In early February 2026, representatives of the Czech Semiconductor Centre actively participated in two significant events in Brussels, aimed at fostering cooperation and innovation within the European semiconductor ecosystem: the ECS Brokerage Event 2026 and the aCCCess – ENCCC First Annual Meeting.
The ECS Brokerage Event 2026, held on 4–5 February 2026 at The EGG in Brussels, brought together a vibrant community from across the European Electronic Components and Systems (ECS) sector. This key annual gathering focused on facilitating the exchange of innovative research and innovation (R&I) project ideas, networking with industry peers, and creating strong project consortia in preparation for the upcoming Chips JU Calls 2026.
With over 750 visitors and more than 70 pitched project ideas, the event underscored its role as a central meeting point for stakeholders aiming to transform ideas into concrete collaborations and funded initiatives. The brokerage format allowed participants to present their concepts, connect with potential partners, and refine proposals tailored to the substantial funding opportunities ahead — including a budget of around €200 million earmarked for the new calls.
The event was co-organised by the industry associations AENEAS, EPoSS and INSIDE, and combined brokerage activities tailored specifically for the ECS community.
Immediately following the Brokerage Event, the aCCCess – ENCCC First Annual Meeting convened representatives from across the European Network of Chips Competence Centres (ENCCC) to share progress, align on objectives, and report to senior stakeholders from the Chips Joint Undertaking. The ENCCC community plays a pivotal role in bringing together capabilities from 27 CCCs across 25 countries, enhancing synergies in technology transfer, training and services, and accelerating Europe’s competitive edge in semiconductor development.
At both events, the Czech Semiconductor Centre was represented by its Director, Karel Masařík, and Deputy Director, Jana Drbohlavová. Their participation emphasised the Centre’s commitment to fostering pan-European collaboration, engaging with strategic partners, and contributing to the collective development of robust consortia that can capitalise on the forthcoming Chips JU funding opportunities. Stanislav Černý, president of the Czech National Semiconductor Cluster, was also among important guests and participants.
During the ENCCC meeting, the Czech Semiconductor Centre presented a clear overview of its core competences, early achievements and next priorities. The Centre’s strengths lie in technical and application expertise, particularly in the areas of energy grids, automotive applications and key enablement technologies such as electron microscopy, metrology and diagnostics. As an effective navigation and enablement hub, the Centre serves as an entry point to the European Design Platform and Pilot Lines, while guiding companies and researchers through the complexity of Europe’s semiconductor infrastructure.
As a concrete success story was highlighted the National PL/DP Webinar organised by CSC in September 2025, which brought together more than 70 participants from SMEs and large enterprises, including representatives of APECS, FAMES and the European Design Platform. The event received strongly positive Mentimeter feedback, confirmed real demand for the Czech Semiconductor Centre as an effective access point, and marked the practical start of the user onboarding journey — demonstrating not just visibility, but tangible validation of CSC services.
Participation in these two events provided an invaluable platform for Czech stakeholders to elevate their visibility within Europe’s semiconductor ecosystem, exchange strategic insights, and strengthen networks that will be essential for future innovation projects and collaborative success.
Photos taken by Jana Drbohlavová and Stanislav Černý
