041
CREATED:20260716T095647Z
LAST-MODIFIED:20260716T095909Z
UID:2566-1792713600-1792799999@czechsemiconductorcentre.cz
SUMMARY:HM Fellowship Programme 2027/2028
DESCRIPTION:Researchers and academics with a strong track record in international teaching are invited to apply for the HM Fellowship Programme 2027/2028\, organised by Hochschule München University of Applied Sciences (HM). The programme offers an excellent opportunity to spend a semester in Munich while contributing to innovative teaching\, developing new international learning formats\, and strengthening academic collaboration across Europe. \nEstablished in 2007\, the HM Fellowship Programme has already welcomed more than 65 international fellows. For the 2027/2028 academic year\, up to three fellowships will be awarded to outstanding candidates from a wide range of disciplines. \nSuccessful applicants will: \n\nteach in English during either the Summer Semester 2027 (15 March – end of July 2027) or the Winter Semester 2027/2028 (1 October 2027 – mid-February 2028)\,\ncontribute to the development of innovative international teaching projects alongside HM academic staff\,\nhelp advance Hochschule München’s strategy of “internationalisation at home” through new teaching methods\, joint programmes and collaborative educational initiatives.\n\nFellowship support\nThe fellowship provides comprehensive financial support\, including: \n\nTeaching allowance of up to €9\,000\,\nAcademic project grant of €3\,000\,\nTravel and accommodation reimbursement of up to €6\,000\,\nadditional organisational support from HM’s International Office\, including assistance with accommodation and visa arrangements.\n\nWho can apply?\nApplicants should: \n\nhold a doctoral degree (PhD)\,\ndemonstrate an excellent academic record\,\nhave substantial experience in international teaching\,\npreferably come from an HM partner institution\, although applicants from other institutions with strong collaboration potential are also encouraged to apply.\n\nApplication deadline\nApplications must be submitted by 23 October 2026. The results of the selection process will be announced in early December 2026. \nFor further information about the fellowship and application process\, please contact the HM International Office – Staff Mobility Team at staff-mobility-io@hm.edu \nAll details available here:Call for Application
URL:https://czechsemiconductorcentre.cz/event/hm-fellowship-programme-2027-2028/
LOCATION:München\, München\, Germany
CATEGORIES:External Event
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DTSTART;VALUE=DATE:20261026
DTEND;VALUE=DATE:20261028
DTSTAMP:20260922T115041
CREATED:20260720T064156Z
LAST-MODIFIED:20260720T064156Z
UID:2576-1792972800-1793145599@czechsemiconductorcentre.cz
SUMMARY:Deep Tech Summit
DESCRIPTION:Start-ups\, investors\, researchers and industry representatives are invited to attend Deep Tech Summit 2026\, a major Central and Eastern European event connecting technology innovators with investment\, business and partnership opportunities. \nTaking place in Warsaw on 26–27 October 2026\, the summit is expected to welcome more than 1\,000 participants from over 30 countries\, including over 250 start-ups and scale-ups\, 150 investors and business angels\, as well as corporate executives\, researchers\, engineers and representatives of the innovation ecosystem. \nThe event is particularly relevant to semiconductor\, hardware and advanced-technology start-ups seeking new investors\, industrial partners and connections across the CEE region. \nWhy attend?\nParticipants will have the opportunity to: \n\nmeet venture capital funds\, corporate investors and business angels;\ntake part in dedicated matchmaking and one-to-one meetings;\npresent technologies and business propositions to potential partners;\nexplore financing and international growth opportunities;\nconnect with start-up founders\, industry executives\, researchers and innovation organisations;\ngain insights into emerging deep-tech trends and technology commercialisation.\n\nTwo days of investment\, innovation and networking\nThe first day\, Investment Day on 26 October\, will focus on matchmaking\, investor discussions\, VC Central and networking events. Participants will be able to meet selected technology projects and connect with investors\, corporations and potential business partners. \nThe CEE Summit on 27 October will feature the Business on Tech and Science to Business stages\, expert discussions\, keynote presentations\, workshops\, pitching competitions and further matchmaking opportunities. Side events will take place throughout both days. \nDeep Tech Summit provides semiconductor and hardware innovators with an opportunity to enter the wider CEE investment ecosystem\, strengthen their international visibility and establish relationships that can support funding\, commercialisation and expansion into new markets. \nDeep Tech Summit 2026\n26–27 October 2026\nWarsaw\, Poland \nLearn more and register on the official Deep Tech Summit website
URL:https://czechsemiconductorcentre.cz/event/deep-tech-summit/
LOCATION:Warsaw\, Poland\, Warsaw\, Poland
CATEGORIES:External Event
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