The IEEE Solid-State Circuits Society is pleased to announce its fifth open-source integrated circuit (IC) design contest under the umbrella of its PICO (Platform for IC Design Outreach) program. While this contest is open to anyone (no restrictions), we encourage the participation of pre-college students, undergraduates, and geographical regions that are underrepresented within the IC design […]

19th Silicon Saxony Day... offers unique insight into future technologies and business solutions covering hardware, software and connectivity topics. gives you the chance to get in touch with like-minded leaders, engineers, scientists and business developers and join the hightech community. provides an innovative and international platform for sharing ideas and trends for future information and […]

CEA-Leti Innovation Days is back for a new edition! Leti Innovation Days 2025, from June 17 to 19, will offer you a front-row seat to our most recent advances. Join more than 1,100 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate! More at: https://leti-innovation-days.com/2025/lid-world/ 

Following the successful launch of the FAMES Pilot Line Open-Access, we are pleased to invite you to the first edition of the FAMES Academy. • Date: June 18, 2025 • Location: CEA-Leti Innovation Days–LID World Summit, Grenoble, France The FAMES Academy is designed to support startups, fabless companies, research institutions and industry stakeholders in making the most […]

Themed Heterogenous Integration: Bolstering Europe's Resilience the 3D & Systems Summit 2025 will primarily focus on exploring strategies for enhancing Europe's semiconductor industry addressing topics as geopolitical dynamics, market trends, as well as the latest advancements in chiplet applications and hybrid bonding techniques. The Summit will feature an exclusive exhibition area, showcasing industry leaders alongside innovative emerging […]

Applications are now open for ChipStart EU, a groundbreaking incubator programme designed to support and accelerate early-stage semiconductor startups across Europe. Powered by Silicon Catalyst EU, and backed by the Chips Joint Undertaking and Malta Enterprise, this one-year programme offers free, no-equity incubation to 10 selected startups from EU member states with active Chips JU […]

INSIDE Connect 2025 is an exclusive, members-only event organised by INSIDE Industry Association. It brings together the full spectrum of Europe’s Electronic Components and Systems (ECS) community, from researchers and innovators to strategic policymakers with the shared goal of advancing digital innovation across Europe. Hosted at the Hotel Barceló Málaga, the event offers a dedicated forum for strategic […]

The EU Business Hub, an EU-funded programme supporting the international expansion of European SMEs and start-ups, is pleased to invite companies active in the semiconductor sector to apply for two upcoming business missions to Japan and the Republic of Korea. These missions are designed to facilitate market entry, strengthen partnerships, and enhance visibility in two […]

The aim of this “Microelectronics for 6G – Front End Module” workshop is to gather detailed feedback about the needs, challenges and priorities of relevant stakeholders for a Focus Topic under consideration on the FEM extension, which is a strategic domain for 6G developments. The Focus Topic would also aim at supporting innovation in the […]

We kindly invite you to join the Pre-Brokerage for Lab to Fab Accelerator projects on Advanced Packaging on September 18, 2025 15:30 – 17:30 CEST in Grenoble, France, at the World Trade Center. The workshop will take place in conjunction with and is kindly hosted by the EMPC 2025 | The 25th European Microelectronics & […]