Czech Semiconductor Centre was honoured to meet a high-level delegation from the Bavarian State Ministry of Economic Affairs, Regional Development and Energy. The meeting took place at the Advanced Chip Design and Research Centre (ACDRC) on Thursday June 12. Led by Vice Minister Tobias Gotthardt, the visit marked an important milestone in fostering deeper collaboration within the European semiconductor ecosystem.
The delegation, which included Dr. Patricia Callies, Head of the Industry Division at the Bavarian Ministry, was welcomed by Stanislav Cerny, President of the Czech National Semiconductor Cluster (CNSC), along with leading academic and industry experts in chip design, cybersecurity, and education. Experts from the Czech Semiconductor Centre, headed by its director Karel Masarik and his deputy Jana Drbohlavova, presented future possibilities of cooperation with the Czech Competence Centre focused in chips and semiconductors.
Whole discussions shared ambitions for the development of the semiconductor industry, highlighting the growing importance of cross-border cooperation. Both Czech and Bavarian representatives emphasized the strategic role of the European Semiconductor Regions Alliance (ESRA) in building a resilient and interconnected European chip value chain. As active ESRA members, both regions reaffirmed their commitment to shaping the future of European semiconductor policy and innovation.
Dr. Callies presented the Bavarian Chip-Design-Center (BCDC), an initiative aligned closely with CSC’s mission. Like its Czech counterpart, BCDC focuses on empowering small and medium-sized enterprises (SMEs) and startups in chip innovation. A key area of synergy discussed was RISC-V technology—an open standard with significant momentum in both Bavaria and the Czech Republic, supported notably by Codasip, whose parent company is headquartered in Bavaria.
The conversation also explored collaboration opportunities in AI and cybersecurity applications, particularly in energy grid management—an increasingly vital area in today’s digital and green transitions. Dr. Callies extended a formal invitation to CSC to participate in future joint initiatives, further cementing the spirit of European cooperation. In addition, the Bavarian delegation introduced the Bavarian Chip Alliance as a potential partner. Both parties expressed keen interest in forging closer ties between their respective innovation ecosystems. The visit concluded with mutual agreement on continuing dialogue and exploring concrete projects that can bring mutual benefits to both regions and contribute to Europe’s technological sovereignty.