ISIG Executive Summit EU 2026
Prague will welcome senior representatives of the global semiconductor industry on 14–16 September 2026. The ISIG Executive Summit EU will bring together decision-makers from the semiconductor, power electronics and advanced manufacturing sectors to discuss the technologies and strategic choices shaping Europe’s industrial future.
Held under the theme “Chips, Power and Machines: Powering AI and Electrifying Industry”, the summit will connect international industry leaders, technology experts, investors and policymakers with Czechia’s rapidly developing semiconductor ecosystem.
The programme will explore some of the most important trends affecting the industry, including Europe’s future position in the global semiconductor market, the development of the European Chips Act, advanced manufacturing, artificial intelligence, robotics and the electrification of transport and industry.
From power electronics to intelligent machines
A major focus of the event will be on the technologies enabling the next generation of electric vehicles and industrial systems. Participants will examine how 800-volt architectures and power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) can improve performance, energy efficiency, charging speed and reliability.
Further sessions will address the semiconductor requirements of humanoid robots and autonomous systems, including edge intelligence, real-time decision-making, advanced sensing and energy-efficient computing.
The agenda will also cover:
- advanced processes, materials and testing for scalable SiC and GaN production;
- automation and data-driven optimisation in intelligent semiconductor fabs;
- funding opportunities for innovative and scalable semiconductor projects;
- the future of wide-bandgap semiconductor research and development;
- the impact of artificial intelligence and the emerging Chips Act 2.0 on the power, automotive and industrial sectors;
- the capabilities and future development of the Czech semiconductor industry.
International speakers and Czech expertise
The summit will feature senior representatives of leading global semiconductor companies. Confirmed speakers include Thomas Morgenstern, Executive Vice President for Manufacturing at STMicroelectronics, and Magdalena Christine Böbel, Executive Vice President for Integrated Circuits for Energy Systems and Head of the corresponding business division at Infineon Technologies.
The programme will also introduce international participants to Czechia’s semiconductor expertise, industrial capabilities and potential for deeper integration into European and global value chains.
As part of the summit, delegates will have an opportunity to visit the Hitachi Energy Semiconductors facility in Prague, providing a first-hand look at semiconductor production and expertise based in Czechia.
The event is supported by CzechInvest in cooperation with the Ministry of Foreign Affairs of the Czech Republic.
Event details
Event: ISIG Executive Summit EU 2026
Date: 14–16 September 2026
Location: Prague, Czechia
Main theme: Chips, Power and Machines: Powering AI and Electrifying Industry
Language: English
Join semiconductor executives, technology leaders, investors and policymakers in Prague and take part in the discussion about the future of chips, power electronics, artificial intelligence and advanced industrial manufacturing in Europe.
Register on the official ISIG Executive Summit EU website.
