Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging

We kindly invite you to join the Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging

on September 18, 2025
15:30 – 17:30 CEST
in Grenoble, France, at the World Trade Center.

The workshop will take place in conjunction with and is kindly hosted by the EMPC 2025 | The 25th European Microelectronics & Packaging Conference (EMPC 2025).

Chips JU is currently preparing the launch of two calls for Advanced Packaging. The goal of the workshop is to inform the community about the call content and to initiate consortia building.

The respective draft call https://www.chips-ju.europa.eu/CallDetails/?id=2af90e5b-d984-f011-b4cc-000d3ab33b4d has been published on September 2, 2025.

Please register here for the workshop: https://pretix.eu/eposs/LabToFab/. The workshop will take place onsite only.