Heterogenous Integration: Bolstering Europe’s Resilience
June 25 - June 27
Themed Heterogenous Integration: Bolstering Europe’s Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe’s semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging companies. This Summit is a platform for gathering and exchange of knowledge and fostering of collaborations within the semiconductor sector.
Attendees will have several opportunities for B2B matching, including networking receptions, coffee breaks, lunches, and a unique Networking Dinner Cruise along the beautiful Elbe River.